Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30
| 参数名称 | 属性值 |
| 厂商名称 | Mitsubishi(日本三菱) |
| 零件包装代码 | SIMM |
| 包装说明 | SIMM, SIM30 |
| 针数 | 30 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 80 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XSMA-N30 |
| 内存密度 | 9437184 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 30 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX9 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | SIMM |
| 封装等效代码 | SIM30 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 512 |
| 座面最大高度 | 20.32 mm |
| 最大待机电流 | 0.0045 A |
| 最大压摆率 | 0.63 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 2.54 mm |
| 端子位置 | SINGLE |
| Base Number Matches | 1 |
| MH1M09A0J-8 | MH1M09A0J-12 | MH1M09A0JA-10 | MH1M09A0JA-8 | MH1M09A0JA-12 | MH1M09A0J-10 | |
|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 | Fast Page DRAM Module, 1MX9, 120ns, CMOS, SIMM-30 | Fast Page DRAM Module, 1MX9, 100ns, CMOS, SIMM-30 | Fast Page DRAM Module, 1MX9, 80ns, CMOS, SIMM-30 | Fast Page DRAM Module, 1MX9, 120ns, CMOS, SIMM-30 | Fast Page DRAM Module, 1MX9, 100ns, CMOS, SIMM-30 |
| 零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| 包装说明 | SIMM, SIM30 | SIMM, SIM30 | , SIP30,.2 | , SIP30,.2 | , SIP30,.2 | SIMM, SIM30 |
| 针数 | 30 | 30 | 30 | 30 | 30 | 30 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 80 ns | 120 ns | 100 ns | 80 ns | 120 ns | 100 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XSMA-N30 | R-XSMA-N30 | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-T30 | R-XSMA-N30 |
| 内存密度 | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit | 9437184 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 30 | 30 | 30 | 30 | 30 | 30 |
| 字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 | 1MX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装等效代码 | SIM30 | SIM30 | SIP30,.2 | SIP30,.2 | SIP30,.2 | SIM30 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 512 | 512 | 512 | 512 | 512 | 512 |
| 座面最大高度 | 20.32 mm | 20.32 mm | 21.082 mm | 21.082 mm | 21.082 mm | 20.32 mm |
| 最大待机电流 | 0.0045 A | 0.0045 A | 0.0045 A | 0.0045 A | 0.0045 A | 0.0045 A |
| 最大压摆率 | 0.63 mA | 0.45 mA | 0.54 mA | 0.63 mA | 0.45 mA | 0.54 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| 厂商名称 | Mitsubishi(日本三菱) | - | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
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