INTEGRATED CIRCUITS
DATA SHEET
SAA7715H
Digital Signal Processor
Preliminary specification
File under Integrated Circuits, IC01
2001 May 07
Philips Semiconductors
Preliminary specification
Digital Signal Processor
CONTENTS
1
1.1
1.2
2
3
4
5
6
7
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.3.5
8.3.6
8.4
8.5
8.5.1
8.5.2
8.6
8.7
8.8
8.9
8.10
9
9.1
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
FEATURES
Hardware
Possible firmware
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
PLL division factors for different clock inputs
The word select PLL
The Filter Stream DAC (FSDAC)
Interpolation filter
Noise shaper
Function of pin POM
Power off plop suppression
Pin VREFDA for internal reference
Supply of the analog outputs
External control pins
Digital serial inputs/outputs and SPDIF inputs
Digital serial inputs/outputs
SPDIF inputs
I
2
C-bus interface (pins SCL and SDA)
Reset
Power-down mode
Power supply connection and EMC
Test mode connections (pins TSCAN, RTCB
and SHTCB)
I
2
C-BUS PROTOCOL
Addressing
Slave address (pin A0)
Write cycles
Read cycles
Program RAM
Data word alignment
I
2
C-bus memory map specification
I
2
C-bus memory map definition
Table definitions
10
10.1
10.1.1
10.2
10.2.1
10.3
10.3.1
10.3.2
10.3.3
10.3.4
10.3.5
10.3.6
10.3.7
10.4
10.4.1
10.4.2
10.4.3
10.4.4
11
12
13
14
15
16
17
18
18.1
18.2
18.3
18.4
18.5
19
20
21
22
SAA7715H
SOFTWARE IN ROM DESCRIPTION
Audio dynamics compressor
Theory of operation
Audio enhancer
Theory of operation
Equalizer
General description
Overview
Controls
Centre frequency
Gain
Q
Hints and tips
Stereo spatializer
Overview
Controls
Mix
Hints and tips
LIMITING VALUES
THERMAL CHARACTERISTICS
CHARACTERISTICS
I
2
S-BUS TIMING
I
2
C-BUS TIMING
APPLICATION DIAGRAM
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C COMPONENTS
2001 May 07
2
Philips Semiconductors
Preliminary specification
Digital Signal Processor
1
1.1
FEATURES
Hardware
SAA7715H
•
24-bit Philips 70 MIPS DSP core (24-bit data path and
12/24-bit coefficient path)
•
1.5 kbyte of downloadable DSP program memory
(PRAM)
•
2 kbyte of DSP program memory (PROM)
•
2.5 kbyte of re-programmable DSP data memory
(XRAM)
•
512 byte of re-programmable DSP coefficient memory
(YRAM)
•
Four stereo digital serial inputs (8 channels) with
common BCK and WS. To these inputs the I
2
S-bus
format or LSB-justified formats can be applied
•
One stereo bitstream DAC (2 channels) with 64 fold
oversampling and noise shaping
•
Selectable clock output (pin SYSCLK) for external slave
devices (512f
s
to 128f
s
)
•
Four stereo digital serial outputs (8 channels) with
selectable I
2
S-bus or LSB-justified format
•
Two SPDIF inputs combined with digital serial input
•
On-board WS_PLL generates clock for on-board DAC
and output pin SYSCLK
•
I
2
C-bus controlled (including fast mode)
•
Programmable Phase-Locked Loop (PLL) derives the
clock for the DSP from the CLK_IN input
• −40
to +85
°C
operating temperature range
•
supply voltage only 3.3 V
•
All digital inputs are tolerant for 5 V input levels
•
Power-down mode for low current consumption in
standby mode
•
Optimized pinning for applications with other Philips
DACs (such as UDA1334, UDA1355 and UDA1328).
1.2
Possible firmware
•
Incredible surround
•
Incredible mono (Imono)
•
DPL virtualiser
•
Dolby digital virtualiser (DVD post-processing)
•
Dynamic compressor
•
Spectral enhancer
•
Equalizer with peaking/shelving filters
•
DC filters
•
Bass/treble control
•
Dynamic loudness
•
Tone/noise generator
•
Graphical spectrum analyser
•
Configurable Delay Unit (DLU)
•
Sound steering/elevation for CAR applications
•
Sample Rate Conversion (SRC).
2
APPLICATIONS
•
As co-processor for a car radio DSP in a car radio
application for additional acoustic enhancements
(sound steering/sound elevation/signal processing)
•
Multichannel audio: in DVD and Home theatre
applications as post-processing device like signal
virtualisation (virtual 3D surround) and acoustic
enhancement, tone control, volume control and
equalizers
•
Multichannel decoding: Dolby Pro Logic and virtual
3D surround
•
PC/USB audio applications: stereo widening (Incredible
surround), sound steering, sound positioning and
speaker equalization.
•
Dolby®
(1)
Pro Logic decoding
•
Smoothed volume control (without zipper noise)
•
Automatic Volume Levelling (AVL)
•
Dynamic bass enhancement
•
Ultra bass
(1)
Dolby
— Available only to licensees of Dolby Laboratories
Licensing Corporation, San Francisco, CA94111, USA, from
whom licensing and application information must be obtained.
Dolby is a registered trade-mark of Dolby Laboratories
Licensing Corporation.
2001 May 07
3
Philips Semiconductors
Preliminary specification
Digital Signal Processor
3
GENERAL DESCRIPTION
SAA7715H
The SAA7715 can be configured for various audio
applications by downloading the dedicated DSP program
code into the DSP program RAM or using the ROM or a
combination of both. During the ‘Power-down mode’ the
contents of the memories and all other settings will keep
their values. The SAA7715 can be initialized using the
I
2
C-bus interface.
Several system application examples, based on this
existing SAA7715, are available for a wide range of audio
applications (e.g car radio DSP, DVD post-processing,
Dolby Pro Logic, PC/USB audio and more) which can be
used as a reference design for customers.
The SAA7715 is a cost effective and powerful high
performance 24-bit programmable DSP for a variety of
digital audio applications. This DSP device integrates a
24-bit DSP core with programmable memories (program
RAM/ROM, data and coefficient RAM), 4 digital serial
inputs, 4 digital serial outputs, 2 separate SPDIF
receivers, a stereo FSDAC, a standard Philips I
2
C-bus
interface, a phase-locked loop for the DSP clock
generation and a second phase-locked loop for system
clock generation (internal and external DAC clocks).
4
QUICK REFERENCE DATA
SYMBOL
PARAMETER
operating supply voltage
CONDITIONS
MIN.
TYP.
3.3
95
20
380
400
MAX.
3.45
−
−
−
−
UNIT
V
mA
mA
mW
µA
V
DD
I
DDD
I
DDA
P
tot
I
POWERDOWN
all pins V
DD
with respect to 3.15
pins V
SS
−
−
−
−
supply current of the digital high activity of the DSP at
part
DSPFREQ frequency
supply current of the
analog part
total power dissipation
DC supply current of the
total chip in Power-down
mode
sample frequency
total harmonic
distortion-plus-noise to
signal ratio of DAC
signal-to-noise ratio of
DAC
clock input
maximum DSP clock
zero input and output
signal
high activity of the DSP at
DSPFREQ frequency
pin POWERDOWN
enabled
at IIS_WS1, SPDIF1 or
SPDIF2 input
at 0 dB
at
−60
dB
code = 0
DIV_CLK_IN = LOW
DIV_CLK_IN = HIGH
f
s
(THD + N)/S
DAC
32
−
−
−
8.192
16.384
−
44.1
−85
−37
100
96
−
−
−
kHz
dB(A)
dB(A)
dB(A)
MHz
MHz
MHz
S/N
DAC
CLK_IN
DSPFREQ
5
11.2896 12.288
−
−
24.576
70
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
SAA7715H
QFP44
DESCRIPTION
plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10
×
10
×
1.75 mm
VERSION
SOT307-2
2001 May 07
4
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2001 May 07
5
IIS_IN3
9
6
Philips Semiconductors
Digital Signal Processor
BLOCK DIAGRAM
RESERVED1
RESERVED2
handbook, full pagewidth
RESERVED3
SPDIF2
SPDIF1
VDDA1
VDDA2
VSSA1
VSSA2
VDDI1
24
1
2
3
5
25
4
7
8
VSSI1
14
VDDE
VSSE
35
17
23
16
37
15
21
VSSI2
10
31
30
IIS_BCK1
IIS_WS1
IIS_IN1
IIS_IN4
IIS_OUT1
IIS_OUT2
IIS_OUT3
IIS_OUT4
IIS_BCK
IIS_WS
XRAM
YRAM
29
28
33
SAA7715H
IIS_IN2
6
32
DSP CORE
34
36
VOUTL
VOUTR
POM
VREFDA
÷
2
S
PRAM
PLL
DSP CLOCK
PROM
STEREO
DAC
256 fs
CLOCK
39
38
TCB
I
2
C-BUS
WS_PLL
22
CLK_IN
41
DIV_CLK_IN
44
DSP_INOUT7
43
DSP_INOUT6
42
DSP_INOUT5
40
POWERDOWN
20
SHTCB
19
RTCB
26
TSCAN
13
SDA
12
SCL
11
A0
27
SYSCLK
18
DSP_RESET
MGT826
Preliminary specification
SAA7715H
Fig.1 Block diagram.
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