Ⅰ.
SCOPE：
This specification applies to the Pb Free high current type SMD inductors for
MSI-100705-SERIES
PRODUCT INDENTIFICATION
MSI-100705-R12 M
①
②
③ ④
①
Product Code
②
Dimensions Code
③
Inductance Code
④
Tolerance Code
(1) SHAPES AND DIMENSIONS
A: 10.2 Max.
B: 7.0
Max.
C: 4.96 Max.
D: 1.52 Typ.
E: 2.49 Typ.
mm
mm
mm
mm
mm
(2) ELECTRICAL SPECIFICATIONS
SEE TABLE 1
TEST INSTRUMENTS
L : HP 4284A PRECISION LCR METER (or equivalent)
RDC : CHROMA MODEL 16502 MILLIOHMMETER (or equivalent)
IDC1 : CH3302/G LCR METER
CH1320,CH1320S BIAS CURRENT SOURCE(or equivalent)
(3) CHARACTERISTICS
(3)-1 Ambient temperature
…….........
＋60℃
Max.
(3)-2 Operate temperature range ......
－40℃½＋125℃
(Including self temp. rise)
(3)-3 Storage temperature range ......
－40℃½＋125℃
MAG.LAYERS
MSI-100705-SERIES
Page 1/8
TABLE
MAGLAYERS
PT/NO.
MSI-100705-85N□
MSI-100705-R10□
MSI-100705-R12□
MSI-100705-R155□
MSI-100705-R22□
Inductance
L(μH)
0.085
0.100
0.120
0.155
0.220
Percent
Tolerance
M,N
M
M
M
M
Test
Frequency
100kHz/0.1V
100kHz/0.1V
100kHz/0.1V
100kHz/0.1V
100kHz/0.1V
Resistance
RDC(mΩ)
0.39±7.7%
0.39±7.7%
0.39±7.7%
0.39±7.7%
0.39±7.7%
Rated DC Current
IDC1(A)
＞70
70
52
40
33
IDC2(A)
31
31
31
31
25
85N
R10
R12
R155
R22
Marking
※ □
specify the inductance tolerance,M(±20%),N(±30%)
※
IDC1： Based on inductance change (△L/Lo： drop 20% Typ.)@ ambient temp. 25℃
IDC2： Based on temperature rise (△T： 40℃ TYP.)
Rated DC Current： The less value which is IDC1 or IDC2 .
RDC TEST POINT
The nominal DCR is measured from point
〝a〞to
point〝b〞.
a
b
MAG.LAYERS
MSI-100705-SERIES
Page-2/8
(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM
Substrate bending
SPECIFICATION
△L/Lo≦±5%
TEST DETAILS
The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
There shall be
no mechanical
damage or elec-
trical damege.
direction is made approximately 3mm.(keep time 30 seconds)
PCB dimension shall the page 7/9
F(Pressurization)
PRESSURE ROD
figure-1
Vibration
△L/Lo≦±5%
The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
There shall be
no mechanical
damage.
and a frequency of from 10 to 55Hz/1 minute repeated should
be applied to the 3 directions (X,Y,Z) for 2 hours each.
(A total of 6 hours)
Solderability
New solder
More than 90%
Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature of
130½150℃ and after it has been immersed to a depth 0.5mm
below for 3±0.2 seconds fully in molten solder M705 with
a temperature of 245±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
MAG.LAYERS
MSI-100705-SERIES
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MECHANICAL
TEST ITEM
Resistance to
Soldering heat
(reflow soldering)
There shall be
no damage or
Sodering temperature (℃)
SPECIFICATION
Temperature profile of reflow soldering
problems.
300
250
200
150
100
50
soldering
(Peak temperature 260±3℃ 10 sec
30 sec Min
Pre-heating
(230
+0
℃)
150 ~ 180℃
Slow cooling
(Stored at room
temperature)
2 min
10
sec.
2 min. or more
The specimen shall be passed through the reflow oven with the
condition shown in the above profile for 1 time.
The specimen shall be stored at standard atmospheric conditions
for 1 hour, after which the measurement shall be made.
ELECTRICAL
TEST ITEM
Temperature
characteristics
SPECIFICATION
△L/L20℃≦±10%
0½2000 ppm/℃
TEST DETAILS
The test shall be performed after the sample has stabilized in
an ambient temperature of -20 to +85℃,and the value
calculated based on the value applicable in a normal
temperature and narmal humidity shall be
△L/L20℃≦±10%.
M AG .L AY E R S
MSI-100705-SERIES
Page-4/8
ENVIROMENT CHARACTERISTICS
TEST ITEM
High temperature
storage
There shall be
no mechanical
damage.
△L/Lo≦±5%
SPECIFICATION
The sample shall be left for 96±4 hours in an atmospere with
a temperature of 85±2℃ and a normal humidity.
Upon completion of the measurement shall be made after the
sample has been left in a normal temperature and normal
humidity for 1 hour.
Low temperature
storage
△L/Lo≦±5%
The sample shall be left for 96±4 hours in an atmosphere with
a temperature of -25±3℃.
There shall be
no mechanical
damage.
Change of
temperature
There shall be
no other dama-
ge of problems
△L/Lo≦±5%
Upon completion of the test, the measurement shall be made
after the sample has been left in a normal temperature and
normal humidity for 1 hour.
The sample shall be subject to 5 continuos cycles, such as shown
in the table 2 below and then it shall be subjected to standard
stmospheric conditions for 1 hour, after which measurement
shall be made.
table 2
Temperature
1
－25±3℃
(Themostat No.1)
2
Standard
No.1→No.2
atmospheric
3
85±2℃
(Themostat No.2)
4
Standard
No.2→No.1
atmospheric
Moisture storage
△L/Lo≦±5%
The sample shall be left for 96±4 hours in a temperature of
40±2℃ and a humidity(RH) of 90½95%.
There shall be
no mechanical
damage.
Test conditions：
The sample shall be reflow soldered onto the printed circuit board in every test.
Upon completion of the test, the measurement shall be made
after the sample has been left in a normal temperature and
normal humidity more than 1 hour.
30 min.
Duration
30 min.
MAG.LAYERS
MSI-100705-SERIES
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