电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HW-14-08-G-S-375-SM-A

产品描述Board Stacking Connector
产品类别连接器    连接器   
文件大小358KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

HW-14-08-G-S-375-SM-A概述

Board Stacking Connector

HW-14-08-G-S-375-SM-A规格参数

参数名称属性值
厂商名称SAMTEC
Reach Compliance Codecompliant
其他特性STAGGERED CONFIGURATION
连接器类型BOARD STACKING CONNECTOR
触点性别MALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
MIL 符合性NO
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数1
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SURFACE MOUNT
触点总数14
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
REVISION AY
DO NOT
SCALE FROM
THIS PRINT
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
HW-XX-XX-XX-X-XXXX-SM-X-XXX
2. TUBE POSITIONS -05 THRU -36 ONLY; POSITIONS -02
THRU -04 TO BE LAYER PACKAGED.
No OF POSITIONS
OPTION #2
3. MAXIMUM CUT FLASH: .020 [0.51] CUT FLASH TO BE
POLARIZED POSITION
-02 THRU -36
IN A NON-CRITICAL AREA LOCATED BETWEEN BODIES.
SPECIFY OMITTED PIN
4. FOR ADDED MECHANICAL STABILITY, SAMTEC RECOMMENDS
LEAD STYLE
MECHANICAL BOARD SPACERS BE USED IN APPLICATIONS WITH
OPTION #1
(SEE TABLE 1)
GOLD OR SELECTIVE GOLD PLATED CONNECTORS. CONTACT
-LC: LOCKING CLIP (SEE FIG 2, SHT 2)
IPG@SAMTEC.COM FOR MORE INFORMATION.
(-D: USE RTSM-50-DVU, USE LC-05-TM)
PLATING SPECIFICATION
(-S: USE TSM-50-SV BODY, USE LC-08-TM-02)
36
02
-T: MATTE TIN ON CONTACT AND TAIL.
-A: ALIGNMENT PIN (SEE FIG 3, SHT 2)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
(-S: 3 POSITION USE TSM-03-SV-A,
.195 4.95
MATTE TIN ON TAIL.
MUST BE MOLDED TO POSITION)
REF
-G: 10µ" SELECTIVE GOLD IN CONTACT AREA,
(4-50 POSITIONS USE TSM-XX-SV-XX,
3µ" SELECTIVE GOLD ON TAIL.
2 POSITIONS TO USE TSM-48-SV-04)
35
01
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
(-D: FOR MOLDED TO POSITION,
2 MAX SWAY
MATTE TIN ON TAIL.
USE RTSM-50-DVU-XX BODY,
.100 2.54 REF
(EITHER DIRECTION)
-TL: 250µ" TIN/LEAD ON CONTACT AND TAIL.
AVAILABLE ON POS -02 THRU -36)
-H: 30µ" SELECTIVE GOLD IN CONTACT
-S: SINGLE ROW
(-D: FOR STAKED, USE RTSM-50-DVU BODY,
AREA, 3µ" SELECTIVE GOLD ON TAIL.
3 POS MIN)
02
72
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
-TR: TAPE & REEL
MATTE TIN ON TAIL.
(4 THRU 27 POSITIONS ONLY)
-TM: MATTE TIN ON CONTACT AND TAIL.
(MAX HEIGHT: .6875)
.295 7.49
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
LEAVE BLANK FOR NO HOLD DOWN OPTION
REF
MATTE TIN ON TAIL.
(-D: USE RTSM-50-DVU, CAN BE CUT
-LM: 10µ" SELECTIVE GOLD IN CONTACT AREA,
TO POSITION, SEE FIG 1)
MATTE TIN ON TAIL.
(-S: USE TSM-50-SV, CAN BE CUT
01
71
-FM: 3µ" SELECTIVE GOLD IN CONTACT AREA,
TO POSITION, SEE FIG 1)
2 MAX SWAY
MATTE TIN ON TAIL.
.200 5.08 REF
(EITHER DIRECTION)
SURFACE MOUNT
ROW OPTION
FIG 1
-D: DOUBLE ROW
HW-XX-10-XX-X-675-SM SHOWN
(USE RTSM-50-DVU FOR BOTTOM INSULATOR)
BOARD SPACE
(USE WRTSM-50-DVU FOR TOP INSULATOR)
"A" = -XXX
-S: SINGLE ROW
(SEE FIG 1 & TABLE 1)
(USE TSM-XX-S BODY FOR BOTTOM INSULATOR)
MAX= C + .150
(NO OF POS x .100[2.54])
+.000[0.00]
(USE WTSM-50-SV FOR TOP INSULATOR)
- .015[0.38]
(NO OF POS -1) x .100[2.54]
.025 0.64 SQ
REF (TYP)
.100 2.54 REF
C
"B" .000[0.00] MIN
[("C" + .150[3.81]) -A]
.050 1.27
WTSM-50-SV
C
"A"±.008[0.20]
BOARD OPTION
(.250[6.35] MIN)
(SEE TABLE 1)
(MAX = "C" + .150[3.81])
.100 2.54
T-1S6-XX-XX-2
WRTSM-50-DVU
"H" REF
.100 2.54 REF
C
.006[0.15]
90°
- 0°
+5°
RTSM-50-DVU
.050 1.27
TSM-50-SV
-S: SINGLE ROW
*
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
.XX: .01 [0.3]
2
.XXX: .005 [0.13]
.XXXX: .0020 [0.051]
ANGLES
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
*
PROPRIETARY NOTE
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: LCP, UL 94 V0, COLOR: BLACK
TERMINAL: PHOS BRONZE
HW BOARD TO BOARD ASSEMBLY
HW-XX-XX-XX-X-XXXX-SM-X-XXX
BY:
G PURVIS
F:\DWG\MISC\MKTG\HW-XX-XX-XX-X-XXXX-SM-X-XXX-MKT.SLDDRW
03/12/1993
SHEET
1
OF
3
悬赏1000元,求一个在空BIOS芯片里只需写一小段,点亮键盘灯的代码
悬赏1000元,求一个在空BIOS芯片里只需写一小段,点亮键盘灯的代码,如果能进行内存测试和启动显卡,悬赏更高!QQ号740347821,邮箱750347821@QQ.COM,电话:13639342048 1,只需要您开机接通电源 ......
aikchun 嵌入式系统
PCB作图技巧
Altium Designer Winter 09 画SCHLIB时,元件引脚名称怎样改成水平的,还是水平只能用text? 211874211875 怎样由图左变成图右? ...
chilezhima PCB设计
急求助:有没有TTL电平直接转232和485两种电平的器件?有成品最好.
有没有TTL电平直接转232和485两种电平的器件?有成品最好. 也就是说用这个产品有三个接口.可以直接把TTL电平转成232和485信号输出....
anjiu 嵌入式系统
高价寻调试人才!
能调试国内某些网络游戏,找到一些关键信息断点!并发送出来!要求稳定性!隐蔽性! 有兴趣的加我QQ : 79005380 价钱自己开! 下面的留点口德 勿骂!! 往往都是些钱没 ......
sunzhaojie 嵌入式系统
平头哥RVB2601板子-IIC总线测试
CH2601的内部设计有IIC总线,板子上的I2C总线与ES7210连接,ES7210芯片是四通道ADC采集芯片,在板子上连接了硅麦, 562405 ES7210的数据是通过I2S总线连接的CH2601,芯片的配置是通过IIC ......
bigbat 国产芯片交流
分析师预计苹果圣诞将推出32GB容量iPhone
本帖最后由 jameswangsynnex 于 2015-3-3 20:00 编辑 近日消息,在苹果今年夏季推出3G iPhone之前,人们的推测之一是苹果将推出一种32GB存储容量的3G iPhone。然而,这个推测也是人们最失望的 ......
maker 消费电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2654  1664  2003  503  122  16  13  31  32  20 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved