HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, FP-20DB
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| 系列 | HCT |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 长度 | 12.8 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 传播延迟(tpd) | 28 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |

| HD74HCT563RP | HD74HCT563FP | HD74HCT573FP | HD74HCT573RP | HD74HCT563P | HD74HCT563T | |
|---|---|---|---|---|---|---|
| 描述 | HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, FP-20DB | HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, FP-20DA | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, FP-20DA | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20, FP-20DB | IC,LATCH,SINGLE,8-BIT,HCT-CMOS,DIP,20PIN,PLASTIC | HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, TTP-20DA |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | DIP | SOIC |
| 包装说明 | SOP, | SOP, | SOP, | SOP, | DIP, DIP20,.3 | TSSOP, |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | compliant | unknown | unknown | compliant | compliant | compliant |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 系列 | HCT | HCT | - | HCT | - | HCT |
| JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | - | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 |
| 长度 | 12.8 mm | 12.6 mm | - | 12.8 mm | - | 6.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | D LATCH | BUS DRIVER |
| 位数 | 8 | 8 | - | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | - | 2 | - | 2 |
| 端子数量 | 20 | 20 | - | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | - | TRUE | - | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | - | SOP | DIP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟(tpd) | 28 ns | 28 ns | - | 28 ns | - | 28 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.65 mm | 2.2 mm | - | 2.65 mm | - | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | - | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | NO | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | - | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 2.54 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 5.5 mm | - | 7.5 mm | - | 4.4 mm |
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