Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | BGA |
| 包装说明 | TFBGA, |
| 针数 | 208 |
| 制造商包装代码 | SOT-950-1 |
| Reach Compliance Code | compli |
| 具有ADC | YES |
| 地址总线宽度 | 24 |
| 位大小 | 32 |
| 最大时钟频率 | 24 MHz |
| DAC 通道 | YES |
| DMA 通道 | YES |
| 外部数据总线宽度 | 32 |
| JESD-30 代码 | S-PBGA-B208 |
| JESD-609代码 | e1 |
| 长度 | 15 mm |
| 湿度敏感等级 | 2 |
| I/O 线路数量 | 160 |
| 端子数量 | 208 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| ROM可编程性 | MROM |
| 座面最大高度 | 1.2 mm |
| 速度 | 72 MHz |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 15 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| Base Number Matches | 1 |
| LPC2460FET208 | LPC2420 | LPC2420FBD208 | LPC2420_09 | LPC2420FET208 | LPC2460FBD208 | LPC2460 | |
|---|---|---|---|---|---|---|---|
| 描述 | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface | Flashless 16-bit/32-bit microcontroller; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | - | 符合 | - | 符合 | 符合 | - |
| 零件包装代码 | BGA | - | QFP | - | BGA | QFP | - |
| 包装说明 | TFBGA, | - | LFQFP, | - | TFBGA, | LFQFP, | - |
| 针数 | 208 | - | 208 | - | 208 | 208 | - |
| Reach Compliance Code | compli | - | compli | - | unknow | compli | - |
| 具有ADC | YES | - | YES | - | YES | YES | - |
| 地址总线宽度 | 24 | - | 24 | - | 24 | 24 | - |
| 位大小 | 32 | - | 16 | - | 16 | 32 | - |
| 最大时钟频率 | 24 MHz | - | 24 MHz | - | 24 MHz | 24 MHz | - |
| DAC 通道 | YES | - | YES | - | YES | YES | - |
| DMA 通道 | YES | - | YES | - | YES | YES | - |
| 外部数据总线宽度 | 32 | - | 32 | - | 32 | 32 | - |
| JESD-30 代码 | S-PBGA-B208 | - | S-PQFP-G208 | - | S-PBGA-B208 | S-PQFP-G208 | - |
| JESD-609代码 | e1 | - | e3 | - | e1 | e3 | - |
| 长度 | 15 mm | - | 28 mm | - | 15 mm | 28 mm | - |
| 湿度敏感等级 | 2 | - | 2 | - | 2 | 2 | - |
| I/O 线路数量 | 160 | - | 160 | - | 160 | 160 | - |
| 端子数量 | 208 | - | 208 | - | 208 | 208 | - |
| 最高工作温度 | 85 °C | - | 85 °C | - | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | - |
| PWM 通道 | YES | - | YES | - | YES | YES | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TFBGA | - | LFQFP | - | TFBGA | LFQFP | - |
| 封装形状 | SQUARE | - | SQUARE | - | SQUARE | SQUARE | - |
| 封装形式 | GRID ARRAY, THIN PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | - | GRID ARRAY, THIN PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | - |
| 峰值回流温度（摄氏度） | 260 | - | 260 | - | 260 | 260 | - |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.2 mm | - | 1.6 mm | - | 1.2 mm | 1.6 mm | - |
| 速度 | 72 MHz | - | 72 MHz | - | 72 MHz | 72 MHz | - |
| 最大供电电压 | 3.6 V | - | 3.6 V | - | 3.6 V | 3.6 V | - |
| 最小供电电压 | 3 V | - | 3 V | - | 3 V | 3 V | - |
| 标称供电电压 | 3.3 V | - | 3.3 V | - | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | - | YES | - | YES | YES | - |
| 技术 | CMOS | - | CMOS | - | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | Tin (Sn) | - | TIN SILVER COPPER | Tin (Sn) | - |
| 端子形式 | BALL | - | GULL WING | - | BALL | GULL WING | - |
| 端子节距 | 0.8 mm | - | 0.5 mm | - | 0.8 mm | 0.5 mm | - |
| 端子位置 | BOTTOM | - | QUAD | - | BOTTOM | QUAD | - |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | - | 30 | 30 | - |
| 宽度 | 15 mm | - | 28 mm | - | 15 mm | 28 mm | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | - | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | - |
| Base Number Matches | 1 | - | 1 | - | 1 | 1 | - |
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