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1N5811D3B.GBDM

产品描述3A, 150V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3 VARIANT B, 2 PIN
产品类别分立半导体    二极管   
文件大小291KB,共4页
制造商SEMELAB
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1N5811D3B.GBDM概述

3A, 150V, SILICON, RECTIFIER DIODE, HERMETIC SEALED, CERAMIC, DLCC3 VARIANT B, 2 PIN

1N5811D3B.GBDM规格参数

参数名称属性值
包装说明R-CDSO-N2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性HIGH RELIABILITY
应用ULTRA FAST RECOVERY POWER
配置SINGLE
二极管元件材料SILICON
二极管类型RECTIFIER DIODE
JESD-30 代码R-CDSO-N2
最大非重复峰值正向电流125 A
元件数量1
相数1
端子数量2
最大输出电流3 A
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式SMALL OUTLINE
认证状态Not Qualified
最大重复峰值反向电压150 V
最大反向恢复时间0.05 µs
表面贴装YES
端子形式NO LEAD
端子位置DUAL
Base Number Matches1

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ULTRA FAST RECOVERY
POWER RECTIFIER
1N5811D3A / 1N5811D3B
DLCC3 - Light Weight Hermetic Ceramic Surface Mount
Package is designed as a drop In replacement for “D-5B” / “E-
MELF” package
Ultra Fast Reverse Recovery
Switching Power Supply Applications
Space Level and High-Reliability Screening Options Available
ABSOLUTE MAXIMUM RATINGS
(TA = 25°C unless otherwise stated)
VBR
VRWM
IO
IFSM
TJ
Tstg
Breakdown Voltage
Working Peak Reverse Voltage
Maximum Rectified Current Io
1
= TA +55°C
(1)
Derate above TA 55°C
Surge Current, tp = 8.3ms
(2)
Junction Temperature Range
Storage Temperature Range
160V
150V
3.0A
25mA/°C
125A
-65 to +175°C
-65 to +175°C
THERMAL PROPERTIES
Symbols
R
θJSP(IN)
R
θJA(PCB)
(3)
R
θJA(PCB)
(4)
Parameters
Thermal Resistance, Junction To Solder Pads TSP = 25°C
Thermal Resistance, Junction To Ambient, On PCB
Thermal Resistance, Junction To Ambient, On PCB
Max.
17
50
117
Units
°C/W
°C/W
°C/W
Notes
(1) IO1 is rated at 3.0A @ TA = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where
TJ(Max) does not exceed 175°C; This equates to R
θJA(PCB)
52°C/W.
(2) TA = 25°C @ IO=3.0A and VRWM for ten 8.3mS surges at 1 minute intervals.
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.
IO1 is rated at 1.5A @ TA = 55°C for PC boards where R
θJA(PCB)
120°C/W. Derate at 12.5mA/°C above TA = 55°C in this case.
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5B device.
Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab plc
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
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