HCT SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 其他特性 | WITH DIRECTION CONTROL |
| 系列 | HCT |
| JESD-30 代码 | R-PDIP-T24 |
| 长度 | 31.64 mm |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 46 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |
| CD74HCT646E | CD74HCT646H | CD54HC646F | CD54HC646H | |
|---|---|---|---|---|
| 描述 | HCT SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDIP24, PLASTIC, DIP-24 | HCT SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, UUC24, DIE | HC/UH SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, CDIP24, FRIT SEALED, CERAMIC, DIP-24 | HC/UH SERIES, 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, UUC24, DIE |
| 零件包装代码 | DIP | DIE | DIP | DIE |
| 包装说明 | DIP, | DIE, | DIP, DIP24,.6 | DIE, |
| 针数 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | not_compliant | unknown |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 其他特性 | WITH DIRECTION CONTROL | WITH DIRECTION CONTROL | - | WITH DIRECTION CONTROL |
| 系列 | HCT | HCT | - | HC/UH |
| JESD-30 代码 | R-PDIP-T24 | R-XUUC-N24 | - | R-XUUC-N24 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | - | REGISTERED BUS TRANSCEIVER |
| 位数 | 8 | 8 | - | 8 |
| 功能数量 | 1 | 1 | - | 1 |
| 端口数量 | 2 | 2 | - | 2 |
| 端子数量 | 24 | 24 | - | 24 |
| 最高工作温度 | 85 °C | 85 °C | - | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE |
| 输出极性 | TRUE | TRUE | - | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | - | UNSPECIFIED |
| 封装代码 | DIP | DIE | - | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | UNCASED CHIP | - | UNCASED CHIP |
| 传播延迟（tpd） | 46 ns | 46 ns | - | 205 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 4.5 V |
| 表面贴装 | NO | YES | - | YES |
| 技术 | CMOS | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | - | NO LEAD |
| 端子位置 | DUAL | UPPER | - | UPPER |
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