电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1/2502492F7LF

产品描述RESISTOR, METAL GLAZE/THICK FILM, 0.5 W, 1 %, 50 ppm, 24900 ohm, SURFACE MOUNT, 2010, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小382KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

CHP1/2502492F7LF概述

RESISTOR, METAL GLAZE/THICK FILM, 0.5 W, 1 %, 50 ppm, 24900 ohm, SURFACE MOUNT, 2010, ROHS COMPLIANT

CHP1/2502492F7LF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明, 2010
Reach Compliance Codecompliant
Is SamacsysN
JESD-609代码e1
制造商序列号CHP
安装特点SURFACE MOUNT
最高工作温度150 °C
封装形状CYLINDRICAL PACKAGE
包装方法TR, 7 INCH
额定功率耗散 (P)0.5 W
额定温度70 °C
电阻24900 Ω
电阻器类型FIXED RESISTOR
尺寸代码2010
表面贴装YES
技术METAL GLAZE/THICK FILM
端子面层TIN SILVER COPPER
端子形状WRAPAROUND
容差1%
工作电压300 V
Base Number Matches1

文档预览

下载PDF文档
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
MSP430寄存器手册
MSP430寄存器手册 ...
xiawanpin 微控制器 MCU
关于ESP8266串口数据读取不完整的问题
如图,自己写的串口程序,首先是显示UDP连接成功,但是查询连接状态的时候得到的返回的数据不完整,求助大神啊:Cry: ...
三不沾 无线连接
pic槽延长到机外且能热插拔
大家好!我这需要一种产品可以将电脑pci槽延长到机箱外面并且能热插拔上面的板卡。诸位谁有这样的产品或者可以做?...
tansuo123 PCB设计
硬盘有驱动程序吗? 大致是一个什么原理? 为什么操作系统对硬盘分区,写,读操作?
硬盘有驱动程序吗? 大致是一个什么原理? 为什么操作系统对硬盘分区,写,读操作?...
daigang057 嵌入式系统
请问:wince中如何在线拷贝文件到flash?
我们都知道可以通修改配置文件的方法将文件和操作系统镜像一起下载到NAND flash中,但有时候在应用程序中肯定会需要在线拷贝文件到flash中,我只能实现将文件拷贝到SDRAM,下次开机就没有了。是不 ......
wo1301 嵌入式系统
我只愿面朝大海,春暖花开
今天下午和父亲在家乡的小江里用电瓶打了下鱼,本来是想去弄几只鳖的,想不到别说鳖了就连大一点的鱼也没弄到,而且水也没以前小时候的那么清了,唉。七八年时间不常在家,想不到家乡的环境也变 ......
wateras1 聊聊、笑笑、闹闹

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 408  215  2330  1520  2190  31  9  18  3  6 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved