TAN504
Features
Package
Through-hole IRED/Right Angle Type
φ
3.6 Right Angle type, Water clear epoxy
Product features
・
High Total Power : 11mW TYP. (I
F
=50mA)
・
Lead–free soldering compatible
・
RoHS compliant
Peak Wavelength
Half Intensity Angle
Die materials
Rank grouping parameter
Soldering methods
940nm
50 deg.
GaAs
Sorted by radiant intensity per rank taping
TTW (Through The Wave) soldering and manual soldering
※
Please refer to Soldering Conditions about soldering.
2kV (HBM)
Bulk : 200pcs(MIN.)
ESD
Packing
Recommended Applications
Electric Household Appliances, OA/FA, PC/Peripheral Equipment, Other General Applications
2012.11.15
Page 1
TAN504
Through-hole IRED/Right Angle Type
Abs olute Maximum R atings
Ite m
P owe r Dissipa tion
F orw a rd Curre nt
P ulse F orwa rd Curre nt
De ra ting
(T a =25
℃
or hig he r)
Re ve rse Volta g e
Ope ra ting T e mpe ra ture
S tora g e T e mpe ra ture
※
1
(Ta=25
℃
)
Absolute Ma x imum Ra ting s
160
100
1,000
1.33
13.3
5
-30~ +85
-30~ +100
Unit
mW
mA
mA
mA/
℃
mA/
℃
V
℃
℃
S ymbol
Pd
I
F
I
F R M
⊿
I
F
⊿
I
F R M
V
R
T
o pr
T
s tg
※
1 IF RM Me a sure me nt condition : P ulse Width
≦
100
μ
s, Duty
≦
1/100
E lectro- Optical Characteris tics
Ite m
S ymbol
Cha ra cte ristics
T YP .
MAX .
MAX .
MIN.
T YP .
T YP .
T YP .
T YP .
T YP .
T YP .
1.3
1.45
10
4.2
8.5
11
940
50
50
1000
Unit
(Ta=25
℃
)
Conditions
I
F
=50mA
V
R
=5V
I
F
=50mA
I
F
=50mA
I
F
=50mA
I
F
=50mA
I
F
=50mA
I
F
=50mA
F orwa rd Volta g e
Re ve rse Curre nt
Ra dia nt Inte nsity
T ota l Output P ow e r
P e a k Wa ve le ng th
S pe ctra l Ha lf-width
Ha lf Inte nsity Ang le
Re sponse T ime
V
F
I
R
I
E
Po
λ
p
⊿λ
2
θ
1/2
tr/tf
V
μ
A
mW/sr
mW
nm
nm
de g .
ns
2012.11.15
Page 2
TAN504
Through-hole IRED/Right Angle Type
Radiant Intensity Rank
I
E
（mW/s
r）
Rnak
MIN.
A
B
C
D
E
4.2
6.0
8.4
12.0
16.8
MAX .
8.4
12.0
16.8
24.0
33.6
I
F
= 50mA
Condition
(Ta=25
℃
)
※
Please contact our sales staff concerning rank designation.
2012.11.15
Page 3
TAN504
Through-hole IRED/Right Angle Type
Technical Data
Spectral Distribution
Relative Intensity vs. Wavelength
Condition : Ta = 25℃, I
F
= 50mA
Spatial Distribution Example
1.2
Condition : Ta = 25℃
1
Relative Intensity
0.8
0.6
0.4
0.2
0
800
850
900
950
1000
1050
1100
Wavelength [nm]
Forward Voltage vs. Forward Current
Condition : Ta = 25℃
Duty Ratio vs. Pulse Forward Current
Condition : Ta = 25℃, tw
≦
100μs
100
10000
Pulse Forward Current I
FRM
(mA)
Forward Current I
F
(mA)
1000
10
100
1
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Forward Voltage : V
F
(V)
10
1.E-03
1.E-02
Duty Ratio
1.E-01
1.E+00
2012.11.15
Page 4
TAN504
Through-hole IRED/Right Angle Type
Technical Data
Power Dissipation vs. Ambient Temperature
Derating
180
160
Power Dissipation : Pd (mW)
Maximum Forward Current : I
F
MAX. (mA)
1200
1000
800
600
Ambient Temperature vs. Maximum Forward Curren
Pulse Width tw≦100μsec
Duty=1%
140
120
100
80
60
40
20
0
-30
-10
10
30
50
70
90
Duty=5%
400
200
0
-30
-10
Duty=10%
Duty=20%
Duty=50%
DC
10
30
50
70
90
Ambient Temperature : Ta(℃)
Ambient Temperature : Ta(℃)
Ambient Temperature vs. Forward Voltage
Condition : I
F
= 50mA
Ambient Temperature vs. Peak Wavelength
Condition : I
F
= 50mA
1.6
1.5
1.4
1.3
1.2
1.1
1.0
-40
10
60
110
Ambient Temperature : Ta (℃)
Peak Wavelength
λp
(nm)
970
960
950
940
930
920
910
-40
-20
0
20
40
60
80
100
Ambient Temperature : Ta(℃)
2012.11.15
Forward Voltage V
F
(V)
Page 5
stm32/stm8
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