MCP1700
Low Quiescent Current LDO
Features
•
•
•
•
•
•
•
•
•
•
•
1.6 µA Typical Quiescent Current
Input Operating Voltage Range: 2.3V to 6.0V
Output Voltage Range: 1.2V to 5.0V
250 mA Output Current for output voltages
≥
2.5V
200 mA Output Current for output voltages < 2.5V
Low Dropout (LDO) voltage
- 178 mV typical @ 250 mA for V
OUT
= 2.8V
0.4% Typical Output Voltage Tolerance
Standard Output Voltage Options:
- 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
Stable with 1.0 µF Ceramic Output capacitor
Short Circuit Protection
Overtemperature Protection
General Description
The MCP1700 is a family of CMOS low dropout (LDO)
voltage regulators that can deliver up to 250 mA of
current while consuming only 1.6 µA of quiescent
current (typical). The input operating range is specified
from 2.3V to 6.0V, making it an ideal choice for two and
three primary cell battery-powered applications, as well
as single cell Li-Ion-powered applications.
The MCP1700 is capable of delivering 250 mA with
only 178 mV of input to output voltage differential
(V
OUT
= 2.8V). The output voltage tolerance of the
MCP1700 is typically ±0.4% at +25°C and ±3%
maximum over the operating junction temperature
range of -40°C to +125°C.
Output voltages available for the MCP1700 range from
1.2V to 5.0V. The LDO output is stable when using only
1 µF output capacitance. Ceramic, tantalum or
aluminum electrolytic capacitors can all be used for
input and output. Overcurrent limit and overtemperature
shutdown provide a robust solution for any application.
Package options include the SOT-23, SOT-89 and
TO-92.
Applications
•
•
•
•
•
•
•
•
•
•
Battery-powered Devices
Battery-powered Alarm Circuits
Smoke Detectors
CO
2
Detectors
Pagers and Cellular Phones
Smart Battery Packs
Low Quiescent Current Voltage Reference
PDAs
Digital Cameras
Microcontroller Power
Package Types
3-Pin SOT-23
V
IN
3
MCP1700
1
2
MCP1700
1
2
3
GND V
IN
V
OUT
3-Pin SOT-89
V
IN
3-Pin TO-92
MCP1700
1 2 3
Related Literature
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765, Microchip Technology Inc., 2002
• AN766, “Pin-Compatible CMOS Upgrades to
BiPolar LDOs”, DS00766,
Microchip Technology Inc., 2002
• AN792, “A Method to Determine How Much
Power a SOT23 Can Dissipate in an Application”,
DS00792, Microchip Technology Inc., 2001
GND V
OUT
GND V
IN
V
OUT
©
2007 Microchip Technology Inc.
DS21826B-page 1
MCP1700
Functional Block Diagrams
MCP1700
V
IN
V
OUT
Error Amplifier
+V
IN
Voltage
Reference
-
+
Over Current
Over Temperature
GND
Typical Application Circuits
MCP1700
GND
V
OUT
1.8V
I
OUT
150 mA
V
IN
V
OUT
C
OUT
1 µF Ceramic
V
IN
(2.3V to 3.2V)
C
IN
1 µF Ceramic
DS21826B-page 2
©
2007 Microchip Technology Inc.
MCP1700
1.0
ELECTRICAL
CHARACTERISTICS
† Notice:
Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
V
DD
............................................................................................+
6.5V
All inputs and outputs w.r.t. .............(V
SS
-0.3V) to (V
IN
+0.3V)
Peak Output Current .................................... Internally Limited
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature ................................... 150°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins (HBM;MM)...............
≥
4 kV;
≥
400V
DC CHARACTERISTICS
Electrical Characteristics:
Unless otherwise specified, all limits are established for V
IN
= V
R
+ 1, I
LOAD
= 100 µA,
C
OUT
= 1 µF (X7R), C
IN
= 1 µF (X7R), T
A
= +25°C.
Boldface
type applies for junction temperatures, T
J
(Note 6)
of -40°C to +125°C.
Parameters
Input / Output Characteristics
Input Operating Voltage
Input Quiescent Current
Maximum Output Current
Output Short Circuit Current
V
IN
I
q
I
OUT_mA
I
OUT_SC
2.3
—
250
200
—
—
1.6
—
—
408
6.0
4
—
—
—
V
µA
mA
mA
Note 1
I
L
= 0 mA, V
IN
= V
R
+1V
For V
R
≥
2.5V
For V
R
<
2.5V
V
IN
= V
R
+ V, V
OUT
= GND,
Current (peak current) measured
10 ms after short is applied.
Note 2
Note 3
(V
R
+1)V
≤
V
IN
≤
6V
I
L
= 0.1 mA to 250 mA for V
R
≥
2.5V
I
L
= 0.1 mA to 200 mA for V
R
<
2.5V
Note 4
I
L
= 250 mA,
(Note 1, Note 5)
I
L
= 200 mA,
(Note 1, Note 5)
10% V
R
to 90% V
R
V
IN
= 0V to 6V,
R
L
= 50Ω resistive
Sym
Min
Typ
Max
Units
Conditions
Output Voltage Regulation
V
OUT
Temperature Coefficient
Line Regulation
Load Regulation
V
OUT
TCV
OUT
ΔV
OUT
/
(V
OUT
XΔV
IN
)
V
R
-3.0%
V
R
-2.0%
—
-1.0
-1.5
V
R
±0.4
%
50
±0.75
±1.0
V
R
+3.0%
V
R
+2.0%
—
+1.0
+1.5
V
ppm/°C
%/V
%
Δ
V
OUT
/V
OUT
V
IN
-V
OUT
V
IN
-V
OUT
T
R
e
N
Dropout Voltage
V
R
>
2.5V
Dropout Voltage
V
R
<
2.5V
Output Rise Time
Output Noise
Note 1:
2:
3:
4:
5:
6:
—
—
—
—
178
150
500
3
350
350
—
—
mV
mV
µs
µV/(Hz)
1/2
I
L
= 100 mA, f = 1 kHz, C
OUT
= 1 µF
7:
The minimum V
IN
must meet two conditions: V
IN
≥
2.3V and V
IN
≥ (V
R
+ 3.0%)
+V
DROPOUT
.
V
R
is the nominal regulator output voltage. For example: V
R
= 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V. The
input voltage (V
IN
= V
R
+ 1.0V); I
OUT
= 100 µA.
TCV
OUT
= (V
OUT-HIGH
- V
OUT-LOW
) *10
6
/ (V
R
*
ΔTemperature),
V
OUT-HIGH
= highest voltage measured over the
temperature range. V
OUT-LOW
= lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
OUT
.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with a V
R
+ 1V differential applied.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
©
2007 Microchip Technology Inc.
DS21826B-page 3
MCP1700
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics:
Unless otherwise specified, all limits are established for V
IN
= V
R
+ 1, I
LOAD
= 100 µA,
C
OUT
= 1 µF (X7R), C
IN
= 1 µF (X7R), T
A
= +25°C.
Boldface
type applies for junction temperatures, T
J
(Note 6)
of -40°C to +125°C.
Parameters
Power Supply Ripple
Rejection Ratio
Thermal Shutdown Protection
Note 1:
2:
3:
4:
5:
6:
Sym
PSRR
Min
—
Typ
44
Max
—
Units
dB
Conditions
f = 100 Hz, C
OUT
= 1 µF, I
L
= 50 mA,
V
INAC
= 100 mV pk-pk, C
IN
= 0 µF,
V
R
= 1.2V
V
IN
= V
R
+ 1, I
L
= 100 µA
T
SD
—
140
—
°C
7:
The minimum V
IN
must meet two conditions: V
IN
≥
2.3V and V
IN
≥ (V
R
+ 3.0%)
+V
DROPOUT
.
V
R
is the nominal regulator output voltage. For example: V
R
= 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, 5.0V. The
input voltage (V
IN
= V
R
+ 1.0V); I
OUT
= 100 µA.
TCV
OUT
= (V
OUT-HIGH
- V
OUT-LOW
) *10
6
/ (V
R
*
ΔTemperature),
V
OUT-HIGH
= highest voltage measured over the
temperature range. V
OUT-LOW
= lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
OUT
.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with a V
R
+ 1V differential applied.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
TEMPERATURE SPECIFICATIONS
Electrical Characteristics:
Unless otherwise specified, all limits are established for V
IN
= V
R
+ 1, I
LOAD
= 100 µA,
C
OUT
= 1 µF (X7R), C
IN
= 1 µF (X7R), T
A
= +25°C.
Boldface
type applies for junction temperatures, T
J
(Note 1)
of -40°C to +125°C.
Parameters
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistance
Thermal Resistance, SOT-23
θ
JA
θ
JA
θ
JA
—
—
Thermal Resistance, SOT-89
Thermal Resistance, TO-92
Note 1:
—
—
336
230
52
131.9
—
—
—
—
°C/W
°C/W
°C/W
°C/W
Minimum Trace Width Single Layer
Board
Typical FR4 4-layer Application
Typical, 1 square inch of copper
EIA/JEDEC JESD51-751-7
4-Layer Board
T
A
T
A
T
A
-40
-40
-65
+125
+125
+150
°C
°C
°C
Sym
Min
Typ
Max
Units
Conditions
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
A
, T
J
,
θ
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
DS21826B-page 4
©
2007 Microchip Technology Inc.
MCP1700
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Unless otherwise indicated: V
R
= 1.8V, C
OUT
= 1 µF Ceramic (X7R), C
IN
= 1 µF Ceramic (X7R), I
L
= 100 µA,
T
A
= +25°C, V
IN
= V
R
+ V.
Note:
Junction Temperature (T
J
) is approximated by soaking the device under test to an ambient temperature equal to the desired junction
temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.
3.0
1.206
Quiescent Current (µA)
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
V
R
= 1.2V
I
OUT
= 0 µA
T
J
= +125°C
1.204
T
J
= +125°C
V
R
= 1.2V
I
OUT
= 0.1 mA
Output Voltage (V)
1.202
1.200
1.198
1.196
1.194
1.192
1.190
T
J
= - 40°C
T
J
= +25°C
T
J
= - 40°C
T
J
= +25°C
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
2
2.5
3
3.5
4
4.5
5
5.5
6
Input Voltage (V)
Input Voltage (V)
FIGURE 2-1:
Input Voltage.
50
45
Input Quiescent Current vs.
FIGURE 2-4:
Output Voltage vs. Input
Voltage (V
R
= 1.2V).
1.8
V
R
= 1.8V
I
OUT
= 0.1 mA
V
R
= 2.8V
T
J
= +25°C
T
J
= +125°C
Ground Current (µA)
35
30
25
20
15
10
5
0
0
25
50
Output Voltage (V)
40
1.795
1.79
T
J
= - 40°C
1.785
1.78
1.775
1.77
T
J
= - 40°C
T
J
= +125°C
T
J
= +25°C
75
100
125
150
175
200
225
250
2
2.5
3
3.5
4
4.5
5
5.5
6
Load Current (mA)
Input Voltage (V)
FIGURE 2-2:
Current.
2.50
Ground Current vs. Load
FIGURE 2-5:
Output Voltage vs. Input
Voltage (V
R
= 1.8V).
2.800
2.798
2.796
2.794
2.792
2.790
2.788
2.786
2.784
2.782
2.780
2.778
T
J
= +125°C
T
J
= - 40°C
T
J
= +25°C
V
R
= 2.8V
I
OUT
= 0.1 mA
Quiscent Current (µA)
V
R
= 5.0V
2.00
1.75
1.50
1.25
-40
-25
-10
5
20
35
50
65
80
95
110 125
V
R
= 1.2V
V
R
= 2.8V
Output Voltage (V)
2.25
V
IN
= V
R
+ 1V
I
OUT
= 0 µA
3.3
3.6
3.9
4.2
4.5
4.8
5.1
5.4
5.7
6
Junction Temperature (°C)
Input Voltage (V)
FIGURE 2-3:
Quiescent Current vs.
Junction Temperature.
FIGURE 2-6:
Output Voltage vs. Input
Voltage (V
R
= 2.8V).
©
2007 Microchip Technology Inc.
DS21826B-page 5
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