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W72M64V-100BC: 产品描述Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159; 产品类别存储存储; 文件大小209KB，共2页; 制造商White Electronic Designs Corporation; 官网地址http://www.wedc.com/

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W72M64V-100BC概述

Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159

W72M64V-100BC规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	White Electronic Designs Corporation
包装说明	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
Reach Compliance Code	unknown
最长访问时间	100 ns
备用内存宽度	32
启动块	BOTTOM
JESD-30 代码	R-PBGA-B159
长度	22 mm
内存密度	134217728 bit
内存集成电路类型	FLASH MODULE
内存宽度	64
功能数量	1
端子数量	159
字数	2097152 words
字数代码	2000000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	2MX64
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
编程电压	3.3 V
认证状态	Not Qualified
座面最大高度	2.2 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
类型	NOR TYPE
宽度	13 mm
Base Number Matches	1

W72M64V-100BC相似产品对比

	W72M64V-100BC	W72M64V-120BC	W72M64V-150BI	W72M64V-100BM	W72M64V-120BM	W72M64V-120BI	W72M64V-150BM	W72M64V-100BI	W72M64V-150BC
描述	Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 100ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	Flash Module, 2MX64, 150ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
厂商名称	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation
包装说明	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159	13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	100 ns	120 ns	150 ns	100 ns	120 ns	120 ns	150 ns	100 ns	150 ns
备用内存宽度	32	32	32	32	32	32	32	32	32
JESD-30 代码	R-PBGA-B159	R-PBGA-B159	R-PBGA-B159	R-PBGA-B159	R-PBGA-B159	R-PBGA-B159	R-PBGA-B159	R-PBGA-B159	R-PBGA-B159
长度	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm	22 mm
内存密度	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit	134217728 bit
内存集成电路类型	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE	FLASH MODULE
内存宽度	64	64	64	64	64	64	64	64	64
功能数量	1	1	1	1	1	1	1	1	1
端子数量	159	159	159	159	159	159	159	159	159
字数	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
字数代码	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000	2000000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	125 °C	125 °C	85 °C	125 °C	85 °C	70 °C
最低工作温度	-	-	-40 °C	-55 °C	-55 °C	-40 °C	-55 °C	-40 °C	-
组织	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64	2MX64
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
编程电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.2 mm	2.2 mm	2.2 mm	2.2 mm	2.2 mm	2.2 mm	2.2 mm	2.2 mm	2.2 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	COMMERCIAL
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
是否Rohs认证	不符合	不符合	不符合	-	不符合	不符合	不符合	不符合	不符合
启动块	BOTTOM	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
类型	NOR TYPE	NOR TYPE	NOR TYPE	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE

W72M64V-100BC

W72M64V-100BC概述

W72M64V-100BC规格参数

W72M64V-100BC相似产品对比

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