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SMAJ5920BE3

产品描述Zener Diode, 6.2V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AC, DO-214BA, SMAJ, 2 PIN
产品类别分立半导体    二极管   
文件大小443KB,共6页
制造商Microsemi
官网地址https://www.microsemi.com
标准
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SMAJ5920BE3概述

Zener Diode, 6.2V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AC, DO-214BA, SMAJ, 2 PIN

SMAJ5920BE3规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microsemi
包装说明R-PDSO-J2
Reach Compliance Codecompliant
ECCN代码EAR99
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JESD-30 代码R-PDSO-J2
JESD-609代码e3
湿度敏感等级1
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散3 W
标称参考电压6.2 V
表面贴装YES
技术ZENER
端子面层Matte Tin (Sn) - annealed
端子形式J BEND
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差5%
工作测试电流60.5 mA
Base Number Matches1

文档预览

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SMAJ5913Be3 – SMAJ5956Be3
Compliant
Silicon 3.0 Watt Zener Diode
DESCRIPTION
The SMAJ5913Be3 – SMAJ5956Be3 series of surface mount 3.0 watt Zeners provides voltage
regulation in a selection from 3.3 to 200 volts with different tolerances as identified by suffix letter
on the part number. It is equivalent to the JEDEC registered 1N5913B through 1N5956B series
with identical electrical characteristics except it is rated at 3.0 W instead of 1.5 W with the lower
thermal resistance features of this surface mount packaging. These plastic encapsulated Zeners
have a moisture classification of Level 1 with no dry pack required.
.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
Ideal for high-density and low-profile mounting.
Zener voltage available 3.3V to 200V.
Available voltage tolerances are 10%, 5%, 2%, and 1%.
RoHS compliant.
DO-214AC or BA
(SMAJ) Package
Also available in:
DO-41 package
( plastic axial leaded)
1N5913BP – 1N5956BP
DO-216 package
( tabbed surface moun t)
1PMT5913B – 1PMT5956B
APPLICATIONS / BENEFITS
Regulates voltage over a broad range of current and temperature.
Nonsensitive to ESD per MIL-STD-750 method 1020.
High specified maximum current (I
ZM
) with adequately heat sinking.
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
(1)
Thermal Resistance Junction-to-Ambient
Rated Average Power Dissipation @ +25 ºC
(also see derating in
Figure 1)
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJL
R
ӨJA
P
M(AV)
V
F
T
SP
Value
-65 to +150
15
80
3.0
1.2
260
Unit
ºC
ºC/W
ºC/W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see
last page).
RF01130, Rev. A (5/13/13)
©2013 Microsemi Corporation
Page 1 of 6
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