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MMB02071001172CBLK

产品描述Fixed Resistor, Metal Glaze/thick Film, 1W, 11700ohm, 700V, 0.25% +/-Tol, 100ppm/Cel, Surface Mount, 2512
产品类别无源元件    电阻器   
文件大小378KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
下载文档 详细参数 全文预览

MMB02071001172CBLK概述

Fixed Resistor, Metal Glaze/thick Film, 1W, 11700ohm, 700V, 0.25% +/-Tol, 100ppm/Cel, Surface Mount, 2512

MMB02071001172CBLK规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称TT Electronics plc
包装说明MELF, 2512
Reach Compliance Codecompliant
ECCN代码EAR99
构造Cylindrical
JESD-609代码e0
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装直径2.01 mm
封装长度6.38 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法BULK
额定功率耗散 (P)1 W
额定温度80 °C
电阻11700 Ω
电阻器类型FIXED RESISTOR
尺寸代码2512
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
端子形状WRAPAROUND
容差0.25%
工作电压700 V
Base Number Matches1

文档预览

下载PDF文档
al Glaze
Glaze™ General Purpose
General Purpose
Metal
face
Surface Mount Power Resistor
Mount Power Resistor
es
Metal Glaze
General Purpose
·
Up to 2 watts
Mount Power Resistor
Surface
MM Series
MM Series
watts
00 volts
·
·
·
Up to 1000 volts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
Metal Glaze™ thick
film element fired
at 1000°C to solid
ceramic substrate
to 2.2 megohm
2
range
Up to watts
0.1 ohm to 2.2 megohm range
150°C maximum operating temperature
Up to 1000 volts
aximum operating temperature
60/40 Solder
temperature
dielectric
over nickel barrier
coating
60/40 Solder
over nickel barrier
High
High
temperature
dielectric
coating
ical Data
Electrical Data
Industry
Footprint
Maximum
Resistance
Maximum
Resistance
IRC
Working
Size
Industry
Power
IRC
Working
Range
Power
Range
Type
Voltage
Code Footprint
Type
Voltage
(ohms)²
Rating
Rating
(ohms)²
MMA0204
F
B
1206
MMA0204
Tolerance
(+%)³
(+%)³
1, 2, 5
1, 2, 5
Tolerance
1, 2, 5
5
0.5
5
TCR
Product
(ppm/°C)³
(ppm/°C)³
Category
100
50, 100
50, 100
100
50, 100
50, 100
100
50, 100
TCR
100
Product
Category
1206
1/2
1/2
400
400
0.1 to 0.99
0.1 to 0.99
Low Range
Standard
1.0
20 to 348K
to 1.0M
0.1 to 0.99
20 to 348K
1.0 to 1.0M
Low Range
Standard
1, 2,
0.25, 0.5
1, 2, 5
0.25,
1, 2, 5
0.25, 0.5
1, 2, 5
50, 100
Tolerance
Tight
100
Standard
Low
50, 100
Range
Tight Toleran
Tight Tolerance
2512
MMB0207
1
700
0.1 to 0.99
1.0 to 2.21M
20 to 348K
1, 2, 5
Low Range
Standard
2512
MMB0207
H
3610
MMC0310
1
2
700
1000
1.0 to 2.21M
0.1 to 0.99
20
1.0 to 2.21M
to 348K
0.1 to 0.99
1.0 to 2.21M
1,
1, 2, 5
2,
50, 100
Range
Low
100
50, 100
¹Not to exceed
P x R
0.25, 0.5
1, 2, 5
1, 2, 5
50, 100
Standard
Tight Toleran
Standard
²Consult factory for tighter TCR, tolerance, or resistance values.
3610
MMC0310
2
1000
Low Range
ceed
P x R
Environmental Data
Temperature Coefficient
Thermal Shock
²Consult
ri
factory for tighter
i
TCR, tolerance, or resistance values.
ethod
Characte stics
Max mum Change
Test M
As specified
±0.5% +0.01
±0.25% +0.01
±1% for R>100K
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
onmental Data
Low Temperature Operation
Characte
Short
cs
Overload
risti
Time
Maxim
±0.5%
Change
um
+0.01
Test Method
ture Coefficient
As
High Temperature Exposure
specified
+0.01
±0.5%
Resistance to Bonding Exposure
+0.01
+0.01
±0.5%
±0.25%
Solderability
Moisture Resistance
MIL-R-55342E Par 4.7.9 (-55°C +125°C)
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow
(-65°C +150°C, 5 cycles)
MIL-R-55342E Par 4.7.3
soldered to board at 260°C for 10 seconds)
Shock
perature Operation
Life Test
±0.25% +0.01
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
±0.5% +0.01
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
me Overload
mperature Exposure
Terminal Adhesion Strength
±0.5% +0.01
+0.01
±0.5%
±1% for R>100K
±1% +0.01
±0.5% +0.01
no mechanical damage
±0.5% +0.01
MIL-R-55342E Par 4.7.5
hours @ 70°C intermittent)
MIL-R-55342E Par 4.7.10 (2000
2.5 x
P x
push from underside of mounted chip for
1200 gram
R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
Chip mounted in center of 90mm long board, deflected 5mm
60 seconds
ce to Bonding Exposure
General Note
General Note
Resistance to Board Bending
no mechanical damage
MIL-R-55342E Par 4.7.7
(Reflow
10 seconds
board at 260°C for 10 seconds
so as to exert pull on chip contacts for
soldered to
±0.25% +0.01
ility
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
Facsimile:
Website: www.irctt.com
rpus Christi Te
r
A subsidiary of
Resistance
±0.5% +0.01
MIL-R-55342E
www.bitechnologies.com
cycles, total 240 hours)
Par 4.7.8 (10
www.irctt.com www.welwyn-tt.com
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
TT electronics plc
IRC reserves the right to make changes in product specification without notice or liability.
TT electronics reserves the right
and is considered accurate at time of going to print.
All information is subject to IRC’s own data
to make changes in product specification without notice or liability.
Wire and Film Technologies Division
Telephone:
© TT electronics plc
±0.5% +0.01
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent
09.12
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