CY62138FV30 MoBL
®
2-Mbit (256 K × 8) Static RAM
2-Mbit (256 K × 8) Static RAM
Features
■
■
Functional Description
The CY62138FV30 is a high performance CMOS static RAM
organized as 256K words by 8 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life™ (MoBL
) in portable
applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
consumption. Place the device into standby mode reducing
power consumption when deselected (CE
1
HIGH or CE
2
LOW).
To write to the device, take Chip Enable (CE
1
LOW and CE
2
HIGH) and Write Enable (WE) inputs LOW. Data on the eight I/O
pins (I/O
0
through I/O
7
) is then written into the location specified
on the address pins (A
0
through A
17
).
To read from the device, take Chip Enable (CE
1
LOW and CE
2
HIGH) and Output Enable (OE) LOW while forcing Write Enable
(WE) HIGH. Under these conditions, the contents of the memory
location specified by the address pins appear on the I/O pins.
The eight input and output pins (I/O
0
through I/O
7
) are placed in
a high impedance state when the device is deselected (CE
1
HIGH or CE
2
LOW), the outputs are disabled (OE HIGH), or
during a write operation (CE
1
LOW and CE
2
HIGH and WE
LOW).
Very high-speed: 45 ns
Temperature ranges
❐
Industrial: –40 °C to 85 °C
❐
Automotive-A: –40 °C to 85 °C
Wide voltage range: 2.20 V to 3.60 V
Pin compatible with CY62138CV25/30/33
Ultra low standby power
❐
Typical standby current: 1
A
❐
Maximum standby current: 5
A
Ultra low active power
❐
Typical active current: 1.6 mA at f = 1 MHz
Easy memory expansion with CE
1
, CE
2
, and OE Features
Automatic power down when deselected
Complementary metal oxide semiconductor (CMOS) for
Optimum speed and power
Offered in Pb-free 36-ball VFBGA, 32-pin TSOP II, 32-pin
SOIC, 32-pin TSOP I and 32-pin STSOP packages
■
■
■
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■
■
Logic Block Diagram
Cypress Semiconductor Corporation
Document #: 001-08029 Rev. *K
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised June 16, 2011
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CY62138FV30 MoBL
®
Contents
Pin Configuration ............................................................. 3
Product Portfolio .............................................................. 3
Maximum Ratings ............................................................. 4
Operating Range ............................................................... 4
Electrical Characteristics ................................................. 4
Capacitance ...................................................................... 5
Thermal Resistance .......................................................... 5
AC Test Loads and Waveforms ....................................... 5
Data Retention Characteristics ....................................... 6
Data Retention Waveform ................................................ 6
Switching Characteristics ................................................ 7
Switching Waveforms ...................................................... 8
Truth Table ........................................................................ 9
Ordering Information ...................................................... 10
Ordering Code Definitions ......................................... 10
Package Diagrams .......................................................... 11
Acronyms ........................................................................ 16
Document Conventions ................................................. 16
Units of Measure ....................................................... 16
Document History Page ................................................. 17
Sales, Solutions, and Legal Information ...................... 18
Worldwide Sales and Design Support ....................... 18
Products .................................................................... 18
PSoC Solutions ......................................................... 18
Document #: 001-08029 Rev. *K
Page 2 of 18
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CY62138FV30 MoBL
®
Pin Configuration
Figure 1. 36-ball VFBGA (Top View)
[1]
1
A
0
I/O
4
I/O
5
V
SS
V
CC
I/O
6
I/O
7
A
9
OE
A
10
NC
CE
1
A
11
A
17
A
16
A
12
A
15
A
13
2
A
1
A
2
3
CE
2
WE
NC
4
A
3
A
4
A
5
5
A
6
A
7
6
A
8
I/O
0
I/O
1
V
CC
V
SS
I/O
2
I/O
3
A
14
A
B
C
D
E
F
G
H
A
17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
I/O
0
I/O
1
I/O
2
V
SS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Figure 2. 32-pin SOIC/TSOP II (Top View)
V
CC
A
15
CE
2
WE
A
13
A
8
A
9
A
11
OE
A
10
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
Figure 3. 32-pin TSOP I (Top View)
Figure 4. 32-pin STSOP (Top View)
A
11
A
9
A
8
A
13
WE
CE
2
A
15
V
CC
A
17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
TSOP I
Top View
(not to scale)
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A
10
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
GND
I/O
2
I/O
1
I/O
0
A
0
A
1
A
2
A
3
A
11
A
9
A
8
A
13
WE
CE
2
A
15
V
CC
A
17
A
16
A
14
A
12
A
7
A
6
A
5
A
4
25
26
27
26
28
29
30
31
32
1
2
3
4
5
6
7
8
STSOP
Top View
(not to scale)
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
OE
A
10
CE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
3
GND
I/O
2
I/O
1
I/O
0
A
0
A
1
A
2
A
3
Product Portfolio
Power Dissipation
Product
Range
V
CC
Range (V)
Min
CY62138FV30LL
Industrial /
Automotive-A
2.2
Typ
[2]
3.0
Max
3.6
45
Speed
(ns)
Operating I
CC
(mA)
f = 1 MHz
Typ
[2]
1.6
Max
2.5
f = f
max
Typ
[2]
13
Max
18
Standby I
SB2
(A)
Typ
[2]
1
Max
5
Notes
1. NC pins are not connected on the die.
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ.)
, T
A
= 25 °C.
Document #: 001-08029 Rev. *K
Page 3 of 18
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CY62138FV30 MoBL
®
Maximum Ratings
Exceeding maximum ratings may impair the useful life of the
device. These user guidelines are not tested.
Storage temperature ................................ –65 °C to +150 °C
Ambient temperature with
power applied .......................................... –55 °C to +125 °C
Supply voltage to ground
potential .........................................................–0.3 V to 3.9 V
DC voltage applied to outputs
in High Z State
[3, 4]
........................................–0.3 V to 3.9 V
DC input voltage
[3, 4]
.....................................–0.3 V to 3.9 V
Output current into outputs (LOW) ............................. 20 mA
Static Discharge Voltage ........................................ > 2001 V
(MIL-STD-883, Method 3015)
Latch-up current .................................................... > 200 mA
Operating Range
Product
CY62138FV30LL
Range
Industrial /
Automotive-A
Ambient
Temperature
–40 °C to
+85 °C
V
CC
[5]
2.2 V to 3.6 V
Electrical Characteristics
Over the Operating Range
Parameter
V
OH
V
OL
V
IH
V
IL
Description
Output HIGH voltage
Output LOW voltage
Input HIGH voltage
Input LOW voltage
Test Conditions
I
OH
= –0.1 mA
I
OH
= –1.0 mA, V
CC
> 2.70 V
I
OL
= 0.1 mA
I
OL
= 2.1 mA, V
CC
> 2.70 V
V
CC
= 2.2 V to 2.7 V
V
CC
= 2.7 V to 3.6 V
V
CC
= 2.2 V to 2.7 V For BGA package
V
CC
= 2.7 V to 3.6 V
V
CC
= 2.2 V to 3.6 V For other packages
I
IX
I
OZ
I
CC
I
SB1[7]
Input leakage current
Output leakage current
GND < V
I
< V
CC
GND < V
O
< V
CC
, output disabled
f = 1 MHz
Automatic CE Power-down
current–CMOS inputs
V
CC
= V
CCmax
,
I
OUT
= 0 mA,
CMOS levels
1.8
2.2
–0.3
–0.3
–0.3
–1
–1
–
–
–
45 ns (Industrial / Automotive-A)
Min
2.0
2.4
–
Typ
[6]
–
–
–
–
–
–
–
–
–
–
–
13
1.6
1
Max
–
–
0.4
0.4
V
CC
+ 0.3 V
V
CC
+ 0.3 V
0.6
0.8
0.6
+1
+1
18
2.5
5
A
Unit
V
V
V
V
V
V
V
V
V
A
A
mA
V
CC
Operating supply current f = f
max
= 1/t
RC
CE
1
> V
CC
– 0.2 V or CE
2
< 0.2 V,
V
IN
> V
CC
– 0.2 V, V
IN
< 0.2 V,
f = f
max
(address and data only),
f = 0 (OE, and WE), V
CC
= 3.60 V
I
SB2 [7]
Automatic CE Power-down
current–CMOS inputs
CE
1
> V
CC
– 0.2 V or CE
2
< 0.2 V,
V
IN
> V
CC
– 0.2 V or V
IN
< 0.2 V,
f = 0, V
CC
= 3.60 V
–
1
5
A
Notes
3. V
IL(min)
=
–
2.0 V for pulse durations less than 20 ns.
4. V
IH(max)
= V
CC
+ 0.75 V for pulse durations less than 20 ns.
5. Full device AC operation assumes a 100
s
ramp time from 0 to V
CC
(min) and 200
s
wait time after V
CC
stabilization.
6. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ.)
, T
A
= 25 °C.
7. Chip enables (CE
1
and CE
2
) must be at CMOS level to meet the I
SB1
/ I
SB2
/ I
CCDR
spec. Other inputs can be left floating.
Document #: 001-08029 Rev. *K
Page 4 of 18
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CY62138FV30 MoBL
®
Capacitance
Parameter
[8]
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
Test Conditions
T
A
= 25 °C, f = 1 MHz, V
CC
= V
CC(typ.)
Max
10
10
Unit
pF
pF
Thermal Resistance
Parameter
[8]
JA
JC
Description
Test Conditions
32-pin
SOIC
44.53
24.05
36-ball
VFBGA
38.49
17.66
32-pin
TSOP II
44.16
11.97
32-pin
STSOP
59.72
15.38
32-pin
TSOP I
50.19
14.59
Unit
C/W
C/W
Thermal resistance
Still air, soldered on a 3 × 4.5
(Junction to Ambient) inch, two layer printed circuit
board
Thermal resistance
(Junction to Case)
AC Test Loads and Waveforms
Figure 5. AC Test Loads and Waveforms
V
CC
OUTPUT
R1
V
CC
30 pF
INCLUDING
JIG AND
SCOPE
R2
GND
Rise Time = 1 V/ns
10%
ALL INPUT PULSES
90%
90%
10%
Fall Time = 1 V/ns
Equivalent to:
THEVENIN
EQUIVALENT
OUTPUT
R
TH
V
Parameter
R1
R2
R
TH
V
TH
2.5 V (2.2 V to 2.7 V)
16667
15385
8000
1.20
3.0 V (2.7 V to 3.6 V)
1103
1554
645
1.75
Unit
V
Note
8. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-08029 Rev. *K
Page 5 of 18
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