电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HW-13-08-S-D-375-SM-LC

产品描述Board Stacking Connector
产品类别连接器    连接器   
文件大小358KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

HW-13-08-S-D-375-SM-LC概述

Board Stacking Connector

HW-13-08-S-D-375-SM-LC规格参数

参数名称属性值
厂商名称SAMTEC
Reach Compliance Codecompliant
连接器类型BOARD STACKING CONNECTOR
触点性别MALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
MIL 符合性NO
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SURFACE MOUNT
触点总数26
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
REVISION AY
DO NOT
SCALE FROM
THIS PRINT
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
HW-XX-XX-XX-X-XXXX-SM-X-XXX
2. TUBE POSITIONS -05 THRU -36 ONLY; POSITIONS -02
THRU -04 TO BE LAYER PACKAGED.
No OF POSITIONS
OPTION #2
3. MAXIMUM CUT FLASH: .020 [0.51] CUT FLASH TO BE
POLARIZED POSITION
-02 THRU -36
IN A NON-CRITICAL AREA LOCATED BETWEEN BODIES.
SPECIFY OMITTED PIN
4. FOR ADDED MECHANICAL STABILITY, SAMTEC RECOMMENDS
LEAD STYLE
MECHANICAL BOARD SPACERS BE USED IN APPLICATIONS WITH
OPTION #1
(SEE TABLE 1)
GOLD OR SELECTIVE GOLD PLATED CONNECTORS. CONTACT
-LC: LOCKING CLIP (SEE FIG 2, SHT 2)
IPG@SAMTEC.COM FOR MORE INFORMATION.
(-D: USE RTSM-50-DVU, USE LC-05-TM)
PLATING SPECIFICATION
(-S: USE TSM-50-SV BODY, USE LC-08-TM-02)
36
02
-T: MATTE TIN ON CONTACT AND TAIL.
-A: ALIGNMENT PIN (SEE FIG 3, SHT 2)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
(-S: 3 POSITION USE TSM-03-SV-A,
.195 4.95
MATTE TIN ON TAIL.
MUST BE MOLDED TO POSITION)
REF
-G: 10µ" SELECTIVE GOLD IN CONTACT AREA,
(4-50 POSITIONS USE TSM-XX-SV-XX,
3µ" SELECTIVE GOLD ON TAIL.
2 POSITIONS TO USE TSM-48-SV-04)
35
01
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
(-D: FOR MOLDED TO POSITION,
2 MAX SWAY
MATTE TIN ON TAIL.
USE RTSM-50-DVU-XX BODY,
.100 2.54 REF
(EITHER DIRECTION)
-TL: 250µ" TIN/LEAD ON CONTACT AND TAIL.
AVAILABLE ON POS -02 THRU -36)
-H: 30µ" SELECTIVE GOLD IN CONTACT
-S: SINGLE ROW
(-D: FOR STAKED, USE RTSM-50-DVU BODY,
AREA, 3µ" SELECTIVE GOLD ON TAIL.
3 POS MIN)
02
72
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
-TR: TAPE & REEL
MATTE TIN ON TAIL.
(4 THRU 27 POSITIONS ONLY)
-TM: MATTE TIN ON CONTACT AND TAIL.
(MAX HEIGHT: .6875)
.295 7.49
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
LEAVE BLANK FOR NO HOLD DOWN OPTION
REF
MATTE TIN ON TAIL.
(-D: USE RTSM-50-DVU, CAN BE CUT
-LM: 10µ" SELECTIVE GOLD IN CONTACT AREA,
TO POSITION, SEE FIG 1)
MATTE TIN ON TAIL.
(-S: USE TSM-50-SV, CAN BE CUT
01
71
-FM: 3µ" SELECTIVE GOLD IN CONTACT AREA,
TO POSITION, SEE FIG 1)
2 MAX SWAY
MATTE TIN ON TAIL.
.200 5.08 REF
(EITHER DIRECTION)
SURFACE MOUNT
ROW OPTION
FIG 1
-D: DOUBLE ROW
HW-XX-10-XX-X-675-SM SHOWN
(USE RTSM-50-DVU FOR BOTTOM INSULATOR)
BOARD SPACE
(USE WRTSM-50-DVU FOR TOP INSULATOR)
"A" = -XXX
-S: SINGLE ROW
(SEE FIG 1 & TABLE 1)
(USE TSM-XX-S BODY FOR BOTTOM INSULATOR)
MAX= C + .150
(NO OF POS x .100[2.54])
+.000[0.00]
(USE WTSM-50-SV FOR TOP INSULATOR)
- .015[0.38]
(NO OF POS -1) x .100[2.54]
.025 0.64 SQ
REF (TYP)
.100 2.54 REF
C
"B" .000[0.00] MIN
[("C" + .150[3.81]) -A]
.050 1.27
WTSM-50-SV
C
"A"±.008[0.20]
BOARD OPTION
(.250[6.35] MIN)
(SEE TABLE 1)
(MAX = "C" + .150[3.81])
.100 2.54
T-1S6-XX-XX-2
WRTSM-50-DVU
"H" REF
.100 2.54 REF
C
.006[0.15]
90°
- 0°
+5°
RTSM-50-DVU
.050 1.27
TSM-50-SV
-S: SINGLE ROW
*
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
.XX: .01 [0.3]
2
.XXX: .005 [0.13]
.XXXX: .0020 [0.051]
ANGLES
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
*
PROPRIETARY NOTE
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: LCP, UL 94 V0, COLOR: BLACK
TERMINAL: PHOS BRONZE
HW BOARD TO BOARD ASSEMBLY
HW-XX-XX-XX-X-XXXX-SM-X-XXX
BY:
G PURVIS
F:\DWG\MISC\MKTG\HW-XX-XX-XX-X-XXXX-SM-X-XXX-MKT.SLDDRW
03/12/1993
SHEET
1
OF
3
哈哈,好久不动手,竟然忘了如何使用电烙铁
找到了就顺便分享一下啦 电烙铁的使用 --------------------------------------------------------------------------- 12 . 1 焊接工艺 基本要求: ① 熟悉电子产品的安装与焊接工艺; ② ......
456 模拟电子
SLC与MLC NAND FLASH的驱动问题
我看SLC与MLC的DATASHEET没有什么区别 但是驱动程序用于SLC按页读写都正确,用于mlc就不正确,有谁知道用于mlc的驱动程序与用于slc的驱动程序上应该有什么不同之处,谢谢!!!!...
gcj19870623 嵌入式系统
求问WiFi与蓝牙串扰怎么解决
板子上使用的AP6216模块,WiFi连接时开启蓝牙,终端ping百度的响应时间由几十毫秒变为几千毫秒,持续时间好几秒,蓝牙连接后会变稳定,有没有大神遇到类似的情况或者有相关经验,请指教...
xierson 无线连接
【MM32 eMiniBoard测评】+绿植监护器
本帖最后由 jinglixixi 于 2020-12-8 13:28 编辑 起初打算用数字式传感器器设计一个对家居环境检测及提示功能的装置,但其依托的毫秒级和微秒级的延时函数不具备,也就较难实现了,故将设计 ......
jinglixixi 国产芯片交流
迷茫中,嵌入式软件的前途在哪里?
搞了几年的嵌入式软件开发了,各种操作系统下的驱动写了不少,各种操作系统的移植裁减也做了不少了,突然发现没啥可做的了,每天都开始重复性劳动了,除非自己写操作系统去。 前几周郁闷的想去 ......
wangxiongke 嵌入式系统
STEVAL-IDB007V1电池电压检测
今天学习了一下STEVAL-IDB007V1的ADC,在DMA demo基础上实现了电池电压检测。开发板设置如下:JP2需要跳线到BAT这一端 343209 板卡背面需要电池供电: 343210 BlueNRG-1的ADC分为 ......
bkn1860 意法半导体-低功耗射频

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2581  1979  1458  452  569  36  35  44  50  1 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved