电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HW-02-12-SM-D-875-SM-LC

产品描述Board Stacking Connector
产品类别连接器    连接器   
文件大小358KB,共3页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

HW-02-12-SM-D-875-SM-LC概述

Board Stacking Connector

HW-02-12-SM-D-875-SM-LC规格参数

参数名称属性值
厂商名称SAMTEC
Reach Compliance Codecompliant
连接器类型BOARD STACKING CONNECTOR
触点性别MALE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
MIL 符合性NO
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SURFACE MOUNT
触点总数24
UL 易燃性代码94V-0
Base Number Matches1

文档预览

下载PDF文档
REVISION AY
DO NOT
SCALE FROM
THIS PRINT
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
HW-XX-XX-XX-X-XXXX-SM-X-XXX
2. TUBE POSITIONS -05 THRU -36 ONLY; POSITIONS -02
THRU -04 TO BE LAYER PACKAGED.
No OF POSITIONS
OPTION #2
3. MAXIMUM CUT FLASH: .020 [0.51] CUT FLASH TO BE
POLARIZED POSITION
-02 THRU -36
IN A NON-CRITICAL AREA LOCATED BETWEEN BODIES.
SPECIFY OMITTED PIN
4. FOR ADDED MECHANICAL STABILITY, SAMTEC RECOMMENDS
LEAD STYLE
MECHANICAL BOARD SPACERS BE USED IN APPLICATIONS WITH
OPTION #1
(SEE TABLE 1)
GOLD OR SELECTIVE GOLD PLATED CONNECTORS. CONTACT
-LC: LOCKING CLIP (SEE FIG 2, SHT 2)
IPG@SAMTEC.COM FOR MORE INFORMATION.
(-D: USE RTSM-50-DVU, USE LC-05-TM)
PLATING SPECIFICATION
(-S: USE TSM-50-SV BODY, USE LC-08-TM-02)
36
02
-T: MATTE TIN ON CONTACT AND TAIL.
-A: ALIGNMENT PIN (SEE FIG 3, SHT 2)
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,
(-S: 3 POSITION USE TSM-03-SV-A,
.195 4.95
MATTE TIN ON TAIL.
MUST BE MOLDED TO POSITION)
REF
-G: 10µ" SELECTIVE GOLD IN CONTACT AREA,
(4-50 POSITIONS USE TSM-XX-SV-XX,
3µ" SELECTIVE GOLD ON TAIL.
2 POSITIONS TO USE TSM-48-SV-04)
35
01
-L: 10µ" SELECTIVE GOLD IN CONTACT AREA,
(-D: FOR MOLDED TO POSITION,
2 MAX SWAY
MATTE TIN ON TAIL.
USE RTSM-50-DVU-XX BODY,
.100 2.54 REF
(EITHER DIRECTION)
-TL: 250µ" TIN/LEAD ON CONTACT AND TAIL.
AVAILABLE ON POS -02 THRU -36)
-H: 30µ" SELECTIVE GOLD IN CONTACT
-S: SINGLE ROW
(-D: FOR STAKED, USE RTSM-50-DVU BODY,
AREA, 3µ" SELECTIVE GOLD ON TAIL.
3 POS MIN)
02
72
-F: 3µ" SELECTIVE GOLD IN CONTACT AREA,
-TR: TAPE & REEL
MATTE TIN ON TAIL.
(4 THRU 27 POSITIONS ONLY)
-TM: MATTE TIN ON CONTACT AND TAIL.
(MAX HEIGHT: .6875)
.295 7.49
-SM: 30µ" SELECTIVE GOLD IN CONTACT AREA,
LEAVE BLANK FOR NO HOLD DOWN OPTION
REF
MATTE TIN ON TAIL.
(-D: USE RTSM-50-DVU, CAN BE CUT
-LM: 10µ" SELECTIVE GOLD IN CONTACT AREA,
TO POSITION, SEE FIG 1)
MATTE TIN ON TAIL.
(-S: USE TSM-50-SV, CAN BE CUT
01
71
-FM: 3µ" SELECTIVE GOLD IN CONTACT AREA,
TO POSITION, SEE FIG 1)
2 MAX SWAY
MATTE TIN ON TAIL.
.200 5.08 REF
(EITHER DIRECTION)
SURFACE MOUNT
ROW OPTION
FIG 1
-D: DOUBLE ROW
HW-XX-10-XX-X-675-SM SHOWN
(USE RTSM-50-DVU FOR BOTTOM INSULATOR)
BOARD SPACE
(USE WRTSM-50-DVU FOR TOP INSULATOR)
"A" = -XXX
-S: SINGLE ROW
(SEE FIG 1 & TABLE 1)
(USE TSM-XX-S BODY FOR BOTTOM INSULATOR)
MAX= C + .150
(NO OF POS x .100[2.54])
+.000[0.00]
(USE WTSM-50-SV FOR TOP INSULATOR)
- .015[0.38]
(NO OF POS -1) x .100[2.54]
.025 0.64 SQ
REF (TYP)
.100 2.54 REF
C
"B" .000[0.00] MIN
[("C" + .150[3.81]) -A]
.050 1.27
WTSM-50-SV
C
"A"±.008[0.20]
BOARD OPTION
(.250[6.35] MIN)
(SEE TABLE 1)
(MAX = "C" + .150[3.81])
.100 2.54
T-1S6-XX-XX-2
WRTSM-50-DVU
"H" REF
.100 2.54 REF
C
.006[0.15]
90°
- 0°
+5°
RTSM-50-DVU
.050 1.27
TSM-50-SV
-S: SINGLE ROW
*
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
.XX: .01 [0.3]
2
.XXX: .005 [0.13]
.XXXX: .0020 [0.051]
ANGLES
THIS DOCUMENT CONTAINS CONFIDENTIAL AND
PROPRIETARY INFORMATION AND ALL DESIGN,
MANUFACTURING, REPRODUCTION, USE, PATENT RIGHTS
AND SALES RIGHTS ARE EXPRESSLY RESERVED BY SAMTEC,
INC. THIS DOCUMENT SHALL NOT BE DISCLOSED, IN WHOLE
OR PART, TO ANY UNAUTHORIZED PERSON OR ENTITY NOR
REPRODUCED, TRANSFERRED OR INCORPORATED IN ANY
OTHER PROJECT IN ANY MANNER WITHOUT THE EXPRESS
WRITTEN CONSENT OF SAMTEC, INC.
*
PROPRIETARY NOTE
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATOR: LCP, UL 94 V0, COLOR: BLACK
TERMINAL: PHOS BRONZE
HW BOARD TO BOARD ASSEMBLY
HW-XX-XX-XX-X-XXXX-SM-X-XXX
BY:
G PURVIS
F:\DWG\MISC\MKTG\HW-XX-XX-XX-X-XXXX-SM-X-XXX-MKT.SLDDRW
03/12/1993
SHEET
1
OF
3
FPGA QQ群:69611574 期待你的加入!
FPGA QQ群:69611574 期待你的加入!...
fpga126 FPGA/CPLD
星载SAR目标回波信号模拟及成像显示
本帖最后由 jameswangsynnex 于 2015-3-3 19:58 编辑 摘要:根据合成孔径雷达(SAR)的系统设计参数和星载雷达的运动特点,设计和实现了SAR回波信号模拟产生系统,实时地产生所需SAR回波数据"产生的 ......
JasonYoo 消费电子
DSP在线升级程序步骤【转】
目标板:C2000的28335/28069 一、主要思路: 1、准备升级程序(相当于一个bootloader),作为上电首先运行的程序。进入升级程序,首先判断需不需要升级,需要升级,进入升级状态,通信完成新 ......
模拟IC 微控制器 MCU
MSP430F5529定时器使用程序详解
#include void main(void) { WDTCTL=WDTPW+WDTHOLD; P1DIR|=(BIT1+BIT2+BIT3+BIT4+BIT5);//P1.1-P1.5为输出方向 P1OUT=0x00; //全部拉低,初始化LED全灭 TA0CCTL1= ......
Aguilera 微控制器 MCU
更新demo怎么用ftp
A:只更新自己写的demo怎么用ftp B:进入系统后 zmode 更好用。 http://wiki.myzr.com.cn/index.php?title=%E7%BB%88%E7%AB%AF%E8%BD%AF%E4%BB%B6XShell%E5%8F%82%E8%80%83%E6%89%8B%E5%86%8C ......
明远智睿Lan 综合技术交流
【NXP Rapid IoT评测】+ 蓝牙协议栈使用方法小结
本帖最后由 manhuami2007 于 2019-1-20 20:15 编辑 399769 Rapid iot套件是如何使用蓝牙进行通讯的呢?通过在MK64FN这颗主MCU中模拟出蓝牙协议栈来进行蓝牙通讯。 那么是如何模拟的呢 ......
manhuami2007 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 290  1823  745  864  1801  7  6  29  33  42 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved