* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/
_
C from 65
_
to 125
_
C
SOIC Package: – 7 mW/
_
C from 65
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
Min
4.5
0
Max
5.5
Unit
V
V
DC Supply Voltage (Referenced to GND)
Vin, Vout
TA
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time (Figure 1)
VCC
– 55
0
+ 125
500
_
C
ns
tr, tf
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
Guaranteed Limit
Symbol
S b l
VIH
VIL
Parameter
P
Test C di i
T
Conditions
VCC
V
4.5
5.5
4.5
5.5
4.5
5.5
4.5
4.5
5.5
4.5
5.5
5.5
– 55 to
25
_
C
2.0
2.0
0.8
0.8
4.4
5.4
v
85
_
C
v
125
_
C
2.0
2.0
0.8
0.8
4.4
5.4
2.0
2.0
0.8
0.8
4.4
5.4
3.7
0.1
0.1
0.4
Unit
U i
V
V
V
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20
µA
v
v
v
v
v
v
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20
µA
Vin = VIH or VIL
|Iout|
20
µA
Vin = VIH or VIL
|Iout|
4.0 mA
Vin = VIH or VIL
|Iout|
20
µA
Vin = VIH or VIL
|Iout|
4.0 mA
VOH
Minimum High–Level Output
Voltage
3.98
0.1
0.1
3.84
0.1
0.1
VOL
Maximum Low–Level Output
Voltage
V
0.26
0.33
Iin
Maximum Input Leakage Current
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Vin = VCC or GND
Iout = 0
µA
±
0.1
4.0
±
1.0
40
±
1.0
160
µA
µA
ICC
∆I
CC
Additional Quiescent Supply
Current
Vin = 2.4 V, Any One Input
Vin = VCC or GND, Other Inputs
lout = 0
µA
≥
–55
_
C
2.9
25
_
C to 125
_
C
2.4
5.5
55
mA
A
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
2
High–Speed CMOS Logic Data
DL129 — Rev 6
ÎÎÎ
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎ ÎÎ Î Î Î Î Î
Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎ Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î ÎÎ Î Î Î Î Î
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
* Used to determine the no–load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High–
Speed CMOS Data Book (DL129/D).
Î Î
Î
Î
Î
Î Î Î Î Î Î
Î Î Î Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
ÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î Î Î Î Î
Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎ Î ÎÎÎ Î
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
Î Î Î Î Î
Î Î Î Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎ Î ÎÎÎ Î
Î
Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î Î Î Î Î
ÎÎÎÎÎÎÎÎÎÎÎ Î
Î Î Î Î Î
Î
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Î
Î
AC ELECTRICAL CHARACTERISTICS
(VCC = 5.0 V
±
10%, CL = 50 pF, Input tr = tf = 6.0 ns)
Symbol
S b l
tPLH,
tPHL
tTLH,
tTHL
tPHL
fmax
Maximum Output Transition Time, Any Output
Maximum Propagation Delay, Reset to Q
Maximum Propagation Delay, Clock to Q
Maximum Clock Frequency (50% Duty Cycle)
Parameter
P
Fig.
Fi
1, 5
2, 4
1, 4
1, 4
– 55 to
25
_
C
18
25
25
30
Guaranteed Limit
High–Speed CMOS Logic Data
DL129 — Rev 6
Symbol
S b l
tr, tf
trec
tsu
tw
tw
th
CPD
Maximum Input Rise and Fall Times
Minimum Pulse Width, Set or Reset
Minimum Pulse Width, Clock
Minimum Recovery Time, Set or Reset Inactive to Clock
Minimum Hold Time, Clock to Data
Minimum Setup Time, Data to Clock
Power Di i i C
P
Dissipation Capacitance (P G )*
i
(Per Gate)*
Parameter
P
TIMING REQUIREMENTS
(VCC = 5.0 V
±
10%, CL = 50 pF, Input tr = tf = 6.0 ns)
3
Fig.
Fi
1
2
1
2
3
3
– 55 to 25
_
C
Min
5.0
3.0
12
12
10
Max
500
Guaranteed Limit
Typical @ 25°C, VCC = 5.0 V
Min
5.0
3.0
15
15
12
v
85
_
C
v
85
_
C
v
125
_
C
Max
500
20
28
28
24
30
Min
5.0
3.0
18
18
15
MC74HCT273A
v
125
_
C
22
35
35
20
Max
500
MOTOROLA
MHz
Unit
U i
Unit
U i
pF
F
ns
ns
ns
ns
ns
ns
ns
ns
ns
MC74HCT273A
SWITCHING WAVEFORMS
tr
CLOCK
2.7 V
1.3 V
0.3 V
tw
1/fmax
tPLH
Q
90%
1.3 V
10%
tTLH
tTHL
tPHL
trec
3.0 V
CLOCK
1.3 V
GND
tf
3.0 V
RESET
GND
1.3 V
GND
tPHL
Q
1.3 V
tw
3.0 V
Figure 1.
Figure 2.
TEST POINT
VALID
3.0 V
DATA
1.3 V
GND
tsu
CLOCK
th
3.0 V
1.3 V
GND
DEVICE
UNDER
TEST
OUTPUT
CL*
* Includes all probe and jig capacitance
Figure 3.
EXPANDED LOGIC DIAGRAM
C
D0
3
DR
C
D1
4
DR
C
D2
7
DR
C
DATA
INPUTS
D3
8
DR
C
D4
13
DR
C
D5
14
DR
C
D6
17
DR
C
DR
Q
2
Figure 4. Test Circuit
Q0
Q
5
Q1
Q
6
Q2
Q
9
Q3
NONINVERTING
OUTPUTS
Q
12
Q4
Q
15
Q5
Q
16
Q6
D7
18
Q
19
Q7
CLOCK
11
RESET
1
MOTOROLA
4
High–Speed CMOS Logic Data
DL129 — Rev 6
MC74HCT273A
OUTLINE DIMENSIONS
–A–
20
11
N SUFFIX
PLASTIC PACKAGE
CASE 738–03
ISSUE E
B
1
10
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0
_
15
_
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0
_
15
_
0.51
1.01
–T–
SEATING
PLANE
K
M
E
G
F
D
20 PL
N
J
0.25 (0.010)
M
20 PL
0.25 (0.010)
T A
M
M
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
–A–
20
11
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
10X
–B–
1
10
P
0.010 (0.25)
M
B
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0
_
7
_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0
_
7
_
0.395
0.415
0.010
0.029
20X
D
M
0.010 (0.25)
T A
S
B
J
S
F
R
X 45
_
C
–T–
18X
SEATING
PLANE
G
K
M
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data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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