Decoder/Driver, CMOS, PDSO16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I(ol) | 0.024 A |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 电源 | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 6.8 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 74AC11239D | 74AC11239N | C2220X105K5RACTU | 74ACT11239N | |
|---|---|---|---|---|
| 描述 | Decoder/Driver, CMOS, PDSO16 | Decoder/Driver, CMOS, PDIP16 | SMD Comm X7R Flex, Ceramic, 1 uF, 10%, 50 VDC, X7R, SMD, MLCC, FT-CAP, Temperature Stable, 2220 | Decoder/Driver, CMOS, PDIP16 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown | unknown | - | unknown |
| Is Samacsys | N | N | - | N |
| JESD-30 代码 | R-PDSO-G16 | R-PDIP-T16 | - | R-PDIP-T16 |
| JESD-609代码 | e0 | e0 | - | e0 |
| 负载电容(CL) | 50 pF | 50 pF | - | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - | OTHER DECODER/DRIVER |
| 最大I(ol) | 0.024 A | 0.024 A | - | 0.024 A |
| 功能数量 | 2 | 2 | - | 2 |
| 端子数量 | 16 | 16 | - | 16 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | - | DIP |
| 封装等效代码 | SOP16,.25 | DIP16,.3 | - | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | - | IN-LINE |
| 电源 | 3.3/5 V | 3.3/5 V | - | 5 V |
| Prop。Delay @ Nom-Sup | 6.8 ns | 6.8 ns | - | 8 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified |
| 表面贴装 | YES | NO | - | NO |
| 技术 | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | - | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | DUAL |
| Base Number Matches | 1 | 1 | - | 1 |
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