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560756-1

产品描述Interconnect Device:Other, INTERCONNECTION DEVICE, INTERCONNECTION DEVICE
产品类别连接器    连接器   
文件大小103KB,共1页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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560756-1概述

Interconnect Device:Other, INTERCONNECTION DEVICE, INTERCONNECTION DEVICE

560756-1规格参数

参数名称属性值
Reach Compliance Codeunknown
其他特性2 CONTACTS, LOW PROFILE, GOLD PLATED
连接器类型INTERCONNECTION DEVICE
Base Number Matches1

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560756-1 Product Details
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.050 (1.27), .079 (2mm) C/L Low Profile System
Not re vie we d for R oHS C om plia nce
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560756-1
T E I nternal N umber: 5 6 0 7 5 6 - 1
Product Highlights:
l
C ontact
l
Number of Positions = 2
l
1.27 mm C enterline
l
PC B Mount Style = Through Hole
l
Mounting Style = Through Board
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Obsolete
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Product Drawings:
l
2P HEADER C ONTAC T
(PDF, English)
Catalog Pages/Data Sheets:
l
None Available
Product Specifications:
l
None Available
Application Specifications:
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APPLIC ATION SPEC IFIC ATION, LPS (LOW PROFILE SYSTEM) ...
(PDF, English)
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LPS (Low Profile System) C onnectors
(PDF, English)
Instruction Sheets:
l
None Available
CAD Files:
l
None Available
List all Documents
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
l
Product Type
= C ontact
l
Number of Positions
= 2
l
PC B Mount Style
= Through Hole
Mechanical Attachment:
l
Mounting Style
= Through Board
Body Related Features:
l
C enterline (mm [in])
= 1.27 [0.050]
Contact Related Features:
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C ontact Base Material = Phosphor Bronze
l
C ontact Mating Area Plating Material = Gold
Industry Standards:
l
RoHS/ELV C ompliance
= Not reviewed for ELV/RoHS compliance
l
Lead Free Solder Processes
= Not reviewed for lead free solder
process
Conditions for Usage:
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Temperature Rating = High
Packaging Related Features:
l
Packaging Method = Reel
Other:
l
Brand = AMP
Additional Information:
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Product Line Information
Related Products:
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Tooling
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