Microcontroller, 8-Bit, FLASH, SAM88RC CPU, 11.1MHz, CMOS, PQFP80
参数名称 | 属性值 |
包装说明 | QFP, TQFP80,.55SQ |
Reach Compliance Code | compliant |
位大小 | 8 |
CPU系列 | SAM88RC |
JESD-30 代码 | S-PQFP-G80 |
端子数量 | 80 |
最高工作温度 | 85 °C |
最低工作温度 | -25 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | TQFP80,.55SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 2.5/3.3 V |
认证状态 | Not Qualified |
RAM(字节) | 566 |
ROM(单词) | 16384 |
ROM可编程性 | FLASH |
速度 | 11.1 MHz |
最大压摆率 | 8 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
S3F8285X-TW | S3F8285X-QW | S3F828BX-TW | S3C8285XX-TW | S3C8285XX-QW | S3C8289XX-TW | S3C8289XX-QW | S3C828BXX-QW | S3C828BXX-TW | |
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描述 | Microcontroller, 8-Bit, FLASH, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, FLASH, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, FLASH, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, MROM, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, MROM, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, MROM, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, MROM, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, MROM, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 | Microcontroller, 8-Bit, MROM, SAM88RC CPU, 11.1MHz, CMOS, PQFP80 |
包装说明 | QFP, TQFP80,.55SQ | QFP, QFP80,.7X.9,32 | QFP, TQFP80,.55SQ | QFP, TQFP80,.55SQ | QFP, QFP80,.7X.9,32 | QFP, TQFP80,.55SQ | QFP, QFP80,.7X.9,32 | QFP, QFP80,.7X.9,32 | QFP, TQFP80,.55SQ |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | SAM88RC | SAM88RC | SAM88RC | SAM88RC | SAM88RC | SAM88RC | SAM88RC | SAM88RC | SAM88RC |
JESD-30 代码 | S-PQFP-G80 | R-PQFP-G80 | S-PQFP-G80 | S-PQFP-G80 | R-PQFP-G80 | S-PQFP-G80 | R-PQFP-G80 | R-PQFP-G80 | S-PQFP-G80 |
端子数量 | 80 | 80 | 80 | 80 | 80 | 80 | 80 | 80 | 80 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
封装等效代码 | TQFP80,.55SQ | QFP80,.7X.9,32 | TQFP80,.55SQ | TQFP80,.55SQ | QFP80,.7X.9,32 | TQFP80,.55SQ | QFP80,.7X.9,32 | QFP80,.7X.9,32 | TQFP80,.55SQ |
封装形状 | SQUARE | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 566 | 566 | 2614 | 566 | 566 | 1078 | 1078 | 2614 | 2614 |
ROM(单词) | 16384 | 16384 | 65536 | 16384 | 16384 | 32768 | 32768 | 65536 | 65536 |
ROM可编程性 | FLASH | FLASH | FLASH | MROM | MROM | MROM | MROM | MROM | MROM |
速度 | 11.1 MHz | 11.1 MHz | 11.1 MHz | 11.1 MHz | 11.1 MHz | 11.1 MHz | 11.1 MHz | 11.1 MHz | 11.1 MHz |
最大压摆率 | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA | 8 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.8 mm | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.8 mm | 0.8 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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