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MRC1100R330G13LF

产品描述Fixed Resistor, Metal Glaze/thick Film, 1W, 0.33ohm, 350V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 2010, MELF, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小142KB,共2页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
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MRC1100R330G13LF概述

Fixed Resistor, Metal Glaze/thick Film, 1W, 0.33ohm, 350V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 2010, MELF, ROHS COMPLIANT

MRC1100R330G13LF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明MELF, 2010
Reach Compliance Codecompliant
Is SamacsysN
构造Cylindrical
JESD-609代码e3
制造商序列号MRC
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装直径2.67 mm
封装长度6.38 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法TR, 13 INCH
额定功率耗散 (P)1 W
额定温度70 °C
电阻0.33 Ω
电阻器类型FIXED RESISTOR
系列MRC
尺寸代码2010
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状WRAPAROUND
容差2%
工作电压350 V
Base Number Matches1

文档预览

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MRC Series
Metal Glaze High Power Density
Surface Mount Power Resistor
1/2 watt in 1/8 watt package
1 watt in 1/2 watt package (2010 footprint)
MRC1/2: 0.05
Ω
to 1.0
Ω
(contact factory for higher values)
150°C maximum operating temperature
Superior surge handling capability
Metal Glaze
thick film
element fired at 1000°C to
solid ceramic substrate
TM
High temperature
dielectric coating
60/40 Solder over nickel barrier
Environmental Data
Size
Industry
Code
1
Footprint
IRC
Type
Max.
Working
Power Rating Voltage
2
Max.
Resistance
TCR
Tolerance
Voltage Range (ohms)
3
(ppm/°C)
3
(±%)
3
0.1 to 0.99
C
1206
MRC1/2
1/2W @ 70°C
200
400
1.0 to 10K
20 to 10K
0.05 to 0.099
E
2010
MRC1
1W @ 70°C
350
700
0.10 to 1.0
1,2,5
100
Low Range
1,2,5
1,2,5
0.25, 0.5
2,5
100
50,100
50,100
200
Product
Catagory
Low Range
Standard
Tight Tolerance
Low Range
MRC Applications:
The MRC1/2 will dissipate 1/2 watt at 70°C on a 1206 footprint, while the MRC 1 will dissipate 1 watt at 70°C on a
2010 footprint. The MRC is recommended for applications where board real estate is a major concern. Due to high
power density and superior surge handling capability, it is also recommended as a direct replacement on existing
board designs where standard 1206 and 2010 resistors are marginal or failing.
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Maximum Change
As specified
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
±(1.0% + 0.01Ω)
±(0.5% + 0.01Ω)
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
PxR for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip
for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
Resistance to Bonding Exposure
±(0.25% + 0.01Ω)
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
95% minimum coverage
±(0.5% + 0.01Ω)
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
±(1% + 0.01Ω)
no mechanical damage
© IRC Wirewound and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
MRC Series Issue April 2010 Sheet 1 of 2
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