DIODE LEADLESS
CHIP CARRIER
DLCC1
•
Light Weight Hermetic Ceramic Surface Mount
Package is designed as a drop In replacement for
“MELF-4.5 (D-5D)”/ ”DO-213AA” Packages
•
Designed For High Reliability Military, Aerospace
and Space Applications
ABSOLUTE
ABSOLUTE MAXIMUM RATINGS
(Tamb = 25°C unless otherwise stated)
VRMS
VDC
I
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum DC Output Current
>700V
>1000V
1.0A
PACKAGE MASS
63Sn/37Pb Solder Tin Dipped typically <40mg
Comparisons with similar DO-213AA packages shows no increase in weight:
1N750AUR-1 = 40mg
1N4620UR-1 = 40mg
MECHANICAL DATA
A
C
DLCC1 Variant A (D1A)
SML
DLCC1
D
E
D
B
PAD 1
PAD 2
DIMENSION
A
B
C
D
E
F
ANODE
CATHODE
mm
4.60 ±0.20
2.00 ±0.20
1.30 ±0.20
0.70 ±0.20
3.00 ±0.20
1.80 ±0.20
Inches
0.181 ±0.007
0.079 ±0.007
0.051 ±0.007
0.028 ±0.007
0.118 ±0.007
0.071 ±0.007
2
1
F
Semelab Ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab Ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 8844
Issue 1
Page 1 of 3
DIODE LEADLESS CHIP CARRIER
DLCC1
DLCC1 PCB SOLDER PAD LAYOUT GUIDE
The DLCC1 package is designed to align conveniently with the industry standard pad layouts (See Below) for the
“MELF-4.5 (D 5D)” and DO-213AA packages.
The design allows easy substitution of the DLCC1 package into existing board designs providing easy surface mount
process integration, excellent cost and availability benefits over MELF packages.
Soldering temperature should be 260°C for a maximum of 10 seconds.
The DLCC1 pad castellations allows solder flow up the sides of the package enabling visual inspection of the
successful solder joint.
A
C
B
DO-213AA
SOLDER PADS
DIMENSION
A
B
C
mm
5.08
1.40
2.03
Inches
0.200
0.055
0.080
MELF-4.5 (D-5D)
SOLDER PADS
DIMENSION
A
B
C
mm
6.45
1.70
2.41
Inches
0.254
0.067
0.095
Image Showing the DLCC1 on the
recommended DO-213AA
solder pad foot print
and DO-213AA package overlay.
Semelab Ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Image Showing the DLCC1 on the
recommended MELF-4.5 (D-5D)
solder pad foot print
and MELF-4.5 (D-5D) package overlay.
Document Number 8844
Issue 1
Page 2 of 3
DIODE LEADLESS
CHIP CARRIER
SCREENING OPTIONS
Space Level (JQRS/ESA) and High Reliability options are
available in accordance with the
High Reliability and
Screening Options Handbook
available for download from
the from the TT electronics Semelab web site.
ESA Quality Level Products are based on the testing
procedures specified in the generic ESCC 5000 and in the
corresponding part detail specifications.
Semelab’s QR216 and QR217 processing specifications
(JQRS), in conjunction with the companies ISO 9001:2000
approval present a viable alternative to the American MIL-
PRF-19500 space level processing.
QR217 (Space Level Quality Conformance) is based on the
quality conformance inspection requirements of MIL-PRF-
19500 groups A (table V), B (table VIa), C (table VII) and
also ESA / ESCC 5000 (chart F4) lot validation tests.
QR216 (Space Level Screening) is based on the screening
requirements of MIL-PRF-19500 (table IV) and also ESA
/ESCC 5000 (chart F3).
JQRS parts are processed to the device data sheet and
screened to QR216 with conformance testing to Q217
groups A and B in accordance with MIL-STD-750 methods
and procedures.
Additional conformance options are available, for example
Pre-Cap Visual Inspection, Buy-Off Visit or Data Packs.
These are chargeable and must be specified at the order
stage (See Ordering Information). Minimum order
quantities may apply.
Alternative or additional customer specific conformance or
screening requirements would be considered. Contact
Semelab sales with enquires.
ORDERING INFORMATION
Part numbers are built up from Type, Package Variant, and
screening level. The part numbers are extended to include
the additional options as shown below.
Type – See Electrical Stability Characteristics Table
Package Variant – See Mechanical Data
Screening Level – See Screening Options (ESA / JQRS)
Additional Options:
Customer Pre-Cap Visual Inspection
Customer Buy-Off visit
Data Pack
Solderability Samples
Scanning Electron Microscopy
Radiography (X-ray)
Total Dose Radiation Test
MIL-PRF-19500 (QR217)
Group B charge
Group B destructive mechanical samples
Group C charge
Group C destructive electrical samples
Group C destructive mechanical samples
ESA/ESCC
Lot Validation Testing (subgroup 1) charge
LVT1 destructive samples (environmental)
LVT1 destructive samples (mechanical)
Lot Validation Testing (subgroup 2) charge
LVT2 endurance samples (electrical)
Lot Validation Testing (subgroup 3) charge
LVT3 destructive samples (mechanical)
.CVP
.CVB
.DA
.SS
.SEM
.XRAY
.RAD
.GRPB
.GBDM (12 pieces)
.GRPC
.GCDE (12 pieces)
.GCDM (6 pieces)
.LVT1
.L1DE (15 pieces)
.L1DM (15 pieces)
.LVT2
.L2D (15 pieces)
.LVT3
.L3D (5 pieces)
Additional Option Notes:
1) All ‘Additional Options’ are chargeable and must be specified at order stage.
2) When Group B,C or LVT is required, additional electrical and mechanical destructive
samples must be ordered
3) All destructive samples are marked the same as other production parts unless
otherwise requested.
MARKING DETAILS
Parts can be laser marked with approximately 7 characters
on two lines and always includes cathode identification.
Typical marking would include part or specification number,
week of seal or serial number subject to available space and
legibility.
Customer specific marking requirements can be arranged at
the time of order.
Example Marking:
Example ordering information:
The following example is for the 1N6642 part with package
variant A, JQRS screening, additional Group C conformance
testing and a Data pack.
Part Numbers:
1N6642D1A-JQRS
(Include quantity for flight parts)
1N6642D1A-JQRS.GRPC
(chargeable conformance option)
1N6642D1A-JQRS.GCDE
(charge for destructive parts)
1N6642D1A-JQRS.GCDM
(charge for destructive parts)
1N6642D1A-JQRS.DA
(charge for Data pack)
Customers with any specific requirements (e.g. marking or
screening) may be supplied with a similar alternative part
number (there is maximum 20 character limit to part
numbers). Contact Semelab sales with enquiries
High Reliability and Screening Options Handbook link:
http://www.semelab.co.uk/pdf/misc/documents/hirel_and_screening_options.pdf
Semelab Ltd reserves the right to change test conditions, parameter limits and package dimensions without notice.
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to
verify that datasheets are current before placing an order.
Semelab Ltd
Telephone +44 (0) 1455 556565
Email:
sales@semelab-tt.com
Coventry Road, Lutterworth, Leicestershire, LE17 4JB
Fax +44 (0) 1455 552612
Website:
http://www.semelab-tt.com
Document Number 8844
Issue 1
Page 3 of 3
PCB设计
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
