E-pHEMT MMIC
Product Features
• Small size
• Higher Gain
• Higher linearity
• SOT89 SMD Type package
• Higher productivity
• Lower manufacturing cost
• -55dBc CSO 135 Channels @ +30dBmV/ch
• -70dBc CTB 135 Channels @ +30dBmV/ch
• -67dBc XMD 135 Channels @ +30dBmV/ch
AE427
(Preliminary)
Application
• Low Noise Amplifier for
CATV, Satellite
• Cable Modem
• FTTH (G-PON, GE-PON)
• Optical node
Package : SOT-89
Description
AE427is designed as low cost drive amplifiers for many applications including FTTH, CATV System.
This MMIC is based on Gallium Arsenide Enhancement Mode pHEMT which shows low current draw and very low noise.
The data in this spec sheet is valid only for 75 ohm application. 50 ohm data is in a separate spec sheet.
Specifications
PARAMETER
Frequency
Gain
Input Return Loss
Output Return Loss
Output IP3
1dB Compression Point
Noise Figure
CSO
CTB
XMOD
DC Current
NOTE
1. Test conditions unless otherwise noted. Test Freq = 500MHz, T=25℃, Vdd=8V, 75Ω system
2. OIP3 measured with 2 tones at an output power of +10dBm/tone separated by 1MHz, Test Freq = 500MHz
UNIT
MHz
dB
dB
dB
dBm
dBm
dB
dBc
MIN
TYP
50 ~ 1000
MAX
Condition
23
25
-11
-16
37
21
40
24
2
-55
-70
-67
130
3
-50
-65
-62
At 500MHz/10dBm 2tone
At 500MHz
135 channel, +30dBmV/ch
135 channel, +30dBmV/ch
135 channel, +30dBmV/ch
Vdd = 8.0V
30 ~ 870MHz
dBc
dBc
mA
Absolute Minimum and Maximum Ratings
PARAMETER
Device Voltage
Operating Temperature
Storage Temperature
UNIT
VDC
MIN
TYP
+8
-40
-40
MAX
+9
+85
+150
℃
℃
▪
Tel : 82-31-250-5011
▪
rfsales@rfhic.com
▪
All specifications may change without notice.
▪
Version 0.2
E-pHEMT MMIC
+8V
4.7uF
( Tantal)
AE427
(Preliminary)
◎
Application Circuit: 50MHz ~ 1000MHz, 75ohm System
100nF
Rbias = 0 ohm
1uH
( Wire wound
)
Input
680 nH
300 pF
8. 2 nH
AE427
0 ohm
12 pF
8. 2 nH
10 nF
Output
2. 4 pF
910 ohm
560 ohm
◎
Typical RF Performance: V
DD
=8V, I
DS
=130mA, T=25℃, 75ohm System
S-Parameter
30
30
Noise Figure vs Frequency
5
25
S21
20
Return Loss(dB)
4
Gain(dB)
15
0
NF(dB)
20
10
3
2
10
S11
S22
-10
1
5
0.0
0.2
0.4
0.6
Freq(GHz)
0.8
1.0
1.2
-20
0
10
200
400
600
Freq(MHz)
800
1000
◎
Multi-Tone Test 135CH_FLAT@Output Power +30dBmV/Ch
Level: +30dBmV
FRQ
55.25
77.25
109.25
211.25
331.25
445.25
547.25
637.25
745.25
859.25
Tilt: 135CH_FLAT
CTB_RAW
73.4
74.6
73.8
74.2
72.7
73.5
72.4
72
72.1
71.1
CTB_COR
77.7
78.9
78.1
78.5
77
77.8
76.7
76.3
76.5
75.4
N-FLR
75.6
75.9
75.9
76.2
74.7
75.4
73.8
73.8
73.7
72
CSU_RAW
75.2
60.2
74.6
69.4
63.3
61.2
58.5
57.4
56
55.5
CSU_COR
79.5
60.3
78.9
70.5
63.6
61.4
58.6
57.5
56
55.6
CSU_FRQ
56
77.99
109.99
212.49
332.49
446.49
548.5
638.49
746.49
860.49
CSL_RAW
61
75.3
59.5
58
56.7
56.7
57.3
58.7
63.9
67.8
CSL_COR
61.1
79.7
59.6
58
56.7
56.7
57.5
58.8
64.4
70
CSL_FRQ
54
75.97
107.99
209.99
329.99
443.99
545.98
635.98
743.99
858.49
XMD(NCTA)
69.8
70.2
71.2
70.5
70.2
69.2
69.2
69.2
68.8
68.1
Min
Max
68.1
71.2
71.1
74.6
75.4
78.9
72
76.2
55.5
75.2
55.6
79.5
56
860.49
56.7
75.3
56.7
79.7
54
858.49
▪
Tel : 82-31-250-5011
▪
rfsales@rfhic.com
▪
All specifications may change without notice.
▪
Version 0.2
E-pHEMT MMIC
ESD Protection
AE427
(Preliminary)
For a safe use in all situations, it is recommended to have proper ESD control techniques while the device is being
handled. Here are some recommended precautions;
- Person at a workbench should be earthed via a wrist strap and a resistor.
- All mains-powered equipment should be connected to the mains via an earth-leakage switch.
- Equipment cases should be grounded.
- Relative humidity should be maintained between 40% and 50%.
- An ionizer is recommended.
- Keep static materials, such as plastic envelopes and plastic trays etc. away from the workbench
Dimensions
Pin No
1
2
3
4
Function
Input
Ground
Output/Bias
Ground
PCB Pad Layout
Recommended Mounting Configuration
Mounting Configuration Notes
1.Ground / thermal via holes are critical for the proper performance of this device.
2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via hole region contacts
the heatsink.
4. Do not put solder mask on the backside of the PCB in the region where the board contacts the heatsink.
5. RF trace width depends upon the PCB material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters.
RFHIC Corporation (RFHIC) reserves the right to make changes to any products herein or to discontinue any product at any time without notice. RFHIC do not
assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, including without limitation consequential or
incidental damages. The product specifications herein expressed have been carefully checked and are assumed to be reliable. However, RFHIC disclaims liability for
inaccuracies and strongly recommends buyers to verify that the information they are using is current before placing purchase orders. RFHIC products are not
intended for use in life support equipment or application where malfunction of the product can be expected to result in personal injury or death. Buyer uses or sells
such products for any such unintended or unauthorized application, buyer shall indemnify, protect and hold RFHIC and its directors, officers, stockholders,
employees, representatives and distributors harmless against any and all claims arising out of such use. RFHIC’s liability under or arising out of damages, claims of
whatsoever kind and nature which RFHIC products could cause shall be limited in amount to the net purchase price of the products sold to buyer by RFHIC
.
▪
Tel : 82-31-250-5011
▪
rfsales@rfhic.com
▪
All specifications may change without notice.
▪
Version 0.2
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