电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MMA0204100R470GLF7

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.47ohm, 400V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小378KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

MMA0204100R470GLF7概述

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 0.47ohm, 400V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT

MMA0204100R470GLF7规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明MELF, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
构造Cylindrical
JESD-609代码e1
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装直径1.45 mm
封装长度3.25 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法TR, 7 INCH
额定功率耗散 (P)0.5 W
额定温度80 °C
电阻0.47 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形状WRAPAROUND
容差2%
工作电压400 V
Base Number Matches1

文档预览

下载PDF文档
al Glaze
Glaze™ General Purpose
General Purpose
Metal
face
Surface Mount Power Resistor
Mount Power Resistor
es
Metal Glaze
General Purpose
·
Up to 2 watts
Mount Power Resistor
Surface
MM Series
MM Series
watts
00 volts
·
·
·
Up to 1000 volts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
to 2.2 megohm
2
range
Up to watts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Up to 1000 volts
aximum operating temperature
60/40 Solder
temperature
dielectric
over nickel barrier
coating
60/40 Solder
over nickel barrier
High
High
temperature
dielectric
coating
ical Data
Electrical Data
Industry
Footprint
Maximum
Resistance
Maximum
Resistance
IRC
Working
Size
Industry
Power
IRC
Working
Range
Power
Range
Type
Voltage
Code Footprint
Type
Voltage
(ohms)²
Rating
Rating
(ohms)²
MMA0204
F
B
1206
MMA0204
Tolerance
(+%)³
(+%)³
1, 2, 5
1, 2, 5
Tolerance
1, 2, 5
5
0.5
5
TCR
Product
(ppm/°C)³
(ppm/°C)³
Category
100
50, 100
50, 100
100
50, 100
50, 100
100
50, 100
TCR
100
Product
Category
1206
1/2
1/2
400
400
0.1 to 0.99
0.1 to 0.99
Low Range
Standard
1.0
20 to 348K
to 1.0M
0.1 to 0.99
20 to 348K
1.0 to 1.0M
Low Range
Standard
1, 2,
0.25, 0.5
1, 2, 5
0.25,
1, 2, 5
0.25, 0.5
1, 2, 5
50, 100
Tolerance
Tight
100
Standard
Low
50, 100
Range
Tight Toleran
Tight Tolerance
2512
MMB0207
1
700
0.1 to 0.99
1.0 to 2.21M
20 to 348K
1, 2, 5
Low Range
Standard
2512
MMB0207
H
3610
MMC0310
1
2
700
1000
1.0 to 2.21M
0.1 to 0.99
20
1.0 to 2.21M
to 348K
0.1 to 0.99
1.0 to 2.21M
1,
1, 2, 5
2,
50, 100
Range
Low
100
50, 100
¹Not to exceed
P x R
0.25, 0.5
1, 2, 5
1, 2, 5
50, 100
Standard
Tight Toleran
Standard
²Consult factory for tighter TCR, tolerance, or resistance values.
3610
MMC0310
2
1000
Low Range
ceed
P x R
Environmental Data
Temperature Coefficient
Thermal Shock
²Consult
ri
factory for tighter
i
TCR, tolerance, or resistance values.
ethod
Characte stics
Max mum Change
Test M
As specified
±0.5% +0.01
±0.25% +0.01
±1% for R>100K
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
onmental Data
Low Temperature Operation
Characte
Short
cs
Overload
risti
Time
Maxim
±0.5%
Change
um
+0.01
Test Method
ture Coefficient
As
High Temperature Exposure
specified
+0.01
±0.5%
Resistance to Bonding Exposure
+0.01
+0.01
±0.5%
±0.25%
Solderability
Moisture Resistance
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow
(-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.3
soldered to board at 260°C for 10 seconds)
Shock
perature Operation
Life Test
±0.25% +0.01
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
±0.5% +0.01
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
me Overload
mperature Exposure
Terminal Adhesion Strength
±0.5% +0.01
+0.01
±0.5%
±1% for R>100K
±1% +0.01
±0.5% +0.01
no mechanical damage
±0.5% +0.01
MIL-R-55342E Par 4.7.5
hours @ 70°C intermittent)
MIL-R-55342E Par 4.7.10 (2000
2.5 x
P x
push from underside of mounted chip for
1200 gram
R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Chip mounted in center of 90mm long board, deflected 5mm
60 seconds
ce to Bonding Exposure
General Note
General Note
Resistance to Board Bending
no mechanical damage
MIL-R-55342E Par 4.7.7
(Reflow
10 seconds
board at 260°C for 10 seconds
so as to exert pull on chip contacts for
soldered to
±0.25% +0.01
ility
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Facsimile:
Website: www.irctt.com
rpus Christi Te
r
A subsidiary of
Resistance
±0.5% +0.01
MIL-R-55342E
www.bitechnologies.com
cycles, total 240 hours)
Par 4.7.8 (10
www.irctt.com www.welwyn-tt.com
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
TT electronics plc
IRC reserves the right to make changes in product specification without notice or liability.
TT electronics reserves the right
and is considered accurate at time of going to print.
All information is subject to IRC’s own data
to make changes in product specification without notice or liability.
Wire and Film Technologies Division
Telephone:
© TT electronics plc
±0.5% +0.01
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent
09.12
我算是服了stm8硬件iic了
大致说说吧,我现在主机软件模拟iic,从机是硬件iic中断 我实现的是主机发命令给从机,从机接收到命令后吧数据发给主机, 而且主机必须让从机休眠,休眠后,必须唤醒。 但是现在通讯都无 ......
yangganglone stm32/stm8
multisum电路仿真有问题
393055 有没人呢解惑? multisim的仿真当中如何设置继电器才能实现红圈的功能? 393056 这里面的继电器都长这个样子 ...
Hckboyfriend 模拟电子
AD7705 中文1
本帖最后由 paulhyde 于 2014-9-15 09:13 编辑 AD7705 中文1 ...
da610 电子竞赛
网络版原理图==stm32核心板+w5100模块
http://www.stmsky.com/bbs/viewthread.php?tid=1446&extra=网络版原理图==stm32核心板+w5100模块可以直接联网ping192.168.1.2直接打开显示helloworld...
hconfeng stm32/stm8
TI 处理器板卡申请流程
本帖最后由 alan000345 于 2020-7-7 21:45 编辑 申请流程 487881 如何注册? 全国大学电子设计竞赛培训网新会员注册 1.登录全国大学生电子设计竞赛培训网(www.nuedc-training.com.cn) ......
alan000345 微控制器 MCU
磁盘的一直在转,而且磁道是完全对称的环形,怎么准确寻址扇区呢?
扇区的绝对地址是相对于第0个扇区来说的,可是磁盘的一直在转,而且磁道是完全对称的环形,没有任何一个扇区在物理上是特殊的,系统是怎么寻址磁盘的第0扇区的呢?...
xulei1008 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1218  1641  1982  2426  1072  30  19  15  42  43 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved