MB05F
thru
M B10F
Miniature Glass Passivated Single-Phase Surface Mount Flat Bridge Rectifier
VOLTAGE - 50 TO 1000 VOLTS
CURRENT - 0.5 AMPERES
Major Ratings and Characteristics
I
F(AV)
0.5A , 0.8A
V
RRM
50-1000V
I
FSM
35 A
I
R
5.0
μA
V
F
1.0V
T
j
max.
150
°C
FEATURES
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Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
MECHANICAL DATA
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Case: MBF Molded plastic
over glass passivated chip
Terminals: Solder plated, solderable per
J-STD-002B and JESD22-B102D
Polarity: Polarity symbols marked on body
MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS
(T
A
= 25
°C
unless otherwise noted)
Symbol MB05F MB1F MB2F MB4F MB6F MB8F MB10F UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward output rectified
current at T
A
=30℃
-on glass-epoxy P.C.B
(NOTE 1)
-on aluminum substrate
(NOTE 2)
Peak forward surge current 8.3 ms single half sine-wave
superimposed on rated load(JEDEC Method)
Maximum instantaneous forwad voltage drop
per leg at 0.4A
Maximum DC reverse current at T
A
= 25
℃
rated DC blocking voltage per leg T
A
= 125℃
Typical junction capacitance per leg at 4.0 V ,1MHz
(NOTE 1)
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
C
J
R
θJA
R
θJA
R
θJL
50
35
50
100 200 400 600 800 1000
70
140 280 420 560
700
100 200 400 600 800 1000
0.5
0.8
35
1
5.0
100
13
85
70
20
V
V
V
A
A
V
μA
pF
℃/
W
℃
Thermal resistance per leg
(NOTE 2)
(NOTE 1)
T
J
, T
STG
–55
to +150
Operating junction and storage temperature range
NOTE1
:On glass epoxy P.C.B. mounted on 0.05×0.05″(1.3×1.3mm) pads
NOTE2
:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20×20mm) mounted
on 0.05×0.05″(1.3×1.3mm) solder pad
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