1-1-3 DC/DC Converter ICs
SI-8000W Series
■Features
• Surface-mount package (SOP8)
• Output current: 0.6A
• High efficiency: 75 to 80%
• Requires only 4 discrete components
Surface-Mount, Separate Excitation Step-down Switching Mode
■Absolute
Maximum Ratings
Parameter
DC Input Voltage
Power Dissipation
Junction Temperature
Storage Temperature
Thermal Resistance (Junction to 7-Pin Lead)
Thermal Resistance (Junction to Ambient Air)
*1
Symbol
V
IN
P
D
T
j
T
stg
Ratings
35
1
–30 to +125
–40 to +125
22
100
Unit
V
W
°C
°C
°C/W
°C/W
• Internally-adjusted phase correction and
output voltage adjustment performed internally
• Built-in reference oscillator (60kHz)
• Built-in overcurrent and thermal protection
circuits
θ
j-L
θ
j-a
*1: Glass-epoxy board of 40
×
40mm (copper laminate area 4.3%)
■Applications
• Power supplies for telecommunication equipment
• Onboard local power supplies
■Recommended
Operating Conditions
Ratings
Parameter
DC Input Voltage Range
Output Current Range
Operating Junction Temperature Range
Symbol
V
IN
I
O
T
jop
SI-8033W
5.3 to 28
0 to 0.6
–30 to +125
SI-8050W
7 to 33
Unit
V
A
°C
■Electrical
Characteristics
Ratings
Parameter
Symbol
min.
Output Voltage
Efficiency
Oscillation Frequency
Line Regulation
Load Regulation
Temperature Coefficient of Output Voltage
Ripple Rejection
Overcurrent Protection Starting
Current
V
O
Conditions
3.17
SI-8033W
typ.
3.30
V
IN
=15V, I
O
=0.3A
75
V
IN
=15V, I
O
=0.3A
60
V
IN
=15V, I
O
=0.3A
60
V
IN
=8 to 28V, I
O
=0.3A
20
V
IN
=15V, I
O
=0.1 to 0.4A
±0.5
45
f=100 to 120H
Z
0.61
V
IN
=15V
0.61
V
IN
=20V
30
80
max.
3.43
min.
4.80
SI-8050W
typ.
5.00
V
IN
=20V, I
O
=0.3A
80
V
IN
=20V, I
O
=0.3A
60
V
IN
=20V, I
O
=0.3A
80
V
IN
=10 to 30V, I
O
=0.3A
30
V
IN
=20V, I
O
=0.1 to 0.4A
±0.5
45
f=100 to 120H
Z
40
100
max.
5.20
(T
a
=25°C)
Unit
V
%
kH
Z
mV
mV
mV/
°C
dB
A
η
Conditions
f
Conditions
∆V
OLINE
Conditions
∆V
OLOAD
Conditions
∆V
O
/∆T
a
R
REJ
Conditions
I
S1
Conditions
14
ICs
SI-8000W Series
■External
Dimensions (SOP8)
5.1
±0.4
1.27
0.4
±0.1
0.15
+0.1
–0.05
(Unit : mm)
8
7
6
5
1
2
3
4
1.55
±0.15
0t
0.995max.
o1
0
°
1.27
Pin Assignment
q
V
IN
w
N.C
e
SW
r
V
OS
t
GND
y
GND
u
GND
i
GND
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 0.1g
4.4
±0.2
0.5
±0.1
0.05
±0.05
1.5
±0.1
6.2
±0.3
0.10
0.4
±0.1
0.12 M
■Block
Diagram
V
IN
1
OCP
Reg.
OSC
3 SW
■Typical
Connection Diagram
L1
200µH
V
IN
1
V
IN
SW
3
4
D
1
SJPB-D4
(Sanken)
+
V
O
Reset
Drive
Comp.
TSD
C
1
100µF
+
SI-8000W
GND
5 to 8
V
OS
C
2
330µF
Amp.
V
REF
5 to 8
4 V
OS
GND
GND
GND
■Reference
Data
Copper Laminate Area vs. Power Dissipation
1.2
Tj=100°C Area of PC board : 40
×
40mm
Ta=25°C
1
Power Dissipation
P
D
(W)
Copper Laminate Area vs. Thermal Resistance
θ
j-a
140
Area of PC board : 40
×
40mm
Ta=50°C
120
Thermal Resistance
θ
j-a (°C/W)
Ta=80°C
0.8
100
0.6
0.4
80
60
0.2
0
10
100
Copper Laminate Area
(mm
2
)
(GND Terminal)
1000
40
10
100
Copper Laminate Area
(mm
2
)
(GND Terminal)
1000
ICs
15
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