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SST39WF800B-70-4C-MAQE

产品描述Flash, 512KX16, 70ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48
产品类别存储    存储   
文件大小881KB,共26页
制造商Silicon Laboratories Inc
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SST39WF800B-70-4C-MAQE概述

Flash, 512KX16, 70ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48

SST39WF800B-70-4C-MAQE规格参数

参数名称属性值
厂商名称Silicon Laboratories Inc
零件包装代码DSBGA
包装说明VFBGA,
针数48
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间70 ns
JESD-30 代码R-PBGA-B48
长度6 mm
内存密度8388608 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
端子数量48
字数524288 words
字数代码512000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512KX16
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行PARALLEL
编程电压1.8 V
认证状态Not Qualified
座面最大高度0.73 mm
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.65 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
宽度4 mm
Base Number Matches1

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8 Mbit (x16) Multi-Purpose Flash
SST39WF800B
Data Sheet
FEATURES:
• Organized as 512K x16
• Single Voltage Read and Write Operations
– 1.65-1.95V
• Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
• Low Power Consumption (typical values at 5 MHz)
– Active Current: 5 mA (typical)
– Standby Current: 5 µA (typical)
• Sector-Erase Capability
– Uniform 2 KWord sectors
• Block-Erase Capability
– Uniform 32 KWord blocks
• Fast Read Access Time
– 70 ns
• Latched Address and Data
• Fast Erase and Word-Program
– Sector-Erase Time: 36 ms (typical)
– Block-Erase Time: 36 ms (typical)
– Chip-Erase Time: 140 ms (typical)
– Word-Program Time: 28 µs (typical)
• Automatic Write Timing
– Internal V
PP
Generation
• End-of-Write Detection
– Toggle Bit
– Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 48-ball TFBGA (6mm x 8mm)
– 48-ball WFBGA (4mm x 6mm) Micro-Package
– 48-ball XFLGA (5mm x 6mm) Micro-Package
– 48-ball XFLGA (4mm x 6mm) Micro-Package
• All non-Pb (lead-free) devices are RoHS compliant
PRODUCT DESCRIPTION
The SST39WF800B is a 512K x16 CMOS Multi-Purpose
Flash (MPF) manufactured with SST proprietary, high-per-
formance CMOS SuperFlash technology. The split-gate
cell design and thick-oxide tunneling injector attain better
reliability and manufacturability compared to alternate
approaches. The SST39WF800B writes (Program or
Erase) with a 1.65-1.95V power supply. This device con-
forms to JEDEC standard pin assignments for x16 memo-
ries.
The SST39WF800B features high-performance Word-Pro-
gramming which provides a typical Word-Program time of
28 µsec. It uses Toggle Bit or Data# Polling to detect the
completion of the Program or Erase operation. On-chip
hardware and software data protection schemes protects
against inadvertent writes. Designed, manufactured, and
tested for a wide spectrum of applications, the
SST39WF800B is offered with a guaranteed typical endur-
ance of 100,000 cycles. Data retention is rated at greater
than 100 years.
The SST39WF800B is suited for applications that require
convenient and economical updating of program, configu-
ration, or data memory. It significantly improves perfor-
mance and reliability of all system applications while
lowering power consumption. It inherently uses less energy
©2009 Silicon Storage Technology, Inc.
S71344-02-000
12/09
1
during Erase and Program than alternative flash technolo-
gies. When programming a flash device, the total energy
consumed is a function of the applied voltage, current, and
time of application. For any given voltage range, Super-
Flash technology uses less current to program and has a
shorter erase time; therefore, the total energy consumed
during any Erase or Program operation is less than alterna-
tive flash technologies. These devices also improve flexibil-
ity while lowering the cost for program, data, and
configuration storage applications.
SuperFlash technology provides fixed Erase and Program
times independent of the number of Erase/Program cycles
that have occurred. Consequently, the system software or
hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
To meet surface mount requirements, the SST39WF800B
is offered in 48-ball TFBGA, 48-ball WFBGA, and a 48-ball
XFLGA packages. See Figures 2 and 3 for pin assign-
ments and Table 2 for pin descriptions.
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST39WF800B-70-4C-MAQE相似产品对比

SST39WF800B-70-4C-MAQE SST39WF800B-70-4C-CAQE SST39WF800B-70-4I-MAQE SST39WF800B-70-4I-CAQE SST39WF800B-70-4C-C2QE SST39WF800B-70-4I-C2QE
描述 Flash, 512KX16, 70ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 Flash, 512KX16, 70ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, XFLGA-48 Flash, 512KX16, 70ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 Flash, 512KX16, 70ns, PBGA48, 4 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-207CZB-4, XFLGA-48 Flash, 512KX16, 70ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-222, XFLGA-48 Flash, 512KX16, 70ns, PBGA48, 5 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-222, XFLGA-48
零件包装代码 DSBGA DSBGA DSBGA DSBGA BGA BGA
包装说明 VFBGA, VFBGA, VFBGA, VFBGA, VFBGA, LGA48,6X11,20 VFBGA, LGA48,6X11,20
针数 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
JESD-30 代码 R-PBGA-B48 R-PBGA-BU48 R-PBGA-B48 R-PBGA-BU48 R-PBGA-BU48 R-PBGA-BU48
长度 6 mm 6 mm 6 mm 6 mm 6 mm 6 mm
内存密度 8388608 bit 8388608 bit 8388608 bit 8388608 bi 8388608 bi 8388608 bi
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16
功能数量 1 1 1 1 1 1
端子数量 48 48 48 48 48 48
字数 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
字数代码 512000 512000 512000 512000 512000 512000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 85 °C 85 °C 70 °C 85 °C
组织 512KX16 512KX16 512KX16 512KX16 512KX16 512KX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA VFBGA VFBGA VFBGA VFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
编程电压 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 0.73 mm 0.52 mm 0.73 mm 0.52 mm 0.52 mm 0.52 mm
最大供电电压 (Vsup) 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V 1.95 V
最小供电电压 (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V 1.65 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL
端子形式 BALL BUTT BALL BUTT BUTT BUTT
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
宽度 4 mm 4 mm 4 mm 4 mm 5 mm 5 mm
厂商名称 Silicon Laboratories Inc - Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc Silicon Laboratories Inc

 
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