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T491X107M025AG

产品描述Tantalum Capacitor, Polarized, Tantalum (dry/solid), 25V, 20% +Tol, 20% -Tol, 100uF, Surface Mount, 2917, CHIP
产品类别无源元件    电容器   
文件大小1MB,共24页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准  
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T491X107M025AG概述

Tantalum Capacitor, Polarized, Tantalum (dry/solid), 25V, 20% +Tol, 20% -Tol, 100uF, Surface Mount, 2917, CHIP

T491X107M025AG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称KEMET(基美)
包装说明CHIP
Reach Compliance Codecompliant
ECCN代码EAR99
其他特性ESR AND RIPPLE CURRENT IS MEASURED AT 100KHZ
电容100 µF
电容器类型TANTALUM CAPACITOR
介电材料TANTALUM (DRY/SOLID)
ESR300 mΩ
高度4 mm
JESD-609代码e4
漏电流0.025 mA
长度7.3 mm
安装特点SURFACE MOUNT
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
封装形式SMT
包装方法TR, EMBOSSED PLASTIC, 7 INCH
极性POLARIZED
正容差20%
额定(直流)电压(URdc)25 V
纹波电流297 mA
尺寸代码2917
表面贴装YES
Delta切线0.08
端子面层Gold (Au)
端子形状J BEND
宽度4.3 mm
Base Number Matches1

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Tantalum Surface Mount Capacitors – Standard Tantalum
T491 Industrial Grade MnO
2
Series
Overview
The KEMET T491 Series, designed specifically for today’s highly
automated surface mount processes and equipment, is the
leading choice for surface mount designs. The T491 combines
KEMET’s proven solid tantalum technology, acclaimed and
respected throughout the world, with the latest in materials,
processes and automation, resulting in unsurpassed total
performance and value.
This product meets or exceeds the requirements of EIA Standard
535BAAC. The physical outline and dimensions of this series
conform to this global standard. Five low profile case sizes are
available in the T491 Series. The R/2012–12, S/3216–12 and
T/3528–12 case sizes have a maximum height of 1.2 mm. The
U/6032–15 size has a maximum height of 1.5 mm, and the
V/7343–20 has a maximum height of 2.0 mm.
The T491 standard terminations are 100% matte tin and provide
excellent wetting characteristics and compatibility with today's
surface mount solder systems. Tin/lead (Sn/Pb) terminations
are available upon request for any part number. Gold-plated
terminations are also available for use with conductive epoxy
attachment processes. The symmetrical terminations offer total
compliancy to provide the thermal and mechanical stress relief
required with today's technology. Lead frame attachments to the
tantalum pellet are made via a microprocessor-controlled welding
operation, and a high temperature silver epoxy adhesive system.
Standard packaging of these devices is tape and reel in
accordance with EIA 481–1. This system provides perfect
compatibility with all tape-fed placement units.
Benefits
Meets or exceeds EIA Standard 535BAAC
Taped and reeled per EIA 481–1
Symmetrical, compliant terminations
Optional gold-plated terminations
Laser-marked case
100% surge current test on C, D, E, U, V, X sizes
Halogen free epoxy
Capacitance 0.1
µF
to 1,000
µF
Tolerance ±10%, ±20%
Voltage 2.5 – 50 VDC
Extended range values
Low profile case sizes
RoHS Compliant and lead-free terminations
(See www.kemet.com for transition information)
• Operating temperature: -55ºC to +125ºC
Applications
Typical applications include decoupling and filtering in industrial
and automotive end applications such as DC/DC converters,
portable electronics, telecommunications, and control units.
Environmental Compliance
RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder.
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
T2005_T491 • 10/8/2013
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