HB23C65C-L-000概述

MASK ROM, 8KX8, 600ns, CMOS, CQCC28

HB23C65C-L-000规格参数

参数名称	属性值
厂商名称	Hughes Aircraft
包装说明	,
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	600 ns
JESD-30 代码	S-CQCC-N28
内存密度	65536 bit
内存集成电路类型	MASK ROM
内存宽度	8
功能数量	1
端子数量	28
字数	8192 words
字数代码	8000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	8KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装形状	SQUARE
封装形式	CHIP CARRIER
并行/串行	PARALLEL
认证状态	Not Qualified
最大供电电压 (Vsup)	6.5 V
最小供电电压 (Vsup)	4 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	NO LEAD
端子位置	QUAD
Base Number Matches	1

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HB23C65C-L-000相似产品对比

	HB23C65C-L-000	HB23C65C-H-000	HB23C65C-Y-000	HI23C65C-L-000	HB23C65C-D-000	HI23C65C-H-000	HI23C65C-P-000	HI23C65C-D-000	HI23C65C-Y-000
描述	MASK ROM, 8KX8, 600ns, CMOS, CQCC28	MASK ROM, 8KX8, 600ns, CMOS	MASK ROM, 8KX8, 600ns, CMOS, CDIP28	MASK ROM, 8KX8, 600ns, CMOS, CQCC28	MASK ROM, 8KX8, 600ns, CMOS, CDIP28	MASK ROM, 8KX8, 600ns, CMOS	MASK ROM, 8KX8, 600ns, CMOS, PDIP28	MASK ROM, 8KX8, 600ns, CMOS, CDIP28	MASK ROM, 8KX8, 600ns, CMOS, CDIP28
厂商名称	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft	Hughes Aircraft
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	600 ns	600 ns	600 ns	600 ns	600 ns	600 ns	600 ns	600 ns	600 ns
JESD-30 代码	S-CQCC-N28	X-XUUC-N25	R-GDIP-T28	S-CQCC-N28	R-CDIP-T28	X-XUUC-N25	R-PDIP-T28	R-CDIP-T28	R-GDIP-T28
内存密度	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
内存宽度	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1
端子数量	28	25	28	28	28	25	28	28	28
字数	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
字数代码	8000	8000	8000	8000	8000	8000	8000	8000	8000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	125 °C	125 °C	85 °C	125 °C	85 °C	85 °C	85 °C	85 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
组织	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8	8KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
封装形状	SQUARE	UNSPECIFIED	RECTANGULAR	SQUARE	RECTANGULAR	UNSPECIFIED	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER	UNCASED CHIP	IN-LINE	CHIP CARRIER	IN-LINE	UNCASED CHIP	IN-LINE	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V	6.5 V
最小供电电压 (Vsup)	4 V	4 V	4 V	4 V	4 V	4 V	4 V	4 V	4 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	NO	YES	NO	YES	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子位置	QUAD	UPPER	DUAL	QUAD	DUAL	UPPER	DUAL	DUAL	DUAL

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