GS816118B(T/D)/GS816132B(D)/GS816136B(T/D)
100-Pin TQFP & 165-Bump BGA
Commercial Temp
Industrial Temp
Features
• FT pin for user-configurable flow through or pipeline
operation
• Single Cycle Deselect (SCD) operation
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard
100-lead TQFP
100-pin TQFP and 165-bump
BGA packages
• RoHS-compliant 100-pin TQFP and 165-bump BGA packages
available
1M x 18, 512K x 32, 512K x 36
18Mb Sync Burst SRAMs
250 MHz–150 MHz
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
Re
co
m
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
me
nd
ed
for
Applications
The GS816118B(T/D)/GS816132B(D)/GS816136B(T/D) is an
18,874,368-bit high performance synchronous SRAM with a 2-bit
burst address counter. Although of a type originally developed for
Level 2 Cache applications supporting high performance CPUs,
the device now finds application in synchronous SRAM
applications, ranging from DSP main store to networking chip set
support.
Ne
w
Parameter Synopsis
-250
t
KQ
tCycle
Curr
(x18)
Curr
(x32/x36)
t
KQ
tCycle
Curr
(x18)
Curr
(x32/x36)
2.5
4.0
295
345
5.5
5.5
225
255
De
sig
Functional Description
No
t
Pipeline
3-1-1-1
Flow Through
2-1-1-1
Rev: 1.05 9/2008
1/35
n—
Di
sco
nt
inu
ed
Pr
od
u
-200
3.0
5.0
245
285
6.5
6.5
200
220
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by the
user via the FT mode pin (Pin 14). Holding the FT mode pin low
places the RAM in Flow Through mode, causing output data to
bypass the Data Output Register. Holding FT high places the
RAM in Pipeline mode, activating the rising-edge-triggered Data
Output Register.
SCD Pipelined Reads
The GS816118B(T/D)/GS816132B(D)/GS816136B(T/D) is a
SCD (Single Cycle Deselect) pipelined synchronous SRAM. DCD
(Dual Cycle Deselect) versions are also available. SCD SRAMs
pipeline deselect commands one stage less than read commands.
SCD RAMs begin turning off their outputs immediately after the
deselect command has been captured in the input registers.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion (High)
of the ZZ signal, or by stopping the clock (CK). Memory data is
retained during Sleep mode.
Core and Interface Voltages
The GS816118B(T/D)/GS816132B(D)/GS816136B(T/D)
operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V and
2.5 V compatible. Separate output power (V
DDQ
) pins are used to
decouple output noise from the internal circuits and are 3.3 V and
2.5 V compatible.
-150
3.8
6.7
200
225
7.5
7.5
185
205
Unit
ns
ns
mA
mA
ns
ns
mA
mA
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
© 2004, GSI Technology
GS816118B(T/D)/GS816132B(D)/GS816136B(T/D)
TQFP Pin Description
Symbol
A
0
, A
1
A
DQ
A
DQ
B
DQ
C
DQ
D
NC
BW
B
A
, B
B,
B
C
, B
D
CK
GW
E
1
G
ADV
ADSP, ADSC
ZZ
TMS
TDI
TDO
TCK
FT
LBO
V
DD
V
SS
V
DDQ
Type
I
I
I/O
—
I
I
I
I
I
I
I
I
I
I
I
O
I
I
I
I
I
I
Description
Address field LSBs and Address Counter preset Inputs
Address Inputs
Data Input and Output pins
No Connect
Byte Write—Writes all enabled bytes; active low
Byte Write Enable for DQ
A
, DQ
B
Data I/Os; active low
Clock Input Signal; active high
Chip Enable; active low
Global Write Enable—Writes all bytes; active low
Output Enable; active low
Burst address counter advance enable; active low
Address Strobe (Processor, Cache Controller); active low
De
sig
Ne
w
me
nd
ed
for
Flow Through or Pipeline mode; active low
Linear Burst Order mode; active low
Core power supply
I/O and Core Ground
Output driver power supply
Rev: 1.05 9/2008
No
t
Re
co
m
4/35
n—
Di
sco
nt
inu
ed
Pr
od
u
Sleep Mode control; active high
Scan Test Mode Select
Scan Test Data In
Scan Test Data Out
Scan Test Clock
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
© 2004, GSI Technology
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