电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N6626D3B.L1DM

产品描述1.75A, 200V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3 VARIANT B, 2 PIN
产品类别分立半导体    二极管   
文件大小276KB,共4页
制造商SEMELAB
下载文档 详细参数 全文预览

1N6626D3B.L1DM概述

1.75A, 200V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3 VARIANT B, 2 PIN

1N6626D3B.L1DM规格参数

参数名称属性值
包装说明R-CDSO-N2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性HIGH RELIABILITY
应用ULTRA FAST RECOVERY POWER
配置SINGLE
二极管元件材料SILICON
二极管类型RECTIFIER DIODE
JESD-30 代码R-CDSO-N2
JESD-609代码e4
最大非重复峰值正向电流75 A
元件数量1
相数1
端子数量2
最高工作温度175 °C
最低工作温度-65 °C
最大输出电流1.75 A
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式SMALL OUTLINE
认证状态Not Qualified
最大重复峰值反向电压200 V
最大反向恢复时间0.03 µs
表面贴装YES
端子面层GOLD
端子形式NO LEAD
端子位置DUAL
Base Number Matches1

文档预览

下载PDF文档
ULTRA FAST RECOVERY
POWER RECTIFIER
1N6626D3A / 1N6626D3B
High Reliability Screening Options Available
High forward current surge current capability
Switching power supplies or other applications requiring
fast switching and low forward loss
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VRWM
1
IO
IFSM
2
TJ
Tstg
TSP
Working Peak Reverse Voltage
Average Rectified Forward Current TA = 25°C
Peak Forward Current Surge
Junction Temperature Range
Storage Temperature Range
Maximum Soldering Pad Temperature for 20s
200V
1.75A
75A
-65 to +175°C
-65 to +175°C
260°C
THERMAL PROPERTIES
Symbols
R
θJSP(IN)
R
θJA(PCB)
(3)
R
θJA(PCB)
(4)
Parameters
Thermal Resistance, Junction To Solder Pads TSP = 25°C
Thermal Resistance, Junction To Ambient, On PCB
Thermal Resistance, Junction To Ambient, On PCB
Max.
40
72.5
110
Units
°C/W
°C/W
°C/W
Notes
(1) IO1 is rated at 1.75A @ TA = 25°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R
θJA(PCB)
85°C/W.
(2) TA = 25°C @ IO=0A and VRWM = 0V for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.5A @ TA = 25°C for PC boards where R
θJA(PCB)
111°C/W. Derate at 10mA/°C above TA = 25°C in this case.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5A device.
Semelab ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 8975
Issue 2
Page 1 of 4

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1865  1871  2662  1657  2646  15  50  49  33  51 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved