电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SMBJ5923DTRE3

产品描述Zener Diode, 8.2V V(Z), 1%, 2W
产品类别分立半导体    二极管   
文件大小123KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

SMBJ5923DTRE3概述

Zener Diode, 8.2V V(Z), 1%, 2W

SMBJ5923DTRE3规格参数

参数名称属性值
是否Rohs认证符合
Reach Compliance Codeunknown
配置SINGLE
二极管类型ZENER DIODE
最大动态阻抗3.5 Ω
元件数量1
最高工作温度150 °C
最大功率耗散2 W
标称参考电压8.2 V
表面贴装YES
最大电压容差1%
工作测试电流45.7 mA
Base Number Matches1

文档预览

下载PDF文档
SMBG5913 thru SMBG5956B, e3
SMBJ5913 thru SMBJ5956B, e3
SILICON 2.0 Watt ZENER DIODES
SCOTTSDALE DIVISION
DESCRIPTION
The SMBJ5913-5956B or SMBG5913-5956B series of surface mount 2.0
watt Zeners provides voltage regulation in a selection from 3.3 to 200
volts with different tolerances as identified by suffix letter on the part
number. This series is equivalent to the JEDEC registered 1N5913 thru
1N5956B with identical electrical characteristics except it is rated at 2.0 W
instead of 1.5 W with the lower thermal resistance features of the surface
mount packaging. It is available in J-bend design (SMBJ) with the DO-
214AA package for greater PC board mounting density or in Gull-wing
design (SMBG) in the DO-215AA for visible solder connections. It is also
available as RoHS Compliant with an e3 suffix. Microsemi also offers
numerous other Zener products to meet higher and lower power
applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
NOTE: All SMB series are
equivalent to prior SMS package
identifications.
FEATURES
Surface mount equivalent to 1N5913 to 1N5956B
Ideal for high-density and low-profile mounting
Zener voltage available 3.3V to 200V
Standard voltage tolerances are plus/minus 5% with
B suffix and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or 1%
with C or D suffix respectively
Options for screening in accordance with MIL-PRF-19500
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating
current and temperature range
Wide selection from 3.3 to 200 V
Popular DO-214AA or DO-215AA packages
and footprints for either high density J-bend or
Gull-wing designs for visible solder joints
Nonsensitive to ESD per MIL-STD-750 Method
1020
Withstands high surge stresses (see Figure 2)
Moisture classification: Level 1 per IPC/JEDEC
J-STD-020B with no dry pack required
MECHANICAL AND PACKAGING
CASE: Void-free transfer molded
thermosetting epoxy body meeting UL94V-0
TERMINALS: Gull-wing or C-bend (modified
J-bend) tin-lead or RoHS compliant annealed
matte-Tin plating solderable per MIL-STD-750,
method 2026
POLARITY: Cathode indicated by band.
Diode to be operated with banded end positive
with respect to opposite end for Zener
regulation
MARKING: Includes part number without
prefix (e.g. 5913B, 5913Be3, 5948C, 5956D,
etc.)
TAPE & REEL option: Standard per
EIA-481-1-
A
with 12 mm tape, 750 per 7 inch reel or 2500
per 13 inch reel
(add “TR” suffix to part number)
WEIGHT: 0.1 grams
See package dimensions on last page
for JAN, JANTX, and JANTXV are available by adding MQ,
MX, or MV prefixes respectively to part numbers.
RoHS Compliant devices available by adding an “e3” suffix
MAXIMUM RATINGS
Power dissipation at 25
º
C: 2.0 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+150
º
C
Thermal Resistance: 35
º
C/W junction to lead, or
100
º
C/W junction to ambient when mounted on FR4
PC board (1oz Cu) with recommended footprint (see
last page)
Steady-State Power: 2 watts at T
L
< 80
o
C, or 1.25
watts at T
A
= 25
º
C when mounted on FR4 PC board
with recommended footprint (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (maximum)
SMBG(J)5913–5956B, e3
Copyright
©
2007
6-21--2007 REV H
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
总结: PCB设计中的注意事项
作为一个电子工程师设计电路是一项必备的硬功夫,但是原理设计再完美,如果电路板设计不合适性能将大打折扣,严重时甚至不能正常工作http://www.21eic.com/ico/juhao.jpg总结出以下一些PCB设 ......
anboapple PCB设计
定向耦合器的使用技巧和注意事项
定向耦合器是一种极具使用价值的无源射频器件,其可从主传输路径中提取一小部分能量,并将其导向至一个或多个耦合端口。由于耦合端口与主传输路径之间具有高隔离度时较为有利,因此定向耦合 ......
Jacktang 模拟与混合信号
TI带你一起解剖共享单车智能锁!看视频涨知识赢好礼喽!
这个初夏悄然而至,走在温暖的街道上,随处可见小黄、小红、小蓝穿梭而过! 不知何时,共享单车已经融进我们的生活! 随时随地掏出手机快速解码,骑上就走。你知道吗?说走就走,随到随停的 ......
EEWORLD社区 TI技术论坛
四合一电调
本帖最后由 paulhyde 于 2014-9-15 03:19 编辑 四合一电调设计,用于飞行器! ...
FuFox 电子竞赛
我要用vs2005开发,然后在wince5.0应用,需要安装.cab文件,需要wceload吗?
大家好,我最近需要用vs2005开发一套应用软件,我在wince5.0的模拟器里,安装运行都正常。 然后在车载系统(wince5.0系统)里应用,需要安装.cab文件,安装提示“没有应用程序“没有应用程序与 ......
shuanghb 嵌入式系统
想从MFC转到做驱动,有好意见吗(散分90)
有简单驱动程序提供的网页或学习资料?谢谢大家...
hurton 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1490  1107  2581  355  2215  6  36  28  7  58 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved