Fast Page DRAM, 64KX4, 70ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18
参数名称 | 属性值 |
厂商名称 | OKI |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 18 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
访问模式 | FAST PAGE |
最长访问时间 | 70 ns |
其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
JESD-30 代码 | R-PDIP-T18 |
长度 | 22.6 mm |
内存密度 | 262144 bit |
内存集成电路类型 | FAST PAGE DRAM |
内存宽度 | 4 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 18 |
字数 | 65536 words |
字数代码 | 64000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 64KX4 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
刷新周期 | 256 |
座面最大高度 | 4.5 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
Base Number Matches | 1 |
MSM51C464A-70RS | MSM51C464A-10RS | MSM51C464A-10ZS | MSM51C464A-80ZS | MSM51C464A-70JS | MSM51C464A-80JS | MSM51C464A-10JS | MSM51C464A-80RS | MSM51C464A-70ZS | |
---|---|---|---|---|---|---|---|---|---|
描述 | Fast Page DRAM, 64KX4, 70ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Fast Page DRAM, 64KX4, 100ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Fast Page DRAM, 64KX4, 100ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Fast Page DRAM, 64KX4, 80ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 | Fast Page DRAM, 64KX4, 70ns, CMOS, PQCC18, 0.290 INCH, PLASTIC, LCC-18 | Fast Page DRAM, 64KX4, 80ns, CMOS, PQCC18, 0.290 INCH, PLASTIC, LCC-18 | Fast Page DRAM, 64KX4, 100ns, CMOS, PQCC18, 0.290 INCH, PLASTIC, LCC-18 | Fast Page DRAM, 64KX4, 80ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Fast Page DRAM, 64KX4, 70ns, CMOS, PZIP19, 0.400 INCH, PLASTIC, ZIP-20/19 |
零件包装代码 | DIP | DIP | ZIP | ZIP | LCC | LCC | LCC | DIP | ZIP |
包装说明 | DIP, | DIP, | ZIP, | ZIP, | QCCJ, | QCCJ, | QCCJ, | DIP, | ZIP, |
针数 | 18 | 18 | 20 | 20 | 18 | 18 | 18 | 18 | 20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
最长访问时间 | 70 ns | 100 ns | 100 ns | 80 ns | 70 ns | 80 ns | 100 ns | 80 ns | 70 ns |
其他特性 | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH |
JESD-30 代码 | R-PDIP-T18 | R-PDIP-T18 | R-PZIP-T19 | R-PZIP-T19 | R-PQCC-J18 | R-PQCC-J18 | R-PQCC-J18 | R-PDIP-T18 | R-PZIP-T19 |
长度 | 22.6 mm | 22.6 mm | 25.5 mm | 25.5 mm | 12.45 mm | 12.45 mm | 12.45 mm | 22.6 mm | 25.5 mm |
内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bi |
内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 18 | 18 | 19 | 19 | 18 | 18 | 18 | 18 | 19 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 | 64KX4 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | ZIP | ZIP | QCCJ | QCCJ | QCCJ | DIP | ZIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
刷新周期 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 | 256 |
座面最大高度 | 4.5 mm | 4.5 mm | 10.16 mm | 10.16 mm | 3.55 mm | 3.55 mm | 3.55 mm | 4.5 mm | 10.16 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | YES | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | ZIG-ZAG | ZIG-ZAG | QUAD | QUAD | QUAD | DUAL | ZIG-ZAG |
宽度 | 7.62 mm | 7.62 mm | 2.8 mm | 2.8 mm | 7.24 mm | 7.24 mm | 7.24 mm | 7.62 mm | 2.8 mm |
厂商名称 | OKI | - | OKI | OKI | OKI | OKI | OKI | OKI | OKI |
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