Arithmetic Logic Unit, 10K Series, 2-Bit, ECL, CDIP16, CERDIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | CAPABLE OF 4 LOGIC & ARITHMETIC OPERATIONS; HIGHER ORDER LOOKAHEAD |
| 系列 | 10K |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.495 mm |
| 逻辑集成电路类型 | ARITHMETIC LOGIC UNIT |
| 位数 | 2 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 最大电源电流（ICC） | 152 mA |
| 传播延迟（tpd） | 14 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 10582/BEAJC | 10582/BFAJC | 10582M/B2AJC | |
|---|---|---|---|
| 描述 | Arithmetic Logic Unit, 10K Series, 2-Bit, ECL, CDIP16, CERDIP-16 | Arithmetic Logic Unit, 10K Series, 2-Bit, ECL, CDFP16, CERAMIC, FP-16 | Arithmetic Logic Unit, 10K Series, 2-Bit, ECL, CQCC20, CERAMIC, LCC-20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown |
| Is Samacsys | N | N | N |
| 其他特性 | CAPABLE OF 4 LOGIC & ARITHMETIC OPERATIONS; HIGHER ORDER LOOKAHEAD | CAPABLE OF 4 LOGIC & ARITHMETIC OPERATIONS; HIGHER ORDER LOOKAHEAD | CAPABLE OF 4 LOGIC & ARITHMETIC OPERATIONS; HIGHER ORDER LOOKAHEAD |
| 系列 | 10K | 10K | 10K |
| JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 |
| 长度 | 19.495 mm | 9.65 mm | 8.885 mm |
| 逻辑集成电路类型 | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT | ARITHMETIC LOGIC UNIT |
| 位数 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | QCCN |
| 封装等效代码 | DIP16,.3 | FL16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER |
| 最大电源电流（ICC） | 152 mA | 152 mA | 152 mA |
| 传播延迟（tpd） | 14 ns | 14 ns | 14 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 座面最大高度 | 5.08 mm | 2.15 mm | 1.9 mm |
| 表面贴装 | NO | YES | YES |
| 技术 | ECL | ECL | ECL |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 6.415 mm | 8.885 mm |
| Base Number Matches | 1 | 1 | 1 |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
