电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1/8-502461DBLKLF

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2460ohm, 200V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小382KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

CHP1/8-502461DBLKLF概述

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 2460ohm, 200V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT

CHP1/8-502461DBLKLF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
JESD-609代码e1
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装形状CYLINDRICAL PACKAGE
包装方法BULK
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻2460 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数50 ppm/°C
端子面层Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
端子形状WRAPAROUND
容差0.5%
工作电压200 V
Base Number Matches1

文档预览

下载PDF文档
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
急需一块FPGA的摄像头采集板子
急需一块FPGA的板子,功能不需要多强大,只要有带SDRAM,带VGA,剩余引脚引出,可以插OV7670摄像头模块就成。当然,如果有做过用FPGA驱动OV7670,VGA显示的,希望能提供下成功的案例。...
夏小五 淘e淘
MSP430无聊灌水贴。。
以前都是在论坛各种不登陆潜水,呃,突然看到了团购活动,深感出来转一圈是必要的。。。 现在还正在学51单片机神马的,各种时序图看的晕头转向,然后带我的学长说买一个430可能以后要调,于是 ......
yclong001 微控制器 MCU
香主,关注一下SPIDMA方式的问题
香主你好:我做SPIDMA接收的试验,使用ST的例程。操作没有问题。可是不能实现循环接收,例程是发送一次,而后查询标志,就结束了。如何实现不断查询标志的接收啊,也就是接收循环起来!! ......
kpbearmo stm32/stm8
STM32的FLASH当做掉电数据保存器问题!
我看到STM32的FLASH可以用指令擦出和读, 这样能不能替代我外部的AT45DB 的FLASH芯片呢? 用作存储掉电保护的数据。。 不知道这样用有什么缺点! 请大家指教...
初五的月光 stm32/stm8
从pt100精度而言,实现0--200度误差0.5度能否实现?
从pt100精度而言,实现0--200度误差0.5度能否实现?...
copytang 嵌入式系统
高IP3微波低噪声放大器的仿真
本文使用Ansoft公司微波电路CAD软件Serenade,设计了智能天线实验系统接收端的高IP3低噪声放大器(LNA),设计采用西门子硅锗晶体管Site BFP520文中着重对提高电路的线性度和稳定性、降低噪声系数 ......
JasonYoo 模拟电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2766  2590  514  2334  1951  3  32  16  4  2 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved