A/D Converter, 10-Bit, 1 Func, CDIP28,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Signal Processing Technologies |
| Reach Compliance Code | unknown |
| 最大模拟输入电压 | |
| 转换器类型 | A/D CONVERTER |
| JESD-30 代码 | R-XDIP-T28 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.148% |
| 位数 | 10 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,-5.2 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 表面贴装 | NO |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| SPT7824BMJ/883 | SPT7824AMJ/883 | SPT7824BCU | SPT7824BIC | SPT7824BMQ/883 | SPT7824AIC | |
|---|---|---|---|---|---|---|
| 描述 | A/D Converter, 10-Bit, 1 Func, CDIP28, | A/D Converter, 10-Bit, 1 Func, CDIP28, | ADC, Successive Approximation, 10-Bit, 1 Func, Parallel, Word Access, | ADC, Successive Approximation, 10-Bit, 1 Func, Parallel, Word Access, CQCC28, | A/D Converter, 10-Bit, 1 Func, CQFP44, | ADC, Successive Approximation, 10-Bit, 1 Func, Parallel, Word Access, CQCC28, |
| 厂商名称 | Signal Processing Technologies | Signal Processing Technologies | Signal Processing Technologies | Signal Processing Technologies | Signal Processing Technologies | Signal Processing Technologies |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最大模拟输入电压 | - | - | 3 V | 3 V | 2 V | 3 V |
| 转换器类型 | A/D CONVERTER | A/D CONVERTER | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | A/D CONVERTER | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | R-XDIP-T28 | R-XDIP-T28 | X-XUUC-N28 | S-CQCC-N28 | S-XQFP-G44 | S-CQCC-N28 |
| 位数 | 10 | 10 | 10 | 10 | 10 | 10 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 44 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -25 °C | -55 °C | -25 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 封装主体材料 | CERAMIC | CERAMIC | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DIE | QCCN | QFP | QCCN |
| 封装等效代码 | DIP28,.6 | DIP28,.6 | DIE OR CHIP | LCC28,.45SQ | QFP44,.7SQ,40 | LCC28,.45SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | UNSPECIFIED | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | UNCASED CHIP | CHIP CARRIER | FLATPACK | CHIP CARRIER |
| 电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | YES | YES | YES | YES |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | OTHER | MILITARY | OTHER |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | GULL WING | NO LEAD |
| 端子位置 | DUAL | DUAL | UPPER | QUAD | QUAD | QUAD |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 2.54 mm | 2.54 mm | - | 1.27 mm | 1 mm | 1.27 mm |
| 包装说明 | - | - | DIE, DIE OR CHIP | QCCN, LCC28,.45SQ | QFP, QFP44,.7SQ,40 | QCCN, LCC28,.45SQ |
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