tal Glaze™ Cylindrical
Metal Glaze™ Cylindrical
cial
Official Size Power Resistor
Size
wer Resistor
Cylindrical
Metal Glaze™
CHP1X Series
Series
Official Size
·
0.1 ohm to 10K ohm
·
Outstanding surge capacity
Power Resistor
to 10K ohm
in a 1/2W package (2010 footprint)
·
1W
ding surge capacity
·
150°C maximum operating temperature
1/2W package (2010 footprint)
0.1 ohm to 10K ohm
1W in a 1/2W package (2010 footprint)
150°C maximum operating temperature
Metal Glaze
™
thick film
element fired at 1000°C to
solid ceramic substrate
High Purity ceramic
core for optimal
thermal
distribution
Metal Glaze
™
thick film
element fired at 1000°C to
solid ceramic substrate
CHP1X Series
maximum operating temperature
Outstanding surge capacity
High Purity ceramic
core for optimal
thermal
distribution
High temperature
dielectric coating
60/40 Solder over
High temperature
dielectric coating
nickel barrier
60/40 Solder over
nickel barrier
2
2
Environmental Data
Characteristics
Maximum Change
As specified
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
Temperature Coefficient
onmental Data
Characteristics
Shock
Thermal
Maximum Change
±0.5% + 0.01 ohm
±0.25% + 0.01
As specified
ohm
Test Method
Low Temperature Operation
ure Coefficient
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
MIL-R-55342E Par 4.7.4 (-65°C @
(-55°C
voltage)
MIL-R-55342E Par 4.7.9
working
+ 125°C)
MIL-R-55342E Par 4.7.5
2.5 x
√
P x R for 5 seconds
Shock
±0.5% + 0.01 ohm
±0.5% + 0.01 ohm
±1% for R>100K ohm
±0.5% + 0.01 ohm
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
voltage)
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
perature Operation
±0.25% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-R-55342E Par 4.7.4 (-65°C
board at
MIL-R-55342E Par 4.7.7 (Reflow soldered to
@ working
260°C for 10 seconds)
MIL-R-55342E Par
(245°C
MIL-STD-202, Method 208
4.7.5
for 5 seconds)
2.5 x
√
P x R for 5 seconds
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
Solderability
me Overload
Moisture Resistance
Life Test
±0.5% + 0.01 ohm
95% minimum coverage
±1% for R>100K ohm
±0.5% + 0.01 ohm
perature Exposure
±0.5% + 0.01 ohm
±0.3% + 0.01 ohm
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
to board at
ce to Bonding Exposure
Strength
Terminal Adhesion
Resistance to Board Bending
±1% + 0.01 ohm
±0.25% + 0.01 ohm
no mechanical damage
MIL-R-55342E
underside of mounted chip for
1200 gram push from
Par 4.7.7 (Reflow soldered
60 seconds
10 seconds)
260°C for
ility
95%
±1% + 0.01 ohm
no mechanical damage
minimum coverage
Chip mounted in center of 90mm long board, deflected
5mm so as to exert pull on chip contacts for 10 seconds
seconds)
MIL-STD-202, Method 208 (245°C for 5
Resistance
±0.5% + 0.01 ohm
±0.3% + 0.01 ohm
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
General Note
General Note
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermitt
A subsidiary
±1% + 0.01 ohm
1200 gram push from underside of mounted
of
chip for
All information subject to TT electronics’
TT electronics plc
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
Adhesion
Wire and Film
is
Technologies Division
own data and is considered accurate at time of going to print.
Strength
rpus Christi Te
no mechanical damage
60 seconds
r
Telephone:
Facsimile:
Website: www.irctt.com
IRC reserves the right to make changes in product specification without notice or liability.
TT electronics reserves the right
and is considered accurate at time of going to print.
All information is subject to IRC’s own data
to make changes in product specification without notice or liability.
© TT electronics plc
ce to Board Bending
±1% + 0.01 ohm
01.12
Chip mounted in center of 90mm long board, deflected
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