电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1501822FBLKLF

产品描述RESISTOR, METAL GLAZE/THICK FILM, 1 W, 1 %, 50 ppm, 18200 ohm, SURFACE MOUNT, 2512, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小382KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

CHP1501822FBLKLF概述

RESISTOR, METAL GLAZE/THICK FILM, 1 W, 1 %, 50 ppm, 18200 ohm, SURFACE MOUNT, 2512, ROHS COMPLIANT

CHP1501822FBLKLF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明, 2512
Reach Compliance Codecompliant
JESD-609代码e1
制造商序列号CHP
安装特点SURFACE MOUNT
最高工作温度150 °C
封装形状CYLINDRICAL PACKAGE
包装方法BULK
额定功率耗散 (P)1 W
额定温度70 °C
电阻18200 Ω
电阻器类型FIXED RESISTOR
尺寸代码2512
表面贴装YES
技术METAL GLAZE/THICK FILM
端子面层TIN SILVER COPPER
端子形状WRAPAROUND
容差1%
工作电压350 V
Base Number Matches1

文档预览

下载PDF文档
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
STM32破解有多难?
最近有客户找我们开发一个仪表,我们想用STM32F103做。客户怀疑芯片的解密问题,他说问了深圳的公司,那边告诉他只要2万元、5天时间就可以了。客户一直在问这个问题,真的有点难受。ST最好 ......
yunanxiang stm32/stm8
招聘工程师和实习生
公司简介: 苏州吉视电子科技有限公司位于历史悠久的苏州常熟,是一家专业从事机器视觉系统以及相关设备、组件研发和生产的高科技公司。2013年公司获得常熟市政府领军型创新创业人才计划资助。 ......
机器视觉GFocus 综合技术交流
USB转串口通讯功能求助
我正在使用STM32F10XB_EVAL开发板调试USB例程VirtualCOMPort,USB转串口功能,将接收到的数据发送回去。枚举过程OK的,但到了通讯部分就不行了,用通讯工具发送数据,却接不到回复。 用调 ......
wolfliu_67 stm32/stm8
无线数传模块资料
详细规格: 1 视距可靠传输距离可达800m; 采用GFSK的调制方式; 2 载频 433 MHz,ISM频段,无需申请频点; 3 提供8个信道,如果用户需要,可扩展至32信道; 4 接口速率:1200/2400 ......
jek9528 工业自动化与控制
单片机系统在测控领域的稳定性探讨
近年来单片机系统在工业测控领域的应用越来越广泛,而对于环境恶劣的工业现场,这种新型的微控制器的可靠性,安全性就成为了一个大的问题。在实验室运行正常的程序到了工业现场却不能运行,或 ......
rain 单片机
如何设置SPI1和写中断处理程序,最好不使用库
有谁可以提供个中断主方式的SPI1程序让我参考一下最好不使用库,搞了几天了还是只能够设置完了后进一次中断,//===================================================================////== ......
q91391 stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 915  2396  2056  95  2404  26  5  8  47  24 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved