72-Mbit QDR II SRAM 2-Word
Burst Architecture
Features
■
CY7C1510KV18, CY7C1525KV18
CY7C1512KV18, CY7C1514KV18
®
Configurations
CY7C1510KV18 – 8M x 8
CY7C1525KV18 – 8M x 9
CY7C1512KV18 – 4M x 18
CY7C1514KV18 – 2M x 36
Separate independent read and write data ports
❐
Supports concurrent transactions
350 MHz clock for high bandwidth
Two-word burst on all accesses
Double data rate (DDR) interfaces on both read and write ports
(data transferred at 700 MHz) at 350 MHz
Two input clocks (K and K) for precise DDR timing
❐
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR
®
II operates with 1.5 cycle read latency when DOFF is
asserted HIGH
Operates similar to QDR I device with 1 cycle read latency when
DOFF is asserted LOW
Available in x8, x9, x18, and x36 configurations
Full data coherency, providing most current data
Core V
DD
= 1.8 V (±0.1 V); I/O V
DDQ
= 1.4V to V
DD
❐
Supports both 1.5 V and 1.8 V I/O supply
Available in 165-ball fine pitch ball grid array (FBGA) package
(13 x 15 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Phase Locked Loop (PLL) for Accurate Data Placement
■
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Functional Description
The CY7C1510KV18, CY7C1525KV18, CY7C1512KV18, and
CY7C1514KV18 are 1.8 V synchronous pipelined SRAMs,
equipped with QDR II architecture. QDR II architecture consists
of two separate ports: the read port and the write port to access
the memory array. The read port has dedicated data outputs to
support read operations and the write port has dedicated data
inputs to support write operations. QDR II architecture has
separate data inputs and data outputs to completely eliminate
the need to “turnaround” the data bus that exists with common
I/O devices. Access to each port is through a common address
bus. Addresses for read and write addresses are latched on
alternate rising edges of the input (K) clock. Accesses to the
QDR II read and write ports are completely independent of one
another. To maximize data throughput, both read and write ports
are equipped with DDR interfaces. Each address location is
associated with two 8-bit words (CY7C1510KV18), 9-bit words
(CY7C1525KV18), 18-bit words (CY7C1512KV18), or 36-bit
words (CY7C1514KV18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus turnarounds.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
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Table 1. Selection Guide
Description
Maximum operating frequency
Maximum operating current
x8
x9
x18
x36
350 MHz
350
825
825
840
1030
333 MHz
333
790
790
810
990
300 MHz
300
730
730
750
910
250 MHz
250
640
640
650
790
200 MHz
200
540
540
550
660
167 MHz
167
480
480
490
580
Unit
MHz
mA
Cypress Semiconductor Corporation
Document Number: 001-00436 Rev. *M
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised April 10, 2011
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CY7C1510KV18, CY7C1525KV18
CY7C1512KV18, CY7C1514KV18
Logic Block Diagram (CY7C1510KV18)
D
[7:0]
8
Read Add. Decode
Write Add. Decode
A
(21:0)
22
Write
Reg
Address
Register
Write
Reg
Address
Register
22
A
(21:0)
4M x 8 Array
4M x 8 Array
K
K
CLK
Gen.
Control
Logic
RPS
C
C
CQ
DOFF
Read Data Reg.
16
V
REF
WPS
NWS
[1:0]
8
Control
Logic
8
Reg.
Reg.
Reg. 8
8
8
CQ
Q
[7:0]
Logic Block Diagram (CY7C1525KV18)
D
[8:0]
9
Read Add. Decode
Write Add. Decode
A
(21:0)
22
Write
Reg
Address
Register
Write
Reg
Address
Register
22
A
(21:0)
4M x 9 Array
4M x 9 Array
K
K
CLK
Gen.
Control
Logic
RPS
C
C
CQ
DOFF
Read Data Reg.
18
V
REF
WPS
BWS
[0]
9
Control
Logic
9
Reg.
Reg.
Reg. 9
9
9
CQ
Q
[8:0]
Document Number: 001-00436 Rev. *M
Page 2 of 33
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CY7C1510KV18, CY7C1525KV18
CY7C1512KV18, CY7C1514KV18
Logic Block Diagram (CY7C1512KV18)
D
[17:0]
18
Read Add. Decode
Write Add. Decode
A
(20:0)
21
Write
Reg
Address
Register
Write
Reg
Address
Register
21
A
(20:0)
2M x 18 Array
2M x 18 Array
K
K
CLK
Gen.
Control
Logic
RPS
C
C
CQ
DOFF
Read Data Reg.
36
V
REF
WPS
BWS
[1:0]
18
Control
Logic
18
Reg.
Reg.
Reg. 18
18
18
CQ
Q
[17:0]
Logic Block Diagram (CY7C1514KV18)
D
[35:0]
36
Read Add. Decode
Write Add. Decode
A
(19:0)
20
Write
Reg
Address
Register
Write
Reg
Address
Register
20
A
(19:0)
1M x 36 Array
1M x 36 Array
K
K
CLK
Gen.
Control
Logic
RPS
C
C
CQ
DOFF
Read Data Reg.
72
V
REF
WPS
BWS
[3:0]
36
Control
Logic
36
Reg.
Reg.
Reg. 36
36
36
CQ
Q
[35:0]
Document Number: 001-00436 Rev. *M
Page 3 of 33
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CY7C1510KV18, CY7C1525KV18
CY7C1512KV18, CY7C1514KV18
Contents
Pin Configuration ............................................................ 5
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout ................. 5
Pin Definitions ................................................................. 7
Functional Overview ....................................................... 9
Read Operations ........................................................ 9
Write Operations ........................................................ 9
Byte Write Operations ................................................ 9
Single Clock Mode ..................................................... 9
Concurrent Transactions ............................................ 9
Depth Expansion ........................................................ 9
Programmable Impedance ....................................... 10
Echo Clocks ............................................................. 10
PLL ........................................................................... 10
Application Example ..................................................... 10
Truth Table ..................................................................... 11
Write Cycle Descriptions .............................................. 11
Write Cycle Descriptions .............................................. 12
Write Cycle Descriptions .............................................. 12
IEEE 1149.1 Serial Boundary Scan (JTAG) ................. 13
Disabling the JTAG Feature ..................................... 13
Test Access Port—Test Clock.................................. 13
Test Mode Select (TMS) .......................................... 13
Test Data-In (TDI) .................................................... 13
Test Data-Out (TDO)................................................ 13
Performing a TAP Reset .......................................... 13
TAP Registers .......................................................... 13
Instruction Register.......................................................... 13
Bypass Register .............................................................. 13
Boundary Scan Register.................................................. 13
Identification (ID) Register ............................................... 13
TAP Instruction Set .................................................. 13
IDCODE........................................................................... 14
SAMPLE Z ....................................................................... 14
SAMPLE/PRELOAD........................................................ 14
BYPASS .......................................................................... 14
EXTEST .......................................................................... 14
EXTEST OUTPUT BUS TRISTATE ................................. 14
Reserved ...........................................................................14
TAP Controller State Diagram .......................................15
TAP Controller Block Diagram ......................................16
TAP Electrical Characteristics ......................................16
TAP AC Switching Characteristics ...............................17
TAP Timing and Test Conditions ..................................17
Identification Register Definitions ................................18
Scan Register Sizes .......................................................18
Instruction Codes ...........................................................18
Boundary Scan Order ....................................................19
Power Up Sequence in QDR II SRAM ...........................20
Power Up Sequence ................................................. 20
PLL Constraints......................................................... 20
Maximum Ratings ...........................................................21
Operating Range ............................................................21
Neutron Soft Error Immunity .........................................21
Electrical Characteristics ..............................................21
DC Electrical Characteristics..................................... 21
AC Electrical Characteristics..................................... 23
Capacitance ....................................................................24
Thermal Resistance .......................................................24
Switching Characteristics .............................................25
Switching Waveforms ....................................................27
Ordering Information .....................................................28
Ordering Code Definitions......................................... 29
Package Diagram ...........................................................30
Acronyms ........................................................................31
Document Conventions .................................................31
Units of Measure ....................................................... 31
Document History Page .................................................32
Sales, Solutions, and Legal Information ......................33
Worldwide Sales and Design Support....................... 33
Products .................................................................... 33
PSoC Solutions ......................................................... 33
Document Number: 001-00436 Rev. *M
Page 4 of 33
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CY7C1510KV18, CY7C1525KV18
CY7C1512KV18, CY7C1514KV18
Pin Configuration
The pin configurations for CY7C1510KV18, CY7C1525KV18, CY7C1512KV18, and CY7C1514KV18 follow.
[1]
165-Ball FBGA (13 x 15 x 1.4 mm) Pinout
CY7C1510KV18 (8M x 8)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
DOFF
NC
NC
NC
NC
NC
NC
TDO
2
A
NC
NC
D4
NC
NC
D5
V
REF
NC
NC
Q6
NC
D7
NC
TCK
3
A
NC
NC
NC
Q4
NC
Q5
V
DDQ
NC
NC
D6
NC
NC
Q7
A
4
WPS
A
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
A
A
5
NWS
1
NC/288M
A
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
A
A
A
6
K
K
A
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
A
C
C
7
NC/144M
NWS
0
A
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
A
A
A
8
RPS
A
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
A
A
9
A
NC
NC
NC
NC
NC
NC
V
DDQ
NC
NC
NC
NC
NC
NC
A
10
A
NC
NC
NC
D2
NC
NC
V
REF
Q1
NC
NC
NC
NC
NC
TMS
11
CQ
Q3
D3
NC
Q2
NC
NC
ZQ
D1
NC
Q0
D0
NC
NC
TDI
CY7C1525KV18 (8M x 9)
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
CQ
NC
NC
NC
NC
NC
NC
DOFF
NC
NC
NC
NC
NC
NC
TDO
2
A
NC
NC
D5
NC
NC
D6
V
REF
NC
NC
Q7
NC
D8
NC
TCK
3
A
NC
NC
NC
Q5
NC
Q6
V
DDQ
NC
NC
D7
NC
NC
Q8
A
4
WPS
A
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
A
A
5
NC
NC/288M
A
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
A
A
A
6
K
K
A
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
A
C
C
7
NC/144M
BWS
0
A
V
SS
V
SS
V
DD
V
DD
V
DD
V
DD
V
DD
V
SS
V
SS
A
A
A
8
RPS
A
V
SS
V
SS
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
DDQ
V
SS
V
SS
A
A
9
A
NC
NC
NC
NC
NC
NC
V
DDQ
NC
NC
NC
NC
NC
NC
A
10
A
NC
NC
NC
D3
NC
NC
V
REF
Q2
NC
NC
NC
NC
D0
TMS
11
CQ
Q4
D4
NC
Q3
NC
NC
ZQ
D2
NC
Q1
D1
NC
Q0
TDI
Note
1. NC/144M and NC/288M are not connected to the die and can be tied to any voltage level.
Document Number: 001-00436 Rev. *M
Page 5 of 33
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