The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 25 July 2007.
INCH-POUND
MIL-PRF-19500/337K
25 April 2007
SUPERSEDING
MIL-PRF-19500/337J
1 November 2005
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING, TYPES 1N4153-1,
1N4153UR-1, 1N4153UB, 1N4153UBCA, 1N4153UBCC, 1N4153UBD,
1N4534, AND 1N4534UB, JAN, JANTX, JANTXV, JANHC, AND JANKC
This specification is approved for use by all Departments and Agencies
of the Department of Defense.
The requirements for acquiring the product described herein
shall consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for controlled forward voltage switching
diodes. Three levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two
levels of product assurance are provided for each unencapsulated device type.
1.2 Physical dimensions. See figures 1 (axial leads), 2 (DO-213AA), 3 (UB), 4 (die).
1.3 Maximum ratings. Unless otherwise specified T = +25°C.
A
Type
VBR VRWM IO(PCB) IFSM TSTG
R
ΘJL
R
ΘJEC
R
ΘJA(PCB)
R
ΘJSP
TA =
tp = & TJ L = .375 (UR) (2) (2) (3) (4)
(UB)
inch
(3) (4)
75°C 8.3ms
(9.53 mm)
(1) (2)
(3)
V dc V (pk)
100
75
mA
200
A (pk)
°C
2 -65 to
+175
-55 to
+200
-55 to
+175
-55 to
+200
°C/W
250
°C/W
100
325
250
100
325
120
325
120
°C/W
325
°C/W
1N4153-1
1N4153UR-1
1N4153UB, 1N4153UBCA,
1N4153UBCC, 1N4153UBD
1N4534
1N4534UR
1N4534UB
(1) For temperature-current derating curves, see figures 5 and 6.
(2) T
A
= +75°C for both axial and metal electrode leadless face diodes (MELF) (UR) on printed circuit board (PCB),
PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, in still air; pads for (UR) = .061 inch (1.55 mm) x
.105 inch (2.67 mm); pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4
mm) long, lead length L
≤
.187 inch (
≤
4.75 mm);
R
ΘJA
with a defined PCB thermal resistance condition
included, is measured at I
O
= 200 mA dc.
(3) See figures 7, 8, and 9 for thermal impedance curves.
(4) R
ΘJSP
refers to thermal resistance from junction to the solder pads of the UB package.
Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
semiconductor@dscc.dla.mil.
Since contact information can change, you may want to verify the currency of
this address information using the ASSIST Online database at
http://assist.daps.dla.mil
.
AMSC N/A
FSC 5961
MIL-PRF-19500/337K
1.4 Primary electrical characteristics at T
A
= +25°C, unless otherwise specified.
Limits
VF1
I
F
= 100
µA
dc
0.490 V dc
0.550 V dc
IR1
VR = 50 V dc
VF2
I
F
= 250
µA
dc
0.530 V dc
0.590 V dc
IR2
VR = 50 V dc
TA = 150°C
50
µA
dc
VF3
I
F
= 1 mA dc
0.590 V dc
0.670 V dc
VF4
I
F
= 2 mA dc
0.620 V dc
0.700 V dc
VF5
I
F
= 10 mA dc
0.700 V dc
0.810 V dc
VF6
I
F
= 20 mA dc
0.740 V dc
0.880 V dc
Min
Max
Limit
C
VR = 0 V dc
f = 1 MHz
2.0 pF
trr
IF = IR = 10 mA dc
RL = 100 ohms, IRR = 1.0 mA dc
4 ns
Max
50 nA dc
(1) Primary electrical characteristics for surface mount devices are equivalent to the corresponding non-surface
mount devices unless otherwise specified.
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
2
MIL-PRF-19500/337K
Types
Ltr
1N4153-1
(DO-35)
1N4534
(DO-34)
BD
BL
LD
LL
BD
BL
LD
LL
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.056
.075
1.42
1.91
.140
.180
3.56
4.57
.018
.022
0.46
0.56
1.000 1.500 25.40
38.10
.050
.075
1.27
1.91
.080
.120
2.03
3.05
.018
.022
0.46
0.56
1.000 1.500 25.40
38.10
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
FIGURE 1. Physical dimensions.
3
MIL-PRF-19500/337K
DO-213AA
Symbol
BD
BL
ECT
S
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.063
.067
1.60 1.70
.130
.146
3.30 3.70
.016
.022
0.41 0.55
.001 min
0.03 min
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Referencing to dimension S, minimum clearance of glass body to mounting surface on all orientations.
5. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
FIGURE 2. Physical dimensions, 1N4153UR-1 (DO-213AA).
4
MIL-PRF-19500/337K
UB
1N4153UBCA
1N4153UB
2
1N4153UBD
1
Dimensions
Inches
Millimeters
Max
Min
Max
Min
.046
.056
1.17
1.42
.115
.128
2.92
3.25
.085
.108
2.16
2.74
.128
3.25
.108
2.74
.022
.038
0.56
0.97
.017
.035
0.43
0.89
1N4153UBCC
Symbol
Symbol
BH
LS1
BL
LS2
BW
LW
CL
r
CW
r1
LL1
r2
LL2
NOTES:
1. Dimensions are in inches. Millimeters are given for general information only.
2. Ceramic package only.
3. Hatched areas on package denote metallized areas. Pad 4 = shielding, connected to the lid.
4. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
* FIGURE 3. Physical dimensions, surface mount (UB version).
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.035
.039
0.89
0.99
.071
.079
1.80
2.01
.016
.024
0.41
0.61
.008
0.20
.012
0.31
.022
0.56
5
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