Writing to the device is accomplished by taking chip enable
(CE) and write enable (WE) inputs LOW. If byte low enable
(BLE) is LOW, then data from I/O pins (I/O
1
through I/O
8
), is
written into the location specified on the address pins (A
0
through A
15
). If byte high enable (BHE) is LOW, then data from
I/O pins (I/O
9
through I/O
16
) is written into the location speci-
fied on the address pins (A
0
through A
15
).
Reading from the device is accomplished by taking chip en-
able (CE) and output enable (OE) LOW while forcing the write
enable (WE) HIGH. If byte low enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O
1
to I/O
8
. If byte high enable (BHE) is LOW, then
data from memory will appear on I/O
9
to I/O
16
. See the truth
table at the back of this datasheet for a complete description
of read and write modes.
The input/output pins (I/O
1
through I/O
16
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a write operation (CE
LOW, and WE LOW).
The CY7C1021V is available in 400-mil-wide SOJ, standard
44-pin TSOP Type II, and in 48 ball mini BGA packages.
Functional Description
The CY7C1021V is a high-performance CMOS static RAM or-
ganized as 65,536 words by 16 bits. This device has an auto-
matic power-down feature that significantly reduces power
consumption when deselected.
Logic Block Diagram
DATA IN DRIVERS
Pin Configuration
SOJ / TSOP II
Top View
A
4
A
3
A
2
A
1
A
0
CE
I/O
1
I/O
2
I/O
3
I/O
4
V
CC
V
SS
I/O
5
I/O
6
I/O
7
I/O
8
WE
A
15
A
14
A
13
A
12
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A
7
A
6
A
5
A
4
A
3
A
2
A
1
A
0
64K x 16
RAM Array
512 X 2048
I/O
1
– I/O
8
I/O
9
– I/O
16
COLUMN DECODER
BHE
WE
CE
OE
BLE
1021V-1
2CY7C1021V
A
5
A
6
A
7
OE
BHE
BLE
I/O
16
I/O
15
I/O
14
I/O
13
V
SS
V
CC
I/O
12
I/O
11
I/O
10
I/O
9
NC
A
8
A
9
A
10
A
11
NC
ROW DECODER
A
8
A
9
A
10
A
11
A
12
A
13
A
14
A
15
SENSE AMPS
1021V-2
Selection Guide
7C1021V-10
Maximum Access Time (ns)
Maximum Operating Current (mA)
Commercial
L
Maximum CMOS Standby Current (mA) Commercial
L
10
210
160
5
0.500
7C1021V-12
12
200
150
5
0.500
7C1021V-15
15
190
140
5
0.500
Cypress Semiconductor Corporation
•
3901 North First Street
•
San Jose
• CA 95134 •
408-943-2600
October 1996 – Revised April 13, 1998
CY7C1021V
Pin Configurations
(continued)
Mini-BGA
(Top View)
1
BLE
I/O
9
2
OE
BHE
3
A
0
A
3
A
5
NC
NC
A
14
A
12
A
9
4
A
1
A
4
A
6
A
7
NC
A
15
A
13
A
10
5
A
2
CE
I/O
2
I/O
4
I/O
5
I/O
6
WE
A
11
6
NC
I/O
1
I/O
3
V
CC
V
SS
I/O
7
I/O
8
NC
A
B
C
D
E
F
G
H
I/O
10
I/O
11
V
SS
V
CC
I/O
12
I/O
13
I/O
15
I/O
14
I/O
16
NC
NC
A
8
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied ............................................. –55°C to +125°C
Supply Voltage on V
CC
to Relative GND
[1]
.... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High Z State
[1]
.....................................–0.5V to V
CC
+0.5V
DC Input Voltage ..................................–0.5V to V
CC
+0.5V
Notes:
1. V
IL
(min.) = –2.0V for pulse durations of less than 20 ns.
2. T
A
is the “instant on” case temperature.
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage ........................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current..................................................... >200 mA
Operating Range
Range
Commercial
Industrial
Ambient
Temperature
[2]
0°C to +70°C
–40°C to +85°C
V
CC
3.3V
±
10%
3.3V
±
10%
[1]
2
CY7C1021V
Electrical Characteristics
Over the Operating Range
7C1021V-10
Parameter
V
OH
V
OL
V
IH
V
IL
I
IX
I
OZ
I
CC
Description
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
[1]
Input Load Current
Output Leakage
Current
V
CC
Operating
Supply Current
Automatic CE
Power-Down Current
— TTL Inputs
Automatic CE
Power-Down Current
— CMOS Inputs
GND < V
I
< V
CC
GND < V
I
< V
CC
,
Output Disabled
V
CC
= Max.
,
I
OUT
= 0 mA,
f = f
MAX
= 1/t
RC
Max. V
CC
, CE > V
IH
V
IN
> V
IH
or
V
IN
< V
IL
, f = f
MAX
Max. V
CC
,
CE > V
CC
– 0.3V,
V
IN
> V
CC
– 0.3V,
or V
IN
< 0.3V, f=0
L
L
Test Conditions
V
CC
= Min., I
OH
= –4.0 mA
V
CC
= Min., I
OL
= 8.0 mA
Min.
2.2
0.4
2.0
–0.3
–1
–1
V
CC
+
0.3V
0.8
+1
+1
210
160
40
2.0
–0.3
–1
–1
Max.
7C1021V-12
Min.
2.4
0.4
V
CC
+
0.3V
0.8
+1
+1
200
150
40
2.0
–0.3
–1
–1
Max.
7C1021V-15
Min.
2.4
0.4
V
CC
+
0.3V
0.8
+1
+1
190
140
40
Max.
Unit
V
V
V
V
µA
µA
mA
mA
mA
I
SB1
I
SB2
5
500
5
500
5
500
mA
µA
Capacitance
[3]
Parameter
C
IN
C
OUT
Description
Input Capacitance
Output Capacitance
Test Conditions
T
A
= 25°C, f = 1 MHz,
Max.
6
8
Unit
pF
pF
Note:
3. Tested initially and after any design or process changes that may affect these parameters.
AC Test Loads and Waveforms
3.3V
OUTPUT
30 pF
INCLUDING
JIG AND
SCOPE
(a)
OUTPUT
Equivalent to: THÉVENIN
EQUIVALENT
R2
351Ω
R 317
Ω
R 317Ω
3.3V
OUTPUT
5 pF
INCLUDING
JIG AND
SCOPE
(b)
167Ω
30 pF
R2
351Ω
GND
<3ns
1021V-3
1021V-4
ALL INPUT PULSES
3.0V
90%
10%
90%
10%
<3ns
1.73V
3
CY7C1021V
Switching Characteristics
[4]
Over the Operating Range
7C1021V-10
Parameter
READ CYCLE
t
RC
t
AA
t
OHA
t
ACE
t
DOE
t
LZOE
t
HZOE
t
LZCE
t
HZCE
t
PU
t
PD
t
DBE
t
LZBE
t
HZBE
t
WC
t
SCE
t
AW
t
HA
t
SA
t
PWE
t
SD
t
HD
t
LZWE
t
HZWE
t
BW
Read Cycle Time
Address to Data Valid
Data Hold from Address Change
CE LOW to Data Valid
OE LOW to Data Valid
OE LOW to Low Z
OE HIGH to High Z
[5, 6]
CE LOW to Low Z
[6]
CE HIGH to High Z
[5, 6]
7C1021V-12
Min.
12
Max.
7C1021V-15
Min.
15
Max.
Unit
ns
15
3
15
7
0
7
3
7
0
15
7
0
7
15
10
10
0
0
10
8
0
3
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
7
9
ns
ns
Description
Min.
10
Max.
10
3
10
4
0
5
3
5
0
12
5
0
5
10
8
7
0
0
8
6
0
3
5
8
8
12
8
8
0
0
8
6
0
3
0
0
3
0
3
12
12
6
6
6
12
6
6
CE LOW to Power-Up
CE HIGH to Power-Down
Byte enable to Data Valid
Byte enable to Low Z
Byte disable to High Z
Write Cycle Time
CE LOW to Write End
Address Set-Up to Write End
Address Hold from Write End
Address Set-Up to Write Start
WE Pulse Width
Data Set-Up to Write End
Data Hold from Write End
WE HIGH to Low Z
WE LOW to High Z
[6]
[5, 6]
WRITE CYCLE
[7]
6
Byte enable to end of write
Data Retention Characteristics
Over the Operating Range (L version only)
Parameter
V
DR
I
CCDR
Description
V
CC
for Data Retention
Data Retention Current
Com’l
V
CC
= V
DR
= 3.0V,
CE > V
CC
– 0.3V,
V
IN
> V
CC
– 0.3V or
V
IN
< 0.3V
0
t
RC
Conditions
[10]
Min.
2.0
100
Max.
Unit
V
µA
t
CDR[8]
t
R[9]
Chip Deselect to Data Retention Time
Operation Recovery Time
ns
ns
Notes:
4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified
I
OL
/I
OH
and 30-pF load capacitance.
5. t
HZOE
, t
HZBE
, t
HZCE
, and t
HZWE
are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured
±500
mV from steady-state voltage.
6. At any given temperature and voltage condition, t
HZCE
is less than t
LZCE
, t
HZOE
is less than t
LZOE
, and t
HZWE
is less than t
LZWE
for any given device.
7. The internal write time of the memory is defined by the overlap of CE LOW, WE LOW and BHE / BLE LOW. CE, WE and BHE / BLE must be LOW to initiate a write,
and the transition of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write.
8. Tested initially and after any design or process changes that may affect these parameters.
9. t
r
< 3 ns for the –12 and –15 speeds. t
r
< 5 ns for the –20 and slower speeds.
10. No input may exceed V
CC
+ 0.5V.
4
CY7C1021V
Data Retention Waveform
DATA RETENTION MODE
V
CC
3.0V
t
CDR
CE
1021V–5
V
DR
> 2V
3.0V
t
R
Switching Waveforms
Read Cycle No.1
[11, 12]
t
RC
ADDRESS
t
AA
t
OHA
DATA OUT
PREVIOUS DATA VALID
DATA VALID
1021V-6
Read Cycle No.2 (OE Controlled)
ADDRESS
[12, 13]
t
RC
CE
t
ACE
OE
BHE, BLE
t
DOE
t
LZOE
t
DBE
t
LZBE
HIGH IMPEDANCE
t
LZCE
V
CC
SUPPLY
CURRENT
t
PU
50%
t
HZCE
t
HZBE
DATA VALID
t
PD
50%
IISB
SB
1021V-7
t
HZOE
HIGH
IMPEDANCE
DATA OUT
IICC
CC
Notes:
11. Device is continuously selected. OE, CE, BHE, and/or BHE = V
IL
12. WE is HIGH for read cycle.
13. Address valid prior to or coincident with CE transition LOW.
stm32/stm8
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