Micron Confidential and Proprietary
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
Automotive DDR2 SDRAM
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Industrial and automotive temperature compliant
V
DD
= 1.8V ±0.1V, V
DDQ
= 1.8V ±0.1V
JEDEC-standard 1.8V I/O (SSTL_18-compatible)
Differential data strobe (DQS, DQS#) option
4n-bit prefetch architecture
Duplicate output strobe (RDQS) option for x8
DLL to align DQ and DQS transitions with CK
4 internal banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency - 1
t
CK
Programmable burst lengths (BL): 4 or 8
Adjustable data-output drive strength
32ms, 8192-cycle refresh
On-die termination (ODT)
RoHS-compliant
Supports JEDEC clock jitter specification
AEC-Q100
PPAP submisson
8D response time
Options
1
• Configuration
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
• FBGA package (Pb-free) – x8
– 60-ball FBGA (8mm x 10mm)
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm)
• FBGA package (lead solder) – x8
– 60-ball FBGA (8mm x 10mm)
• FBGA package (lead solder) – x16
– 84-ball FBGA (8mm x 12.5mm)
• Timing – cycle time
– 2.5ns @ CL = 5 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
• Self refresh
– Standard
– Low-power
• Operating temperature
– Industrial (–40°C T
C
+95°C;
–40°C T
A
+85°C)
– Automotive (–40°C T
C
, T
A
+105ºC)
• Revision
Note:
Marking
64M8
32M16
CF
HR
JN
HW
-25E
-3
None
L
AIT
AAT
:G
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on
www.micron.com
for
product offerings and availability.
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed Grade
-25E
-25
-3E
-3
CL = 3
400
400
400
400
CL = 4
533
533
667
533
CL = 5
800
667
667
667
CL = 6
800
800
n/a
n/a
CL = 7
n/a
n/a
n/a
n/a
t
RC
(ns)
55
55
54
55
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Confidential and Proprietary
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
Table 2: Addressing
Parameter
Configuration
Refresh count
Row address
Bank address
Column address
64 Meg x 8
16 Meg x 8 x 4 banks
8K
A[13:0] (16K)
BA[1:0] (4)
A[9:0] (1K)
32 Meg x 16
8 Meg x 16 x 4 banks
8K
A[12:0] (8K)
BA[1:0] (4)
A[9:0] (1K)
Figure 1: 512Mb DDR2 Part Numbers
Example Part Number:
MT47H64M8CF-25E
-
MT47H
Configuration
Package
Speed
:
Revision
^
:G Revision
Configuration
64 Meg x 8
32 Meg x 16
Package
Pb-free
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10.0mm FBGA
Lead solder
84-ball 8mm x 12.5mm FBGA
60-ball 8mm x 10mm FBGA
HW
JN
HR
CF
-25E
-3
64M8
32M16
L
Low power
AIT Automotive industrial temperature
AAT Automotive temperature
Speed Grade
tCK = 2.5ns, CL = 5
tCK = 3ns, CL = 5
Note:
1. Not all speeds and configurations are available in all packages.
FBGA Part Number System
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. For a quick conversion of an FBGA code, see the FBGA Part Marking Decoder on Micron’s Web site:
http://www.micron.com.
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
Contents
State Diagram .................................................................................................................................................. 8
Functional Description ..................................................................................................................................... 9
Automotive Industrial Temperature ............................................................................................................... 9
Automotive Temperature ............................................................................................................................ 10
General Notes ............................................................................................................................................ 10
Functional Block Diagrams ............................................................................................................................. 11
Ball Assignments and Descriptions ................................................................................................................. 13
Packaging ...................................................................................................................................................... 17
Package Dimensions ................................................................................................................................... 17
FBGA Package Capacitance ......................................................................................................................... 19
Electrical Specifications – Absolute Ratings ..................................................................................................... 20
Temperature and Thermal Impedance ........................................................................................................ 20
Electrical Specifications – I
DD
Parameters ........................................................................................................ 23
I
DD
Specifications and Conditions ............................................................................................................... 23
I
DD7
Conditions .......................................................................................................................................... 24
AC Timing Operating Specifications ................................................................................................................ 27
AC and DC Operating Conditions .................................................................................................................... 39
ODT DC Electrical Characteristics ................................................................................................................... 40
Input Electrical Characteristics and Operating Conditions ............................................................................... 41
Output Electrical Characteristics and Operating Conditions ............................................................................. 44
Output Driver Characteristics ......................................................................................................................... 46
Power and Ground Clamp Characteristics ....................................................................................................... 50
AC Overshoot/Undershoot Specification ......................................................................................................... 51
Input Slew Rate Derating ................................................................................................................................ 53
Commands .................................................................................................................................................... 66
Truth Tables ............................................................................................................................................... 66
DESELECT ................................................................................................................................................. 70
NO OPERATION (NOP) ............................................................................................................................... 71
LOAD MODE (LM) ...................................................................................................................................... 71
ACTIVATE .................................................................................................................................................. 71
READ ......................................................................................................................................................... 71
WRITE ....................................................................................................................................................... 71
PRECHARGE .............................................................................................................................................. 72
REFRESH ................................................................................................................................................... 72
SELF REFRESH ........................................................................................................................................... 72
Mode Register (MR) ........................................................................................................................................ 72
Burst Length .............................................................................................................................................. 73
Burst Type .................................................................................................................................................. 74
Operating Mode ......................................................................................................................................... 74
DLL RESET ................................................................................................................................................. 74
Write Recovery ........................................................................................................................................... 75
Power-Down Mode ..................................................................................................................................... 75
CAS Latency (CL) ........................................................................................................................................ 76
Extended Mode Register (EMR) ....................................................................................................................... 77
DLL Enable/Disable ................................................................................................................................... 78
Output Drive Strength ................................................................................................................................ 78
DQS# Enable/Disable ................................................................................................................................. 78
RDQS Enable/Disable ................................................................................................................................. 78
Output Enable/Disable ............................................................................................................................... 78
On-Die Termination (ODT) ......................................................................................................................... 79
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
3
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
Off-Chip Driver (OCD) Impedance Calibration ............................................................................................ 79
Posted CAS Additive Latency (AL) ................................................................................................................ 79
Extended Mode Register 2 (EMR2) ................................................................................................................... 81
Extended Mode Register 3 (EMR3) ................................................................................................................... 82
Initialization .................................................................................................................................................. 83
ACTIVATE ...................................................................................................................................................... 86
READ ............................................................................................................................................................. 88
READ with Precharge .................................................................................................................................. 92
READ with Auto Precharge .......................................................................................................................... 94
WRITE ........................................................................................................................................................... 99
PRECHARGE ................................................................................................................................................. 109
REFRESH ...................................................................................................................................................... 110
SELF REFRESH .............................................................................................................................................. 111
Power-Down Mode ........................................................................................................................................ 113
Precharge Power-Down Clock Frequency Change ........................................................................................... 120
Reset ............................................................................................................................................................. 121
CKE Low Anytime ...................................................................................................................................... 121
ODT Timing .................................................................................................................................................. 123
MRS Command to ODT Update Delay ........................................................................................................ 125
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
512Mb: x8, x16 Automotive DDR2 SDRAM
Features
List of Tables
Table 1: Key Timing Parameters ....................................................................................................................... 1
Table 2: Addressing ......................................................................................................................................... 2
Table 3: FBGA 84-Ball – x16 and 60-Ball – x4, x8 Descriptions .......................................................................... 15
Table 4: Input Capacitance ............................................................................................................................ 19
Table 5: Absolute Maximum DC Ratings ......................................................................................................... 20
Table 6: Temperature Limits .......................................................................................................................... 21
Table 7: Thermal Impedance ......................................................................................................................... 22
Table 8: General I
DD
Parameters ..................................................................................................................... 23
Table 9: I
DD7
Timing Patterns (8-Bank Interleave READ Operation) ................................................................. 24
Table 10: DDR2 I
DD
Specifications and Conditions ......................................................................................... 25
Table 11: AC Operating Specifications and Conditions .................................................................................... 27
Table 12: Recommended DC Operating Conditions (SSTL_18) ........................................................................ 39
Table 13: ODT DC Electrical Characteristics ................................................................................................... 40
Table 14: Input DC Logic Levels ..................................................................................................................... 41
Table 15: Input AC Logic Levels ...................................................................................................................... 41
Table 16: Differential Input Logic Levels ......................................................................................................... 42
Table 17: Differential AC Output Parameters ................................................................................................... 44
Table 18: Output DC Current Drive ................................................................................................................ 44
Table 19: Output Characteristics .................................................................................................................... 45
Table 20: Full Strength Pull-Down Current (mA) ............................................................................................. 46
Table 21: Full Strength Pull-Up Current (mA) .................................................................................................. 47
Table 22: Reduced Strength Pull-Down Current (mA) ...................................................................................... 48
Table 23: Reduced Strength Pull-Up Current (mA) .......................................................................................... 49
Table 24: Input Clamp Characteristics ............................................................................................................ 50
Table 25: Address and Control Balls ................................................................................................................ 51
Table 26: Clock, Data, Strobe, and Mask Balls ................................................................................................. 51
Table 27: AC Input Test Conditions ................................................................................................................ 52
Table 28: DDR2-400/533 Setup and Hold Time Derating Values (
t
IS and
t
IH) .................................................... 54
Table 29: DDR2-667/800/1066 Setup and Hold Time Derating Values (
t
IS and
t
IH) ........................................... 55
Table 30: DDR2-400/533
t
DS,
t
DH Derating Values with Differential Strobe ...................................................... 58
Table 31: DDR2-667/800/1066
t
DS,
t
DH Derating Values with Differential Strobe ............................................. 59
Table 32: Single-Ended DQS Slew Rate Derating Values Using
t
DS
b
and
t
DH
b
................................................... 60
Table 33: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-667 ...................................... 60
Table 34: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-533 ...................................... 61
Table 35: Single-Ended DQS Slew Rate Fully Derated (DQS, DQ at V
REF
) at DDR2-400 ...................................... 61
Table 36: Truth Table – DDR2 Commands ...................................................................................................... 66
Table 37: Truth Table – Current State Bank
n
– Command to Bank
n
................................................................ 67
Table 38: Truth Table – Current State Bank
n
– Command to Bank
m
............................................................... 69
Table 39: Minimum Delay with Auto Precharge Enabled ................................................................................. 70
Table 40: Burst Definition .............................................................................................................................. 74
Table 41: READ Using Concurrent Auto Precharge .......................................................................................... 94
Table 42: WRITE Using Concurrent Auto Precharge ....................................................................................... 100
Table 43: Truth Table – CKE .......................................................................................................................... 115
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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