19-5002; Rev 0; 10/09
SiGe, High-Linearity, 2300MHz to 4000MHz
Upconversion/Downconversion Mixer with LO Buffer
General Description
The MAX2044 single, high-linearity upconversion/down-
conversion mixer provides +32.5dBm input IP3, 8.5dB
noise figure, and 7.7dB conversion loss for 2300MHz
to 4000MHz LTE, WiMAXK, and MMDS wireless infra-
structure applications. With an ultra-wide 2600MHz to
4300MHz LO frequency range, the MAX2044 can be
used in either low-side or high-side LO injection archi-
tectures for virtually all 2.5GHz and 3.5GHz applications.
In addition to offering excellent linearity and noise
performance, the MAX2044 also yields a high level of
component integration. This device includes a double-
balanced passive mixer core, an LO buffer, and on-chip
baluns that allow for single-ended RF and LO inputs.
The MAX2044 requires a nominal LO drive of 0dBm,
and supply current is typically 138mA at V
CC
= 5.0V or
121mA at V
CC
= 3.3V.
The MAX2044 is pin similar with the MAX2029/MAX2031
650MHz to 1000MHz mixers and the MAX2039/MAX2041/
MAX2042 1700MHz to 3000MHz mixers, making this
entire family of up/downconverters ideal for applica-
tions where a common PCB layout is used for multiple
frequency bands.
The MAX2044 is available in a compact 20-pin thin QFN
(5mm x 5mm) package with an exposed pad. Electrical
performance is guaranteed over the extended -40NC to
+85NC temperature range.
Features
S
2300MHz to 4000MHz RF Frequency Range
S
2600MHz to 4300MHz LO Frequency Range
S
50MHz to 500MHz IF Frequency Range
S
7.7dB Conversion Loss
S
8.5dB Noise Figure
S
+32.5dBm Typical Input IP3
S
21dBm Typical Input 1dB Compression Point
S
68dBc Typical 2RF - 2LO Spurious Rejection at
P
RF
= -10dBm
S
Integrated LO Buffer
S
Integrated RF and LO Baluns for Single-Ended
Inputs
S
Low -3dBm to +3dBm LO Drive
S
Pin Similar with the MAX2029/MAX2031 Series
of 650MHz to 1000MHz Mixers and the MAX2039/
MAX2041/MAX2042 Series of 1700MHz to
3000MHz Mixers
S
Single 5.0V or 3.3V Supply
S
External Current-Setting Resistor Provides Option
for Operating Device in Reduced-Power/Reduced-
Performance Mode
MAX2044
Applications
2.5GHz WiMAX and LTE Base Stations
2.7GHz MMDS Base Stations
3.5GHz WiMAX and LTE Base Stations
Fixed Broadband Wireless Access
Wireless Local Loop
Private Mobile Radios
Military Systems
PART
MAX2044ETP+
MAX2044ETP+T
Ordering Information
TEMP RANGE
-40NC to +85NC
-40NC to +85NC
PIN-PACKAGE
20 Thin QFN-EP*
20 Thin QFN-EP*
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
T = Tape and reel.
WiMAX is a trademark of WiMAX Forum.
_______________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
SiGe, High-Linearity, 2300MHz to 4000MHz
Upconversion/Downconversion Mixer with LO Buffer
MAX2044
ABSOLUTE MAXIMUM RATINGS
V
CC
to GND..........................................................-0.3V to +5.5V
IF+, IF-, LOBIAS to GND .......................... -0.3V to (V
CC
+ 0.3V)
RF, LO Input Power ....................................................... +20dBm
RF, LO Current (RF and LO is DC shorted
to GND through a balun)................................... .............50mA
Continuous Power Dissipation (Note 1) .................................5W
B
JA
(Notes 2, 3) ............................................................ +38NC/W
B
JC
(Notes 1, 3) ............................................................ +13NC/W
Operating Case Temperature
Range (Note 4) ..................................... T
C
= -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Note 1:
Based on junction temperature T
J
= T
C
+ (B
JC
x V
CC
x I
CC
). This formula can be used when the temperature of the
exposed pad is known while the device is soldered down to a PCB. See the
Applications Information
section for details.
The junction temperature must not exceed +150NC.
Note 2:
Junction temperature T
J
= T
A
+ (B
JA
x V
CC
x I
CC
). This formula can be used when the ambient temperature of the PCB is
known. The junction temperature must not exceed +150NC.
Note 3:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Note 4:
T
C
is the temperature on the exposed pad of the package. T
A
is the ambient temperature of the device and PCB.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit,
V
CC
= 4.75V to 5.25V, no input RF or LO signals. T
C
= -40NC to +85NC, unless otherwise noted. Typical
values are at V
CC
= 5.0V, T
C
= +25NC, all parameters are production tested.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V
CC
I
CC
CONDITIONS
MIN
4.75
TYP
5.0
138
MAX
5.25
155
UNITS
V
mA
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit,
V
CC
= 3.0V to 3.6V, no input RF or LO signals. T
C
= -40NC to +85NC, unless otherwise noted. Typical
values are at V
CC
= 3.3V, T
C
= +25NC, parameters are guaranteed by design, unless otherwise noted.)
PARAMETER
Supply Voltage
Supply Current
SYMBOL
V
CC
I
CC
Total supply current, V
CC
= 3.3V
CONDITIONS
MIN
3.0
TYP
3.3
121
MAX
3.6
135
UNITS
V
mA
RECOMMENDED AC OPERATING CONDITIONS
PARAMETER
SYMBOL
CONDITIONS
Typical Application Circuit
with C1 = 3.3nH
and C12 = 0.3pF, see Table 1 for details
(Note 5)
Typical Application Circuit
with C1 = 8.2pF
and C12 not installed, see Table 1 for
details (Note 5)
(Note 5)
Using an M/A-Com MABAES0029 1:1
transformer as defined in the
Typical
Application Circuit,
IF matching
components affect the IF frequency range
(Note 5)
(Note 5)
MIN
2300
TYP
MAX
3000
MHz
3000
2600
4000
4300
MHz
UNITS
RF Frequency Range
f
RF
LO Frequency
f
LO
IF Frequency
f
IF
50
500
MHz
LO Drive
2
P
LO
-3
0
+3
dBm
______________________________________________________________________________________
SiGe, High-Linearity, 2300MHz to 4000MHz
Upconversion/Downconversion Mixer with LO Buffer
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (DOWNCONVERTER MODE,
f
RF
= 3100MHz to 3900MHz, LOW-SIDE LO INJECTION)
(Typical
Application Circuit
with tuning elements outlined in
Table 1,
V
CC
= 4.75V to 5.25V, RF and LO ports are driven from 50I
sources, P
LO
= -3dBm to +3dBm, P
RF
= 0dBm, f
RF
= 3100MHz to 3900MHz, f
LO
= 2800MHz to 3600MHz, f
IF
= 300MHz, f
RF
> f
LO
,
T
C
= -40NC to +85NC. Typical values are at V
CC
= 5.0V, P
RF
= 0dBm, P
LO
= 0dBm, f
RF
= 3500MHz, f
LO
= 3200MHz, f
IF
= 300MHz,
T
C
= +25NC. All parameters are guaranteed by design, unless otherwise noted.) (Note 6)
PARAMETER
Conversion Loss
SYMBOL
L
C
CONDITIONS
T
C
= +25NC (Notes 7, 8)
f
RF
= 3100MHz to 3900MHz, over any
100MHz band
f
RF
= 3100MHz to 3900MHz, over any
200MHz band
f
RF
= 3100MHz to 3900MHz,
T
C
= -40NC to +85NC
(Note 9)
f
RF1
- f
RF2
= 1MHz, P
RF
= 0dBm per tone
(Note 7, 8)
IIP3
f
RF
= 3500MHz, f
RF1
- f
RF2
= 1MHz,
P
RF
= 0dBm per tone. T
C
= +25NC
(Notes 7, 8)
f
RF
= 3100MHz to 3900MHz, f
IF
= 300MHz,
f
RF1
- f
RF2
= 1MHz, P
RF
= 0dBm per tone,
T
C
= -40NC to +85NC
Single sideband, no blockers present
(Notes 7, 10)
Single sideband, no blockers present,
T
C
= +25NC (Notes 7, 10)
Single sideband, no blockers present,
T
C
= -40NC to +85NC
+8dBm blocker tone applied to RF port,
f
BLOCKER
= 3750MHz, f
RF
= 3500MHz,
f
LO
= 3200MHz, P
LO
= 0dBm, V
CC
= 5.0V,
T
C
= +25NC (Notes 7, 10, 11)
f
SPUR
= f
LO
+
150MHz,
T
C
= +25NC
f
SPUR
= f
LO
+
150MHz
P
RF
= -10dBm
(Notes 7, 10)
P
RF
= 0dBm (Notes 7, 8)
P
RF
= -10dBm
(Notes 7, 10)
P
RF
= 0dBm (Notes 7, 8)
62
52
60
50
28.3
30.0
MIN
7.2
TYP
7.7
0.15
dB
0.25
0.01
21
32.5
dBm
32.5
dB/NC
dBm
MAX
8.5
UNITS
dB
MAX2044
Loss Variation vs. Frequency
DL
C
Conversion Loss Temperature
Coefficient
Input Compression Point
TC
CL
IP
1dB
Third-Order Input Intercept
Point
Third-Order Input Intercept
Point Variation Over
Temperature
±0.5
dBm
8.5
8.5
0.018
10
dB
9.2
dB/NC
Noise Figure
NF
SSB
Noise Figure Temperature
Coefficient
Noise Figure Under Blocking
Conditions
TC
NF
NF
B
17.5
20
dB
68
58
68
58
dBc
2RF - 2LO Spurious Rejection
2x2
_______________________________________________________________________________________
3
SiGe, High-Linearity, 2300MHz to 4000MHz
Upconversion/Downconversion Mixer with LO Buffer
MAX2044
5.0V SUPPLY AC ELECTRICAL CHARACTERISTICS (DOWNCONVERTER MODE,
f
RF
= 3100MHz to 3900MHz, LOW-SIDE LO INJECTION) (continued)
(Typical
Application Circuit
with tuning elements outlined in
Table 1,
V
CC
= 4.75V to 5.25V, RF and LO ports are driven from 50I
sources, P
LO
= -3dBm to +3dBm, P
RF
= 0dBm, f
RF
= 3100MHz to 3900MHz, f
LO
= 2800MHz to 3600MHz, f
IF
= 300MHz, f
RF
> f
LO
,
T
C
= -40NC to +85NC. Typical values are at V
CC
= 5.0V, P
RF
= 0dBm, P
LO
= 0dBm, f
RF
= 3500MHz, f
LO
= 3200MHz, f
IF
= 300MHz,
T
C
= +25NC. All parameters are guaranteed by design, unless otherwise noted.) (Note 6)
PARAMETER
SYMBOL
f
SPUR
= f
LO
+
100MHz,
T
C
= +25NC
f
SPUR
= f
LO
+
100MHz
RF Input Return Loss
LO Input Return Loss
IF Output Impedance
RL
RF
RL
LO
Z
IF
CONDITIONS
P
RF
= -10dBm
(Notes 7, 10)
P
RF
= 0dBm (Notes 7, 8)
P
RF
= -10dBm
(Notes 7, 10)
P
RF
= 0dBm (Notes 7, 8)
MIN
82
62
81
61
TYP
89
69
89
69
16
14
50
dB
dB
I
dBc
MAX
UNITS
3RF - 3LO Spurious Rejection
3x3
LO on and IF terminated into a matched
impedance
RF and IF terminated into a matched
impedance
Nominal differential impedance at the IC’s
IF outputs
RF terminated into 50I, LO driven by a
50I source, IF transformed to 50I using
external components shown in the
Typical
Application Circuit
f
RF
= 3500MHz, P
LO
= +3dBm (Note 8)
f
LO
= 2500MHz to 4000MHz, P
LO
= +3dBm
(Notes 7, 8)
P
LO
= +3dBm
P
LO
= +3dBm (Note 8)
33
IF Output Return Loss
RL
IF
16
dB
RF-to-IF Isolation
LO Leakage at RF Port
2LO Leakage at RF Port
LO Leakage at IF Port
42
-31
-35
-28
dB
dBm
dBm
dBm
4
______________________________________________________________________________________
SiGe, High-Linearity, 2300MHz to 4000MHz
Upconversion/Downconversion Mixer with LO Buffer
3.3V SUPPLY AC ELECTRICAL CHARACTERISTICS (DOWNCONVERTER MODE,
f
RF
= 3100MHz to 3900MHz, LOW-SIDE LO INJECTION)
(Typical
Application Circuit
with tuning elements outlined in
Table 1,
RF and LO ports are driven from 50I sources. Typical values
are at V
CC
= 3.3V, P
RF
= 0dBm, P
LO
= 0dBm, f
RF
= 3500MHz, f
LO
= 3200MHz, f
IF
= 300MHz, T
C
= +25NC, unless otherwise noted.)
(Note 6)
PARAMETER
Conversion Loss
Loss Variation vs. Frequency
Conversion Loss Temperature
Coefficient
Input Compression Point
Third-Order Input Intercept
Point
Third-Order Input Intercept
Variation Over Temperature
Noise Figure
Noise Figure Temperature
Coefficient
2RF - 2LO Spurious Rejection
3RF - 3LO Spurious Rejection
RF Input Return Loss
LO Input Return Loss
IF Output Impedance
NF
SSB
TC
NF
2x2
3x3
RL
RF
RL
LO
Z
IF
SYMBOL
L
C
DL
C
TC
CL
IP
1dB
IIP3
f
RF
= 3100MHz to 3900MHz, over any
100MHz band
f
RF
= 3100MHz to 3900MHz,
T
C
= -40NC to +85NC
(Note 9)
f
RF1
- f
RF2
= 1MHz, P
RF
= 0dBm per tone
f
RF1
- f
RF2
= 1MHz, P
RF
= 0dBm per tone,
T
C
= -40NC to +85NC
Single sideband, no blockers present
Single sideband, no blockers present,
T
C
= -40NC to +85NC
f
SPUR
= f
LO
+
150MHz
f
SPUR
= f
LO
+
100MHz
P
RF
= -10dBm
P
RF
= 0dBm
P
RF
= -10dBm
P
RF
= 0dBm
CONDITIONS
MIN
TYP
7.7
0.1
0.009
19.5
29.5
±0.2
8.5
0.018
69
64
73.3
63.3
18
19
50
MAX
UNITS
dB
dB
dB/NC
dBm
dBm
dB
dB
dB/NC
dBc
dBc
dB
dB
I
MAX2044
LO on and IF terminated into a matched
impedance
RF and IF terminated into a matched
impedance
Nominal differential impedance at the IC’s
IF outputs
RF terminated into 50I, LO driven by a
50I source, IF transformed to 50I using
external components shown in the
Typical
Application Circuit
f
RF
= 3100MHz to 3900MHz,
P
LO
= +3dBm
f
LO
= 2800MHz to 3600MHz,
P
LO
= +3dBm
f
LO
= 2800MHz to 3600MHz,
P
LO
= +3dBm
f
LO
= 2800MHz to 3600MHz,
P
LO
= +3dBm
IF Output Return Loss
RL
IF
14.5
dB
RF-to-IF Isolation
LO Leakage at RF Port
2LO Leakage at RF Port
LO Leakage at IF Port
41
-30
-25.6
-27
dB
dBm
dBm
dBm
_______________________________________________________________________________________
5
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