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HY29LV320BF-80I

产品描述Flash, 2MX16, 80ns, PBGA63, 7 X 11 MM, FBGA-63
产品类别存储    存储   
文件大小318KB,共44页
制造商SK Hynix(海力士)
官网地址http://www.hynix.com/eng/
下载文档 详细参数 选型对比 全文预览

HY29LV320BF-80I概述

Flash, 2MX16, 80ns, PBGA63, 7 X 11 MM, FBGA-63

HY29LV320BF-80I规格参数

参数名称属性值
厂商名称SK Hynix(海力士)
零件包装代码BGA
包装说明TFBGA, BGA63,8X12,32
针数63
Reach Compliance Codecompliant
ECCN代码3A991.B.1.A
最长访问时间80 ns
启动块BOTTOM
命令用户界面YES
通用闪存接口YES
数据轮询YES
JESD-30 代码R-PBGA-B63
JESD-609代码e1
长度11 mm
内存密度33554432 bit
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模1,2,1,63
端子数量63
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织2MX16
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装等效代码BGA63,8X12,32
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行PARALLEL
电源3/3.3 V
编程电压3 V
认证状态Not Qualified
就绪/忙碌YES
座面最大高度1.2 mm
部门规模8K,4K,16K,32K
最大待机电流0.000005 A
最大压摆率0.03 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
切换位YES
类型NOR TYPE
宽度7 mm
Base Number Matches1

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HY29LV320
32 Mbit (2M x 16) Low Voltage Flash Memory
KEY FEATURES
n
Single Power Supply Operation
– Read, program and erase operations from
2.7 to 3.6 volts
– Ideal for battery-powered applications
High Performance
– 70, 80, 90 and 120 ns access time
versions for full voltage range operation
Ultra-low Power Consumption (Typical/
Maximum Values)
– Automatic sleep/standby current: 0.5/5.0
µA
– Read current: 9/16 mA (@ 5 MHz)
– Program/erase current: 20/30 mA
Top and Bottom Boot Block Versions
– Provide one 8 KW, two 4 KW, one 16 KW
and sixty-three 32 KW sectors
Secured Sector
– An extra 128-word, factory-lockable
sector available for an Electronic Serial
Number and/or additional secured data
Sector Protection
– Allows locking of a sector or sectors to
prevent program or erase operations
within that sector
– Temporary Sector Unprotect allows
changes in locked sectors
Fast Program and Erase Times (typicals)
– Sector erase time: 0.5 sec per sector
– Chip erase time: 32 sec
– Word program time: 11
µs
– Accelerated program time per word: 7
µs
Automatic Erase Algorithm Preprograms
and Erases Any Combination of Sectors
or the Entire Chip
Automatic Program Algorithm Writes and
Verifies Data at Specified Addresses
Compliant With Common Flash Memory
Interface (CFI) Specification
– Flash device parameters stored directly
on the device
– Allows software driver to identify and use a
variety of current and future Flash products
Minimum 100,000 Write Cycles per Sector
n
Compatible With JEDEC standards
– Pinout and software compatible with
single-power supply Flash devices
– Superior inadvertent write protection
Data# Polling and Toggle Bits
– Provide software confirmation of
completion of program and erase
operations
Ready/Busy (RY/BY#) Pin
– Provides hardware confirmation of
completion of program and erase
operations
Write Protect Function (WP#/ACC pin)
Allows hardware protection of the first or
last 32 KW of the array, regardless of sector
protect status
Acceleration Function (WP#/ACC pin)
Provides accelerated program times
Erase Suspend/Erase Resume
– Suspends an erase operation to allow
reading data from, or programming data
to, a sector that is not being erased
– Erase Resume can then be invoked to
complete suspended erasure
Hardware Reset Pin (RESET#) Resets the
Device to Reading Array Data
Space Efficient Packaging
– 48-pin TSOP and 63-ball FBGA packages
n
n
n
n
n
n
n
n
n
n
n
n
n
LOGIC DIAGRAM
n
n
n
21
A[20:0]
CE#
OE#
WE#
RESET#
WP#/ACC
RY/BY#
DQ[15:0]
16
n
Revision 1.3, May 2002

HY29LV320BF-80I相似产品对比

HY29LV320BF-80I HY29LV320TT-70
描述 Flash, 2MX16, 80ns, PBGA63, 7 X 11 MM, FBGA-63 Flash, 2MX16, 70ns, PDSO48, TSOP-48
厂商名称 SK Hynix(海力士) SK Hynix(海力士)
零件包装代码 BGA TSOP
包装说明 TFBGA, BGA63,8X12,32 TSOP1, TSSOP48,.8,20
针数 63 48
Reach Compliance Code compliant compliant
ECCN代码 3A991.B.1.A 3A991.B.1.A
最长访问时间 80 ns 70 ns
启动块 BOTTOM TOP
命令用户界面 YES YES
通用闪存接口 YES YES
数据轮询 YES YES
JESD-30 代码 R-PBGA-B63 R-PDSO-G48
JESD-609代码 e1 e6
长度 11 mm 18.4 mm
内存密度 33554432 bit 33554432 bit
内存集成电路类型 FLASH FLASH
内存宽度 16 16
功能数量 1 1
部门数/规模 1,2,1,63 1,2,1,63
端子数量 63 48
字数 2097152 words 2097152 words
字数代码 2000000 2000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 70 °C
组织 2MX16 2MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA TSOP1
封装等效代码 BGA63,8X12,32 TSSOP48,.8,20
封装形状 RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL
电源 3/3.3 V 3.3 V
编程电压 3 V 3 V
认证状态 Not Qualified Not Qualified
就绪/忙碌 YES YES
座面最大高度 1.2 mm 1.2 mm
部门规模 8K,4K,16K,32K 8K,4K,16K,32K
最大待机电流 0.000005 A 0.000005 A
最大压摆率 0.03 mA 0.03 mA
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 3 V
标称供电电压 (Vsup) 3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL
端子面层 TIN SILVER COPPER TIN BISMUTH
端子形式 BALL GULL WING
端子节距 0.8 mm 0.5 mm
端子位置 BOTTOM DUAL
切换位 YES YES
类型 NOR TYPE NOR TYPE
宽度 7 mm 12 mm
Base Number Matches 1 1

 
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