Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PQFP44,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QFP, QFP44,.5SQ,32 |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| CPU系列 | 8051 |
| JESD-30 代码 | S-PQFP-G44 |
| JESD-609代码 | e0 |
| 端子数量 | 44 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP44,.5SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 256 |
| ROM（单词） | 16384 |
| ROM可编程性 | FLASH |
| 速度 | 33 MHz |
| 最大压摆率 | 49.7 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| P89C54UFBB | C320C475K3N5TA | C32225X5R1H225MT | C3225CH2A153JT | P89C58UBPN | P89C51UFBB | P89C51UFPN | P89C58UFBB | P89C58UFPN | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PQFP44, | GoldMax 300 Comm X8L HT150C, Ceramic, 4.7 uF, 10%, 25 VDC, X8L, GoldMax, Commercial Standard, Lead Spacing = 2.54mm | RF LDMOS Integrated Power Amplifier | RF Power LDMOS Transistors | Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PQFP44, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PDIP40, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PQFP44, | Microcontroller, 8-Bit, FLASH, 8051 CPU, 33MHz, CMOS, PDIP40, |
| 是否Rohs认证 | 不符合 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFP, QFP44,.5SQ,32 | - | - | - | DIP, DIP40,.6 | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 | QFP, QFP44,.5SQ,32 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | - | - | - | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | - | - | - | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 8051 | - | - | - | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 代码 | S-PQFP-G44 | - | - | - | R-PDIP-T40 | S-PQFP-G44 | R-PDIP-T40 | S-PQFP-G44 | R-PDIP-T40 |
| JESD-609代码 | e0 | - | - | - | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 44 | - | - | - | 40 | 44 | 40 | 44 | 40 |
| 最高工作温度 | 85 °C | - | - | - | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | - | - | - | DIP | QFP | DIP | QFP | DIP |
| 封装等效代码 | QFP44,.5SQ,32 | - | - | - | DIP40,.6 | QFP44,.5SQ,32 | DIP40,.6 | QFP44,.5SQ,32 | DIP40,.6 |
| 封装形状 | SQUARE | - | - | - | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | - | - | - | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| 电源 | 5 V | - | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 256 | - | - | - | 256 | 128 | 128 | 256 | 256 |
| ROM（单词） | 16384 | - | - | - | 32768 | 4096 | 4096 | 32768 | 32768 |
| ROM可编程性 | FLASH | - | - | - | FLASH | FLASH | FLASH | FLASH | FLASH |
| 速度 | 33 MHz | - | - | - | 33 MHz | 33 MHz | 33 MHz | 33 MHz | 33 MHz |
| 最大压摆率 | 49.7 mA | - | - | - | 49.7 mA | 49.7 mA | 49.7 mA | 49.7 mA | 49.7 mA |
| 标称供电电压 | 5 V | - | - | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | - | - | NO | YES | NO | YES | NO |
| 技术 | CMOS | - | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | - | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | - | - | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.8 mm | - | - | - | 2.54 mm | 0.8 mm | 2.54 mm | 0.8 mm | 2.54 mm |
| 端子位置 | QUAD | - | - | - | DUAL | QUAD | DUAL | QUAD | DUAL |
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