T
EM
I C
Semiconductors
Document number
MHS/SCC 021
Date
Issue
Page
23/12/1999
Rev C
Rev C
1 /42
1
PROJECT
SPACE GENERAL
TITLE
INTEGRATED CIRCUIT, SILICON MONOLITHIC CMOS
16 BITS ERROR DETECTION AND CORRECTION UNIT
BASED ON TYPE 29C516 E
T
EM
I C
Semiconductors
Rev.
Letter
Issue 1
Rev A
18/12/97
Document number
MHS/SCC 021
Date
Issue
Page
23/12/1999
Rev C
Rev C
2 /42
2
DOCUMENTATION CHANGE NOTICE
Rev.
Date
Reference
CHANGE
Item
New document
Amendment of fig 2(b), page 11
Correction of para.4.5.3 page 21 (component number)
Amendment of Table 4, page 35
Amendment of table 7, page 41
Rev B
9/01/98
Amendment of para.4.2.2 page 20
Amendment of figure 5 page 37
Amendment of Notes of Table 6, page 39
Amendment of figure 6 page 40
Amendment of Table 7, page 41
Rev C
23/12/99
Amendment of Table 4, page 35
T
EM
I C
Semiconductors
1
GENERAL
Document number
MHS/SCC 021
Date
Issue
Page
23/12/1999
Rev C
TABLE OF CONTENTS
Rev C
3 /42
3
Page
6
6
6
6
6
6
6
6
6
6
6
6
6
6
18
18
20
20
20
20
20
20
20
20
20
20
20
20
20
21
21
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
1.7.
1.8.
1.9.
1.10.
1.11.
1.12.
Scope
Type Variants
Maximum Ratings
Parameter Derating Information
Physical Dimensions
Pin Assignment
Truth Table/Instruction set/ Programming procedure
Circuits Description
Functional Diagram
Handling Precautions (for information only)
Input Protection Network
Bondind diagram
2.
APPLICABLE DOCUMENTS
3
4.
TERMS, DEFINITIONS, ABBREVIATIONS, SYMBOLS AND UNITS
REQUIREMENTS
4.1.
4.2.
4.2.1.
4.2.2.
4.2.3.
4.2.4.
4.2.5.
4.3.
4.3.1.
4.3.2.
4.4.
4.4.1.
4.4.2.
4.4.3.
General
Deviations from ESA / SCC Generic Specification N° 9000
Deviations from Special In-Process Controls
Deviations from Final Productions Tests (Charts II)
Deviations from Burn-in Tests (Chart III)
Deviations from Qualification, Environmental and Endurance Test (Chart IV)
Deviations from Lot Acceptance Tests (Chart V)
Mechanical Requirements
Dimension Check
Weight
Material and Finishes
Case
lead Material and finish
Technology
T
EM
I C
Semiconductors
4.4.4.
4.5.
4.5.1.
4.5.2.
4.5.3.
4.5.4.
4.6.
4.6.1.
4.6.2.
4.6.3.
4.7.
4.7.1.
4.7.2.
4.7.3.
4.8.
4.8.1.
4.8.2.
4.8.3.
4.8.4.
4.8.5.
4.8.6.
4.9.
4.9.1.
4.9.2.
4.9.3.
Die Attachment
Marking
General
Lead Identification
The Component Number
Traceability Information
Electrical Measurements
Document number
MHS/SCC 021
Date
Issue
Page
23/12/1999
Rev C
Rev C
4 /42
4
21
21
21
21
21
22
22
22
22
22
22
22
22
22
38
38
38
38
38
38
38
38
38
38
38
Electrical Measurements at Room Temperature
Electrical Measurements at High and Low Temperature
Circuits for Electrical Measurements
Burn-in Tests
Parameter Drift Values
Conditions for Power Burn-in
Electrical Circuits for Power Burn-in
Environmental and Endurance Tests
Electrical Measurements at Completion of Environmental Tests
Electrical Measurements at Intermediate Point during Endurance Tests
Electrical Measurements on Completion of Endurance Tests
Conditions for Operating Life-Tests
Electrical Circuits for Operating Life-Tests
Condition For High Temperature Storage Test
Total Dose irradiation Testing
Application
Bias Condition
Electrical Measurements
TABLES
1 (a)
1 (b)
1 (c)
2
Type Variants
Maximum Ratings
Dynamic electrical characteristics
Electrical measurements at room Temperature - dc Parameters
Electrical measurements at room Temperature
-
ac Parameters
3
Electrical Measurements at High and Low Temperature - dc Parameters
Electrical Measurements at High and Low Temperature
-
ac Parameters
4
5
Parameter Drift Values
Conditions for Power Burn-in and Operating Life-Test
7
7
8
23
24
26
27
35
36
T
EM
I C
Semiconductors
6
7
FIGURES
1
2
3(a)
3(b)
3(c)
3(d)
4
5
6
Document number
MHS/SCC 021
Date
Issue
Page
23/12/1999
Rev C
Rev C
5 /42
5
Electrical measurements at Intermediate Points and on Completion of Endurance
Testing
Electrical measurements During and on Completion of Irradiation Testing
39
41
Parameter Derating Information
Physical Dimensions
Pin Assignment
Functional diagram
Input / Output Protection Network
Bonding Diagram
Circuits for Electrical Measurements
Electrical Circuit for Power Burn-in and Operating Life-Test
Bias Conditions for Irradiation Testing
9
10
13
14
15
16
28
37
40
APPENDICES
(Applicable to Specific Manufacturers only)
'A' AGREED DEVIATION FOR MATRA MHS (F)
42
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