Serial I/O Controller, 1 Channel(s), 0.048828125MBps, CMOS, CDIP40
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Harris |
| 包装说明 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown |
| 地址总线宽度 | 1 |
| 边界扫描 | NO |
| 总线兼容性 | 1800 |
| 通信协议 | ASYNC, BIT |
| 数据编码/解码方法 | NRZ |
| 最大数据传输速率 | 0.048828125 MBps |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-CDIP-T40 |
| JESD-609代码 | e0 |
| 低功率模式 | NO |
| DMA 通道数量 | |
| I/O 线路数量 | |
| 串行 I/O 数 | 1 |
| 端子数量 | 40 |
| 片上数据RAM宽度 | |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5/10 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 0 |
| 最大压摆率 | 6 mA |
| 最大供电电压 | 10.5 V |
| 最小供电电压 | 4 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| CDP1854AD | CDP1854ACCQ | CDP1854AEX | CDP1854ACDX | CDP1854ACD | CDP1854AE | CDP1854AQ | CDP1854ACEX | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Serial I/O Controller, 1 Channel(s), 0.048828125MBps, CMOS, CDIP40 | Serial I/O Controller, 1 Channel(s), 0.0244140625MBps, CMOS, PQCC44 | Serial I/O Controller, 1 Channel(s), 0.048828125MBps, CMOS, PDIP40 | Serial I/O Controller, 1 Channel(s), 0.0244140625MBps, CMOS, CDIP40 | Serial I/O Controller, 1 Channel(s), 0.0244140625MBps, CMOS, CDIP40 | Serial I/O Controller, 1 Channel(s), 0.048828125MBps, CMOS, PDIP40 | Serial I/O Controller, 1 Channel(s), 0.048828125MBps, CMOS, PQCC44 | Serial I/O Controller, 1 Channel(s), 0.0244140625MBps, CMOS, PDIP40 |
| 包装说明 | DIP, DIP40,.6 | , | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| 地址总线宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO |
| 总线兼容性 | 1800 | 1800 | 1800 | 1800 | 1800 | 1800 | 1800 | 1800 |
| 通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
| 数据编码/解码方法 | NRZ | NRZ | NRZ | NRZ | NRZ | NRZ | NRZ | NRZ |
| 最大数据传输速率 | 0.048828125 MBps | 0.0244140625 MBps | 0.048828125 MBps | 0.0244140625 MBps | 0.0244140625 MBps | 0.048828125 MBps | 0.048828125 MBps | 0.0244140625 MBps |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-CDIP-T40 | S-PQCC-J44 | R-PDIP-T40 | R-CDIP-T40 | R-CDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | R-PDIP-T40 |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO |
| 串行 I/O 数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 40 | 44 | 40 | 40 | 40 | 40 | 44 | 40 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 10.5 V | 6.5 V | 10.5 V | 6.5 V | 6.5 V | 10.5 V | 10.5 V | 6.5 V |
| 最小供电电压 | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Harris | - | Harris | Harris | Harris | Harris | Harris | Harris |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 封装代码 | DIP | - | DIP | DIP | DIP | DIP | QCCJ | DIP |
| 封装等效代码 | DIP40,.6 | - | DIP40,.6 | DIP40,.6 | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5/10 V | - | 5/10 V | 5 V | 5 V | 5/10 V | 5/10 V | 5 V |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
GD32 MCU
FPGA/CPLD
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