ECL to TTL Translator, ECL100K, CQFP24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QFF, QFL24,.4SQ |
| Reach Compliance Code | unknown |
| 接口集成电路类型 | ECL TO TTL TRANSLATOR |
| JESD-30 代码 | S-XQFP-F24 |
| JESD-609代码 | e0 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | QFF |
| 封装等效代码 | QFL24,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 5,-4.5 V |
| 表面贴装 | YES |
| 技术 | ECL100K |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 100125YB | 100125Y | 100125F-B | 100125F | 100125A | 100125AA | 100125AF | |
|---|---|---|---|---|---|---|---|
| 描述 | ECL to TTL Translator, ECL100K, CQFP24 | ECL to TTL Translator, ECL100K, CQFP24 | ECL to TTL Translator, ECL100K, CDIP24 | ECL to TTL Translator, ECL100K, CDIP24 | ECL to TTL Translator, ECL100K, PQCC28 | ECL to TTL Translator, ECL100K, PQCC28 | ECL to TTL Translator, ECL100K, CDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QFF, QFL24,.4SQ | QFF, QFL24,.4SQ | DIP, DIP24,.4 | DIP, DIP24,.4 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | DIP, DIP24,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 接口集成电路类型 | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR |
| JESD-30 代码 | S-XQFP-F24 | S-XQFP-F24 | R-XDIP-T24 | R-XDIP-T24 | S-PQCC-J28 | S-PQCC-J28 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 24 | 24 | 24 | 24 | 28 | 28 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| 封装代码 | QFF | QFF | DIP | DIP | QCCJ | QCCJ | DIP |
| 封装等效代码 | QFL24,.4SQ | QFL24,.4SQ | DIP24,.4 | DIP24,.4 | LDCC28,.5SQ | LDCC28,.5SQ | DIP24,.4 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 电源 | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V |
| 表面贴装 | YES | YES | NO | NO | YES | YES | NO |
| 技术 | ECL100K | ECL100K | ECL100K | ECL100K | ECL100K | ECL100K | ECL100K |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 厂商名称 | - | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
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