电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

177TW-B-21W1-S-P3SY-3F-RM53

产品描述D Subminiature Connector, 21 Contact(s), Female, Solder Terminal
产品类别连接器    连接器   
文件大小2MB,共15页
制造商Amphenol(安费诺)
官网地址http://www.amphenol.com/
下载文档 详细参数 全文预览

177TW-B-21W1-S-P3SY-3F-RM53概述

D Subminiature Connector, 21 Contact(s), Female, Solder Terminal

177TW-B-21W1-S-P3SY-3F-RM53规格参数

参数名称属性值
Objectid1720575294
Reach Compliance Codeunknown
YTEOL8.77
连接器类型D SUBMINIATURE CONNECTOR
联系完成配合GOLD (30) OVER NICKEL
联系完成终止TIN
触点性别FEMALE
DIN 符合性NO
空壳NO
滤波功能NO
IEC 符合性NO
绝缘体材料POLYETHYLENE
JESD-609代码e3
MIL 符合性NO
制造商序列号177TW
混合触点YES
安装类型BOARD AND PANEL
选件GENERAL PURPOSE
外壳面层TIN
外壳材料STEEL
外壳尺寸B
端接类型SOLDER
触点总数21

文档预览

下载PDF文档
17 TW S
ERIES
S
PECIFICATIONS
:
M
ATERIALS
Shells
Insulators
Signal Contacts
Female
Male
Plating
Coax Contacts
Female
Male
Plating
AND
Hybrid Connector
P
LATINGS
Steel with tin plating or yellow chromate
with or without grounding dimples
High temperature black thermoplastic
Machined bronze
Machined brass
16µ"(.40µm) or 30µ"(.76µm) gold
over 79µ"(1.97µm) nickel
Machined bronze
Machined brass
Inner conductor: 16µ"(.40µm) gold
or 30µ"(.76µm) gold over 79µ"(1.97µm) nickel
Outer ring: 10µ"(.25µm) gold over 79µ"(1.97µm) nickel
Tinned.
(Solder cup and crimp terminations are gold flash.)
Amphenol’s 17TW series hybrid
D-Subminiature connectors are
available with power, coax, high
voltage and signal contacts
assembled in the same connector
body. These connectors are
supplied with screw-machined
contacts which are fixed in the
insulator.
The board-mount product
offering includes straight and
right-angle terminations. The
cable connectors are available in
crimp and solder terminations.
These connectors are compatible
with the infra-red reflow
soldering process. The 17TW
series offers eighteen housing
configurations in five shell sizes.
Industrial
Telecom
Any industry standard
I / O connections
Terminations
Power Contacts
Female
Machined bronze
Male
Machined brass
Plating
Contacts: 16µ"(.40µm) gold or 30µ"(.76µm) gold
over 79µ"(1.97µm) nickel
Terminations
Tinned.
(Solder cup and crimp terminations are gold flash.)
Brackets
Steel with tin plating
Front Jackscrews Brass with tin plating or yellow chromate
Rear Clinch Nuts
Brass with tin plating or yellow chromate
Boardlocks:
Bronze with tin plating
Stand-offs
Brass with tin plating
E
LECTRICAL
D
ATA
Current Rating:
Signal Contacts
7.5 amps with 10 amp peaks
Power Contacts: PCB, Solder-Cup, Crimp 10 to 40 amps
0.5 amps
Current Rating:
Signal & Power Contacts 300 VRMS at 50 Hz
Coax Contacts
150 VRMS at 50 Hz
Coax Contacts
Frequency range:
0 -1 GHz
Attenuation:
0.2 dB
V.S.W.R.:
1.4 (+0.04/GHz)
Characteristic Impedance
50 Ohms
Dielectric Withstanding Voltage
1000V R.M.S. at 50Hz
Insulation Resistance
5000 megaohms at 500 V D.C.
Contact Resistance
≤5
milliohms
Shell Resistance (electrical grounding)
≤1
milliohm
C
LIMATIC
D
ATA
Shell Resistance (electrical grounding)
≤1
milliohm
Operating Temperature
67°F (-55°C) to 311°F (+155°C)
with peaks up to 356°F (180°C)
Damp Heat
56 days 104°F (40°C) at 95% RH
Salt Spray
48 hours
M
ECHANICAL
D
ATA
Contact Retention Force in Dielectric Material
>40 N
Maximum Mating and Unmating Force
with dimples
A size: 80 N B size: 100 N C size: 150 N
D size: 180 N E size: 70 N
without dimples
A size: 50 N B size: 80 N C size: 120 N
D size: 160 N E size: 30 N
Process Compatibility
IR - air convection: 500°F (260°C) for 20 seconds
Soldering iron: 500°F (260°C) for 30 seconds
Mating Cycles
200 (16µ"(.41µm) gold)
500 (30µ"(.76µm) gold)
Blind Mating System Available upon request
Polarization
Available with locking accessories, consult factory
Derating Curves for Power Contacts:
see page 51
Pull-out Force for Crimped Contacts:
see page 51
Approvals:
UL - File number: E 64911 / CSA - File number: LR 57744
Shell Dimensions:
See page 64
T
ELEPHONE
: (416) 754-5656
F
AX
: (416) 754-8668 E-M
AIL
:
SALES
@
AMPHENOLCANADA
.
COM
37
为什么我的proteus7.5 元件库没有单片机
为什么我的proteus7.5 元件库没有单片机 并不缺少文件...
cdxcdx 单片机
这是怎么回事啊,为什么老是有错,求高手指点
160694160694160694160694...
my_style FPGA/CPLD
MSP430 LanuchPad IDE环境搭建
MSP430 LanuchPad IDE环境搭建 由于公司项目需要使用了TI的MSP430F149芯片,于是开始认真搞起MSP430了,突然想到了手上还有几年前论坛获得的MSP430 LanuchPad,一直没有使用过 ......
wateras1 微控制器 MCU
EEWORLD DIY——《晒奖品》
有幸参加了论坛的DIY活动并获得了奖品-示波器。 管理员为了示波器的安全,发的顺丰空运,第二天一早就收到了。废话不多说,上图。341578 图1 341579 图2 341580 图3 示波器包装得 ......
jj1989 DIY/开源硬件专区
某香港医药集团公司招聘嵌入式软件开发工程师(上海)
工作职责: 负责公司新产品开发与试制工作。单片机及嵌入式产品的开发设计工作。 应聘人员要求: 1)电子、自动化、计算机等相关专业,本科或以上学历。 2)2年以上相关工作经验,具有 ......
alert4 嵌入式系统
单芯片的一致多处理(图)
随着SoC设计元件的出现,如MIPS32 1004K一致处理系统(CPS),单操作系统条件下的片上对称多处理(SMP)已经成为了一种真正的设计选择,而系统架构师也需要了解其优点和局限性。 任务越多,越 ......
咖啡不加糖 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1258  846  1940  2580  386  17  16  44  22  1 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved